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  • CF61A8401J-3230-56SMD Electronic components IC IN stock HLX
  • CF61A8401J-3230-56SMD Electronic components IC IN stock HLX
  • CF61A8401J-3230-56SMD Electronic components IC IN stock HLX
  • CF61A8401J-3230-56SMD Electronic components IC IN stock HLX
  • CF61A8401J-3230-56SMD Electronic components IC IN stock HLX
  • CF61A8401J-3230-56SMD Electronic components IC IN stock HLX
CF61A8401J-3230-56SMD Electronic components IC IN stock HLX

CF61A8401J-3230-56SMD Electronic components IC IN stock HLX

  • 1 - 9 Pieces
    $0.08
  • 10 - 999 Pieces
    $0.06
  • 1000 - 2999 Pieces
    $0.05
  • >= 3000 Pieces
    $0.02

CF61A8401J-3230-56SMD Electronic components IC IN stock HLX

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Signal Processing: Enables complex digital and analog operations, supporting applications requiring precise control and data handling.
  • Surface Mount Technology (SMD) Design: Optimized for seamless integration into printed circuit boards (PCBs), reducing space and enhancing manufacturing efficiency.

Key features

  • 1. Advanced Material Technology

  • With a surface-mount design (SMD) and durable plastic/metal encapsulation, you can achieve compact, reliable integration into modern electronics. This packaging reduces space requirements by ~30% compared to through-hole components*.

  • 2. Customizable Design Solutions

  • With adaptable pin configurations and SMD compatibility, you can seamlessly tailor the component to fit diverse PCB layouts and circuit requirements, enhancing design flexibility over rigid through-hole alternatives*.

  • 3. High-Performance Functionality

  • With silicon-based semiconductor technology, you can achieve stable high-speed signal processing and low-power operation, outperforming generic ICs in complex electronic systems*.

  • 4. Versatile Scenario Adaptability

  • With compatibility across consumer electronics, industrial equipment, and IoT devices, you can deploy this component in both low-power home appliances and high-demand commercial applications*.

  • 5. Compliance with Industry Standards

  • With adherence to global certifications like RoHS and REACH, you can ensure eco-friendly and regulatory-compliant use in electronics manufacturing*.

Product details

CF61A8401J-3230-56SMD Electronic components IC IN stock HLX

The CF61A8401J-3230-56SMD is a versatile surface-mount technology (SMD) integrated circuit (IC) designed for compact electronic assemblies. Built with silicon-based semiconductors and encapsulated in durable plastic packaging, it supports diverse applications ranging from consumer electronics to industrial systems. Its SMD design ensures efficient PCB integration, enabling space-saving and high-reliability manufacturing.

Technical specifications

FeatureSpecificationBenefit
Mounting TypeSurface Mount Technology (SMD)Enables automated assembly and reduced PCB space
MaterialSilicon semiconductor with plastic encapsulationHigh thermal stability and corrosion resistance
Operating Temperature-40°C to +85°CReliable performance in extreme environments
Application ScenarioDigital circuits, signal processing, embedded systemsVersatile for IoT devices, automotive electronics, and industrial controls

Customization guide

Adjustable parameters such as pin configuration, thermal resistance, and operating voltage can be tailored to meet specific design requirements. For example, modifying the pin layout allows seamless integration into custom PCB layouts, while enhancing thermal ratings ensures compatibility with high-power applications.

Get inspired

Explore how the CF61A8401J-3230-56SMD can optimize your design. Its compact SMD form factor and wide operating temperature range make it ideal for ruggedized devices, while its signal-processing capabilities enable advanced functionalities in smart home systems or industrial sensors.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temperature-40°C to +85°C-55°C to +125°C-65°C to +150°C*
Power Handling0.5W1.2W (+140%)2.0W (+300%)*
Frequency Response100MHz250MHz (+150%)500MHz (+400%)*

Supplier's note

  1. Technical Breakthroughs:

    • SMD Packaging: Reduces PCB footprint by 40% compared to through-hole alternatives.
    • Enhanced Thermal Performance: The Pro Model’s improved heat dissipation allows 20% higher power handling than industry benchmarks.
    • Extended Temperature Range: The Pro Model’s -65°C to +150°C rating enables use in extreme industrial and automotive environments.
  2. Version Selection Guide:

    • Base Model: Ideal for low-power consumer electronics (e.g., IoT sensors) where standard thermal and frequency requirements suffice.
    • Advanced Model: Suitable for industrial controls and high-speed data applications needing 250MHz processing and moderate power handling.
    • Pro Model: Tailored for aerospace, automotive, and heavy machinery systems requiring extreme durability and high-frequency performance. With its triple-industry-standard thermal tolerance, it ensures reliability in harsh environments.

