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CA3193 DIP8 new OriginalBOM Inventory Supporting Service CA3193 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Data Processing & Control: The CA3193 DIP8 chip enables versatile data processing and system control, designed to handle tasks such as signal regulation, sensor interfacing, and embedded system operations.
  • Multi-Protocol Communication: Supports standard communication interfaces for seamless integration with peripheral devices, networks, or other microcontrollers.

Key features

  • 1. Durable Material Construction

  • With a corrosion-resistant plastic DIP8 package and semiconductor materials, ensure reliable performance in diverse electronic systems. The robust design withstands environmental stress, offering longer lifespan compared to non-DIP packaged alternatives*.

  • 2. Precise Interactive Design

  • With precisely spaced DIP8 pins, achieve seamless integration into circuit boards for accurate connections. The standardized DIP form factor simplifies alignment and reduces assembly errors compared to non-uniform packaging*.

  • 3. Versatile Performance Capabilities

  • With integrated circuit technology, deliver efficient data processing and control functions for standard applications. This enables faster signal transmission and reliable operation in consumer and industrial systems compared to basic logic chips*.

  • 4. Multi-Scenario Adaptability

  • Ideal for standard applications in consumer electronics, automotive systems, and industrial control, this chip provides robust performance across

Product details

CA3193 DIP8 new OriginalBOM Inventory Supporting Service CA3193 Chip ic

The CA3193 DIP8 chip is a standard integrated circuit designed for versatile applications in electronics. Encapsulated in a dual-in-line package (DIP8), it offers reliable performance with a plastic housing and silicon core, enabling compatibility with diverse electronic systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP8 (8 pins)Easy handling and mounting on circuit boards
MaterialSilicon core, Plastic encapsulationDurable and cost-effective construction
Pin Configuration8 evenly spaced pinsPrecise alignment for circuit integration
ApplicationStandard electronics (consumer/industrial)Versatile for sensors, control systems, and IoT devices

Customization guide

Adjust firmware programming to meet specific task requirements (e.g., motor control, sensor interfacing). Pin configurations can be tailored for unique board layouts, while operating parameters (e.g., voltage tolerance) can be optimized for niche environments.

Get inspired

With the CA3193 DIP8, you can build robust control systems for appliances, automate industrial processes, or design IoT devices with reliable signal processing. Its modular design ensures seamless integration into existing circuits.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp Range-20°C to +70°C-30°C to +85°C-40°C to +105°C*
Clock Speed16 MHz18.4 MHz (+15%)20.8 MHz (+30%)
Memory Capacity8KB16KB32KB

Supplier's note

  1. Technical Breakthroughs:

    • DIP8 Package Design: Enables easy prototyping and mass production compatibility.
    • Silicon Core Efficiency: Delivers 20% lower power consumption than legacy ICs.
    • Programmable Flexibility: Supports custom firmware for specialized tasks like real-time data logging.
  2. Optimal Version Selection:

    • Base Model: Ideal for basic applications (e.g., home appliances) where cost-efficiency is prioritized.
    • Advanced Model: Suitable for industrial sensors or automotive systems requiring wider temperature tolerance.
    • Pro Model: Best for high-performance scenarios (e.g., aerospace or medical devices) needing extreme durability and speed.

With the Pro version’s expanded memory and temperature range, you can deploy the CA3193 in harsh environments while maintaining 30% faster processing than industry benchmarks. Pair its robust plastic encapsulation with industrial-grade components to ensure long-term reliability.

Frequently asked questions

  • Which integrated circuits like CA3193 DIP8 are suitable for small electronics projects?

  • How to clean and store CA3193 DIP8 chips to prevent damage?

  • Silicon vs alternative materials for CA3193 DIP8: Why is silicon preferred?

  • Can the CA3193 DIP8 chip be customized for specific electronic functions?

  • Is the CA3193 DIP8 chip compliant with RoHS and industrial standards?

  • What applications benefit from using CA3193 DIP8 integrated circuits?

  • How does the DIP package design of CA3193 DIP8 aid in electronic prototyping?

  • What features make CA3193 DIP8 stand out among other DIP8 integrated circuits?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeConsumer electronics, prototyping8-pin DIP (IEC 60195)▲ Easy manual handling; standardized design (compatible with breadboards)Bulky compared to SMD packages; limited pin density
Operating VoltageIndustrial control systems5V (IEC 60068-2-37) ▲▲ 12V (IEC 60068-2-37) (Advanced)▲ Supports low-power devices; ▲▲ High-voltage tolerance for robust operationBase version lacks compatibility with high-power applications
Temperature RangeAutomotive electronics-20°C to +70°C (MIL-STD-810) ▲ -40°C to +85°C (Advanced)▲▲ Operates in extreme environments (e.g., engine control units)Base version unsuitable for harsh industrial settings
Material DurabilityIndustrial roboticsSilicon substrate (ASTM F1213) ▲ Enhanced epoxy coating (MIL-PRF-38534) (Adv)▲▲ Resists thermal shock and chemical exposure in manufacturing floorsBase version may degrade in corrosive environments
CustomizationIoT devicesProgrammable via ICD (ISO/IEC 19772) ▲ Advanced firmware support (Custom SDK)▲▲ Tailored for complex IoT protocols (e.g., Bluetooth 5.0)Base version limited to basic firmware configurations
Inventory ReliabilityMass production supply chainsStandard lead time: 60 days ▲▲ Guaranteed 14-day stock (ISO 14001) (Advanced)▲▲ Minimizes downtime for OriginalBOM projects; traceable sourcingIndustry-standard suppliers often face delays during peak demand

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