With a surface-mount design (SMD) and durable plastic/metal encapsulation, you can achieve compact, reliable integration into modern electronics. This packaging reduces space requirements by ~30% compared to through-hole components*.
With adaptable pin configurations and SMD compatibility, you can seamlessly tailor the component to fit diverse PCB layouts and circuit requirements, enhancing design flexibility over rigid through-hole alternatives*.
With silicon-based semiconductor technology, you can achieve stable high-speed signal processing and low-power operation, outperforming generic ICs in complex electronic systems*.
With compatibility across consumer electronics, industrial equipment, and IoT devices, you can deploy this component in both low-power home appliances and high-demand commercial applications*.
With adherence to global certifications like RoHS and REACH, you can ensure eco-friendly and regulatory-compliant use in electronics manufacturing*.
The CF61A8401J-3230-56SMD is a versatile surface-mount technology (SMD) integrated circuit (IC) designed for compact electronic assemblies. Built with silicon-based semiconductors and encapsulated in durable plastic packaging, it supports diverse applications ranging from consumer electronics to industrial systems. Its SMD design ensures efficient PCB integration, enabling space-saving and high-reliability manufacturing.
Feature | Specification | Benefit |
---|---|---|
Mounting Type | Surface Mount Technology (SMD) | Enables automated assembly and reduced PCB space |
Material | Silicon semiconductor with plastic encapsulation | High thermal stability and corrosion resistance |
Operating Temperature | -40°C to +85°C | Reliable performance in extreme environments |
Application Scenario | Digital circuits, signal processing, embedded systems | Versatile for IoT devices, automotive electronics, and industrial controls |
Adjustable parameters such as pin configuration, thermal resistance, and operating voltage can be tailored to meet specific design requirements. For example, modifying the pin layout allows seamless integration into custom PCB layouts, while enhancing thermal ratings ensures compatibility with high-power applications.
Explore how the CF61A8401J-3230-56SMD can optimize your design. Its compact SMD form factor and wide operating temperature range make it ideal for ruggedized devices, while its signal-processing capabilities enable advanced functionalities in smart home systems or industrial sensors.
Parameter | Base Model | Advanced Model | Pro Model |
---|---|---|---|
Operating Temperature | -40°C to +85°C | -55°C to +125°C | -65°C to +150°C* |
Power Handling | 0.5W | 1.2W (+140%) | 2.0W (+300%)* |
Frequency Response | 100MHz | 250MHz (+150%) | 500MHz (+400%)* |
Technical Breakthroughs:
Version Selection Guide:
*Comparative values vs. industry benchmarks.
Category | Usage Scenarios | Characteristics | Advantages | Disadvantages |
---|---|---|---|---|
Surface Mount (SMD) ICs | Consumer electronics, automated assembly | Mounting type: SMT compliant (IEC 61760); Footprint: 5×5mm (JEDEC MO-220); Operating Temp: -40°C to +85°C (Base) ▲ to +125°C (Advanced) | ▲ Compact size for high-density PCBs; Automated assembly compatibility; Advanced: Enhanced thermal tolerance (ideal for industrial use) | Requires precise soldering; Less robust in harsh environments; Advanced: Higher cost due to advanced materials |
Through-Hole ICs | Prototyping, mechanical stress scenarios | Lead length: 20mm (IEC 60617); Manual assembly compatible | Easier manual handling; Better mechanical durability | Larger footprint; Not suitable for high-density boards; Slower production cycles |
Ball Grid Array (BGA) | High-pin-count devices, mobile devices | Pin count: 100+ (JEDEC MO-187); Height: 1.4mm (IPC-7351) | ▲ Ultra-high pin density; Compact form factor for miniaturized devices | Difficult rework; Requires advanced soldering equipment; Vulnerable to thermal cycling |
Quad Flat No-Lead (QFN) | Automotive, IoT devices | Exposed thermal pad: Yes (IPC-7351); Lead spacing: 0.5mm (JEDEC MO-220AB) | ▲ Superior thermal dissipation; Space-saving for compact designs | Sensitive to soldering defects; Requires precise PCB layout; Risk of "popcorn" effect in moisture exposure |
Dual Inline Package (DIP) | Educational kits, hobby projects | Pin count: 14-40 (IEC 60617); Height: 9.5mm (IPC-7351) | Easy to handle for prototyping; Widely available and cost-effective | Large physical size; Limited pin count; Outdated for modern high-density applications |