*Comparative values vs. industry benchmarks.

Frequently asked questions

  • Which SMD IC model is best suited for high-frequency applications in consumer electronics?

  • How should SMD components like the CF61A8401J be stored to prevent static damage?

  • What are the advantages of plastic vs. metal encapsulation for SMD ICs like the CF61A8401J?

  • Can the CF61A8401J be customized for specific pin configurations or power ratings?

  • Is the CF61A8401J RoHS-compliant and suitable for medical devices?

  • What applications is the CF61A8401J ideal for due to its analog circuit capabilities?

  • Are there compatibility guarantees for the CF61A8401J with standard PCB manufacturing processes?

  • Is the CF61A8401J in stock, and what’s the lead time for bulk orders?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Surface Mount (SMD) ICsConsumer electronics, automated assemblyMounting type: SMT compliant (IEC 61760);
Footprint: 5×5mm (JEDEC MO-220);
Operating Temp: -40°C to +85°C (Base) ▲ to +125°C (Advanced)
▲ Compact size for high-density PCBs;
Automated assembly compatibility;
Advanced: Enhanced thermal tolerance (ideal for industrial use)
Requires precise soldering;
Less robust in harsh environments;
Advanced: Higher cost due to advanced materials
Through-Hole ICsPrototyping, mechanical stress scenariosLead length: 20mm (IEC 60617);
Manual assembly compatible
Easier manual handling;
Better mechanical durability
Larger footprint;
Not suitable for high-density boards;
Slower production cycles
Ball Grid Array (BGA)High-pin-count devices, mobile devicesPin count: 100+ (JEDEC MO-187);
Height: 1.4mm (IPC-7351)
▲ Ultra-high pin density;
Compact form factor for miniaturized devices
Difficult rework;
Requires advanced soldering equipment;
Vulnerable to thermal cycling
Quad Flat No-Lead (QFN)Automotive, IoT devicesExposed thermal pad: Yes (IPC-7351);
Lead spacing: 0.5mm (JEDEC MO-220AB)
▲ Superior thermal dissipation;
Space-saving for compact designs
Sensitive to soldering defects;
Requires precise PCB layout;
Risk of "popcorn" effect in moisture exposure
Dual Inline Package (DIP)Educational kits, hobby projectsPin count: 14-40 (IEC 60617);
Height: 9.5mm (IPC-7351)
Easy to handle for prototyping;
Widely available and cost-effective
Large physical size;
Limited pin count;
Outdated for modern high-density applications
Chip Scale Package (CSP)High-end smartphones, memory modulesPackage size: 1.2×1.2mm (JEDEC MO-220);
I/O pads: 50+ (IPC-7351)
▲ Minimal package size for extreme miniaturization;
High integration density
Fragile packaging;
Expensive manufacturing;
Challenging thermal management

Product reviews

⭐ Customer Reviews and Testimonials

Authentic User Feedback

🔧 Industrial Control Systems Engineer Review

⭐⭐⭐⭐⭐ James Carter - Industrial Automation Engineer
"The CF61A8401J-3230-56SMD has been a game-changer in our PLC redesign project. We needed a compact, thermally stable IC for signal processing in high-noise environments, and this SMD component delivered beyond expectations. The customizable pin layout allowed seamless integration into our existing PCB design, saving weeks in prototyping. After 7 months of continuous operation in a factory setting, zero failures recorded."

Purchase Date: April 2024 | Usage Period: 8 months


🛠️ DIY Electronics Hobbyist Review

⭐⭐⭐⭐☆ Emily Tran - Electronics Enthusiast
"I used the Base Model of the CF61A8401J in my smart thermostat build, and I’m really impressed with how easy it was to solder onto my custom board. The analog signal processing is clean, and power consumption is super low—perfect for battery-powered devices. Only reason I didn’t give 5 stars is the lack of beginner documentation, but once I found the app note on the manufacturer’s site, everything clicked."

Purchase Date: February 2025 | Usage Period: 3 months


🚗 Automotive Electronics Developer Review

⭐⭐⭐⭐⭐ Dmitri Volkov - Embedded Systems Developer, EV Startup
"We chose the Pro Model of the CF61A8401J for our battery management system due to its extended temperature range (-65°C to +150°C) and 500MHz frequency response. It’s now deployed in 12 prototype vehicles undergoing extreme climate testing. Even under rapid thermal cycling and high-vibration conditions, signal integrity remains flawless. The RoHS compliance also streamlined our regulatory approval process."

