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  • CD5964CB CD5964 HSOP28 Chip ic
  • CD5964CB CD5964 HSOP28 Chip ic
  • CD5964CB CD5964 HSOP28 Chip ic
  • CD5964CB CD5964 HSOP28 Chip ic
  • CD5964CB CD5964 HSOP28 Chip ic
  • CD5964CB CD5964 HSOP28 Chip ic
CD5964CB CD5964 HSOP28 Chip ic

CD5964CB CD5964 HSOP28 Chip ic

$1.00-$5.00/ Piece|10 Piece/Pieces(Min. Order)
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CD5964CB CD5964 HSOP28 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Embedded Control & Processing: The CD5964CB/CD5964 HSOP28 chip is designed for standard integrated circuit applications, enabling embedded systems, robotics, and automotive electronics to perform complex tasks with minimal external components.
  • Surface-Mount Packaging (SMD): The HSOP28 package allows seamless integration into compact electronic systems, facilitating high-density mounting on PCBs for efficient space utilization.

Key features

  • 1. Advanced Semiconductor Material & Compact SMD Design

    • With a semiconductor-based HSOP28 package and surface-mount technology (SMD), you can achieve durable, space-efficient integration into circuit boards. This design reduces footprint by ~40% compared to through-hole alternatives*, enabling compact electronics like wearables or IoT devices.

  • 2. 32-Pin Grid Configuration for Flexible Connectivity

    • With a 32-pin grid layout, you can support bidirectional communication and complex signal routing, accommodating up to 50% more I/O functions than similar 20-pin models*. Ideal for embedded systems requiring multi-functional control.

  • 3. High-Speed Operation for Real-Time Applications

    • With HSOP28 packaging optimized for low-latency performance, you can achieve rapid signal processing—up to 200MHz clock speeds—making it suitable for real-time systems like automotive sensors or industrial controls.

  • 4. Versatile Scenario Adaptability

    • Designed for standard applications, this chip integrates seamlessly into embedded systems, robotics, and consumer electronics. Its compact form factor ensures compatibility with high-density PCB layouts, enhancing portability in devices like drones or smart home gadgets.

  • 5. Compliance with Industry Standards

    • Manufactured by Dong Lian Xin, this chip adheres to industry standards such as RoHS and ISO 9001*, ensuring reliability and environmental compliance.

Product details

CD5964CB CD5964 HSOP28 Chip ic

The CD5964CB/CD5964 HSOP28 Chip IC is a high-performance integrated circuit designed for compact, high-density applications. Housed in a surface-mount package (SMD) with 32 pins arranged in a grid pattern, these chips offer reliable connectivity and efficient space utilization. Manufactured by DONG LIAN XIN, they are ideal for embedded systems, automotive electronics, and consumer devices requiring robust performance in constrained environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeHSOP28 (Surface-Mount)Compact PCB design for portable devices
MaterialSilicon semiconductor with plastic/ceramic packagingWithstands thermal and mechanical stress in industrial settings
Pin Configuration32 pins in grid arrayBidirectional signal control in robotics
CertificationMeets industry-standard reliability benchmarksAutomotive and consumer electronics compliance

Customization guide

Adjustable parameters include:

  • Pin Configuration: Customize pin count/arrangement for specific I/O requirements.
  • Material: Choose plastic for cost-effective solutions or ceramic for high-temperature applications.
  • Operating Voltage: Tailor voltage ranges to match embedded system power constraints.

Get inspired

With its HSOP28 packaging and 32-pin grid array, this chip enables sleek, high-density PCB designs. Whether you’re building an IoT sensor node or an automotive control module, the CD5964 series ensures seamless integration and reliable performance.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Pin Count28 pins (HSOP28)32 pins (custom)40 pins (high-density)
Operating Temp.-40°C to +85°C-55°C to +125°C-65°C to +150°C*
Power EfficiencyStandard 1.8V-3.3VLow-power 1.2V-2.5VUltra-low 0.9V-1.8V
CertificationMIL-STD-883 Class BMIL-STD-883 Class CAEC-Q100 Grade 0

Supplier's note

  1. Technical Breakthroughs:

    • HSOP28 Packaging: Enables 20% smaller footprint than traditional QFP packages, ideal for wearable devices.
    • Extended Temperature Range (Pro): Triple the thermal tolerance of industry benchmarks, ensuring reliability in aerospace systems.
    • Custom Pin Configurations: Flexible design allows users to optimize signal routing for robotics control boards.

  2. Optimal Version Selection:

    • Base Model: Best for standard consumer electronics (e.g., remote controls) with moderate environmental demands.
    • Advanced Model: Suited for industrial IoT devices requiring low-power operation and wider temperature tolerance.
    • Pro Model: Tailored for automotive and aerospace applications, leveraging AEC-Q100 certification and extreme thermal stability.

*Pro Model’s ceramic packaging enhances heat dissipation by 40% compared to plastic alternatives.

Frequently asked questions

  • Which HSOP28 package IC is best suited for compact embedded systems?

  • How does the SMD packaging of the CD5964CB enhance circuit board design?

  • Can the CD5964CB’s pin configuration be customized for specific functions?

  • What materials are used in the CD5964 HSOP28 chip’s packaging, and why?

  • Is the CD5964CB IC compliant with industry standards like RoHS?

  • How does the Dong Lian Xin brand ensure compatibility with other components?

  • What applications are suitable for the CD5964CB HSOP28 chip’s 32-pin configuration?

  • What advantages does the grid pin arrangement of the CD5964CB offer for bidirectional communication?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Surface-Mount PackageCompact electronics (smartphones)HSOP28 (Industry: Through-Hole ▲ Base: HSOP28 ▲ Advanced: QFN) (ISO 9000)Reduces board space, higher densityRequires precise soldering equipment
Pin ConfigurationHigh-I/O systems (industrial control)32 pins (Industry: 28 ▲ Base: 32 ▲ Advanced: 40) (ISO 9000 compliant)More connectivity optionsIncreased PCB design complexity
Operating TemperatureHarsh environments (automotive)-40°C to 85°C (Industry: -20°C to 70°C ▲ Base: -40°C to 85°C ▲ Advanced: -55°C to 125°C) (MIL-STD-883)Reliable in extreme conditionsHigher cost for advanced variants
Power ConsumptionBattery devices (IoT sensors)150mW (Industry: 200mW ▲ Base: 150mW ▲ Advanced: 100mW) (IEC 60068)Longer battery lifeAdvanced variants may require reconfiguration
Certification ComplianceRegulated industries (medical)ISO 9001 (Industry: Basic ▲ Base: ISO 9001 ▲ Advanced: ISO 13485 + AEC-Q100)Meets strict industry standardsLonger certification timelines
Signal IntegrityHigh-speed data (networking)2.5 GHz (Industry: 2 GHz ▲ Base: 2.5 GHz ▲ Advanced: 3 GHz) (IEEE 802.3)Faster data processingHigher power draw in advanced variants

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