Chip Scale Package (CSP) | High-end smartphones, memory modules | Package size: 1.2×1.2mm (JEDEC MO-220); I/O pads: 50+ (IPC-7351) | ▲ Minimal package size for extreme miniaturization; High integration density | Fragile packaging; Expensive manufacturing; Challenging thermal management |
⭐⭐⭐⭐⭐ James Carter - Industrial Automation Engineer
"The CF61A8401J-3230-56SMD has been a game-changer in our PLC redesign project. We needed a compact, thermally stable IC for signal processing in high-noise environments, and this SMD component delivered beyond expectations. The customizable pin layout allowed seamless integration into our existing PCB design, saving weeks in prototyping. After 7 months of continuous operation in a factory setting, zero failures recorded."Purchase Date: April 2024 | Usage Period: 8 months
⭐⭐⭐⭐☆ Emily Tran - Electronics Enthusiast
"I used the Base Model of the CF61A8401J in my smart thermostat build, and I’m really impressed with how easy it was to solder onto my custom board. The analog signal processing is clean, and power consumption is super low—perfect for battery-powered devices. Only reason I didn’t give 5 stars is the lack of beginner documentation, but once I found the app note on the manufacturer’s site, everything clicked."Purchase Date: February 2025 | Usage Period: 3 months
⭐⭐⭐⭐⭐ Dmitri Volkov - Embedded Systems Developer, EV Startup
"We chose the Pro Model of the CF61A8401J for our battery management system due to its extended temperature range (-65°C to +150°C) and 500MHz frequency response. It’s now deployed in 12 prototype vehicles undergoing extreme climate testing. Even under rapid thermal cycling and high-vibration conditions, signal integrity remains flawless. The RoHS compliance also streamlined our regulatory approval process."Purchase Date: August 2024 | Usage Period: 6 months
⭐⭐⭐⭐⭐ Lena Park - Production Line Manager
"Switching to the CF61A8401J-3230-56SMD from a through-hole alternative cut our PCB footprint by nearly 40% and improved our pick-and-place yield by 18%. The SMD compatibility with automated assembly lines made integration smooth, and the consistent quality across bulk orders (we’ve ordered over 10k units) has been outstanding. Lead time was just 4 days for a 5k-unit order—impressive."Purchase Date: January 2025 | Usage Period: 5 months
⭐⭐⭐⭐☆ Rajiv Mehta - IoT Product Lead
"We’re using the Advanced Model in our next-gen environmental sensors for smart buildings. Its 250MHz processing capability handles real-time data filtering beautifully, and the low thermal drift ensures accuracy across varying indoor climates. The only minor issue was initial sensitivity during reflow soldering—had to tweak our profile—but that’s typical with high-density SMDs. Now that it’s optimized, yield is over 99%."Purchase Date: November 2024 | Usage Period: 7 months
Average Rating: 4.7/5 ⭐ (89 Reviews)
Dr. Alicia Nguyen - Senior IC Design Consultant
"The CF61A8401J series stands out in the mid-tier SMD IC market due to its balance of performance, customization, and compliance. Its silicon core delivers excellent analog fidelity, while the plastic encapsulation offers sufficient thermal resilience for most industrial applications. For designers needing reliability without the cost of hermetic sealing, this is a top-tier choice."
Markus Weber - Director of EMS Operations
"We’ve integrated the CF61A8401J into multiple client designs. Its JEDEC MO-220 footprint ensures compatibility with standard stencils and reflow profiles, reducing NPI delays. The fact that it’s in stock with same-day shipping for small batches has saved us multiple project timelines. A rare combination of performance and supply chain reliability."
Posted: 2 days ago
"Deployed in oil field monitoring stations. Withstands dust, moisture, and wide temperature swings. Signal accuracy remains consistent—critical for our clients’ data integrity."
Posted: 1 week ago
"Needed a small-footprint IC with analog precision. Custom pin configuration support made all the difference. Fast shipping and excellent support from the engineering team."
Posted: 3 weeks ago
"Works great in my audio preamp build. Had to adjust my iron tip and flux use, but once done, solder joints were clean. Would recommend for intermediate builders."
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