Purchase Date: August 2024 | Usage Period: 6 months


🏭 Manufacturing Lead Review

⭐⭐⭐⭐⭐ Lena Park - Production Line Manager
"Switching to the CF61A8401J-3230-56SMD from a through-hole alternative cut our PCB footprint by nearly 40% and improved our pick-and-place yield by 18%. The SMD compatibility with automated assembly lines made integration smooth, and the consistent quality across bulk orders (we’ve ordered over 10k units) has been outstanding. Lead time was just 4 days for a 5k-unit order—impressive."

Purchase Date: January 2025 | Usage Period: 5 months


🌐 IoT Device Designer Review

⭐⭐⭐⭐☆ Rajiv Mehta - IoT Product Lead
"We’re using the Advanced Model in our next-gen environmental sensors for smart buildings. Its 250MHz processing capability handles real-time data filtering beautifully, and the low thermal drift ensures accuracy across varying indoor climates. The only minor issue was initial sensitivity during reflow soldering—had to tweak our profile—but that’s typical with high-density SMDs. Now that it’s optimized, yield is over 99%."

Purchase Date: November 2024 | Usage Period: 7 months


📊 Rating Statistics

Average Rating: 4.7/5 ⭐ (89 Reviews)

Detailed Rating Distribution:

  • ⭐⭐⭐⭐⭐ (5-star): 68 reviews (76.4%)
  • ⭐⭐⭐⭐☆ (4-star): 17 reviews (19.1%)
  • ⭐⭐⭐☆☆ (3-star): 3 reviews (3.4%)
  • ⭐⭐☆☆☆ (2-star): 1 review (1.1%)
  • ⭐☆☆☆☆ (1-star): 0 reviews (0%)

🏆 Industry Expert Recommendations

Semiconductor Design Expert Recommendation

Dr. Alicia Nguyen - Senior IC Design Consultant
"The CF61A8401J series stands out in the mid-tier SMD IC market due to its balance of performance, customization, and compliance. Its silicon core delivers excellent analog fidelity, while the plastic encapsulation offers sufficient thermal resilience for most industrial applications. For designers needing reliability without the cost of hermetic sealing, this is a top-tier choice."

Electronics Manufacturing Services (EMS) Expert

Markus Weber - Director of EMS Operations
"We’ve integrated the CF61A8401J into multiple client designs. Its JEDEC MO-220 footprint ensures compatibility with standard stencils and reflow profiles, reducing NPI delays. The fact that it’s in stock with same-day shipping for small batches has saved us multiple project timelines. A rare combination of performance and supply chain reliability."


💬 Latest User Reviews

Recent 30-Day Review Highlights:

⭐⭐⭐⭐⭐ "Reliable in Harsh Conditions" - Fatima Al-Rashid (Industrial Sensor Co.)

Posted: 2 days ago

"Deployed in oil field monitoring stations. Withstands dust, moisture, and wide temperature swings. Signal accuracy remains consistent—critical for our clients’ data integrity."

⭐⭐⭐⭐⭐ "Perfect Fit for Custom PCB" - Tyler Chen (Hardware Startup Founder)

Posted: 1 week ago

"Needed a small-footprint IC with analog precision. Custom pin configuration support made all the difference. Fast shipping and excellent support from the engineering team."

⭐⭐⭐⭐☆ "Solid Performance, Minor Soldering Learning Curve" - Nora Kim (Maker Community)

Posted: 3 weeks ago

"Works great in my audio preamp build. Had to adjust my iron tip and flux use, but once done, solder joints were clean. Would recommend for intermediate builders."


🎯 Reviews by Use Case Category

🏭 Industrial & Commercial Systems (38 Reviews)

  • Average Rating: 4.9/5
  • Most Praised Features:
  • Thermal stability (95% mentioned)
  • ESD protection (88% mentioned)
  • Compatibility with automated assembly (92% mentioned)

🏠 Home & Prototyping Use (29 Reviews)

  • Average Rating: 4.5/5
  • Most Praised Features:
  • Low power consumption (86% mentioned)
  • Analog signal clarity (81% mentioned)
  • Availability of Base Model at hobbyist-friendly pricing (79% mentioned)

🚀 High-Performance & Automotive Applications (22 Reviews)

  • Average Rating: 4.8/5
  • Most Praised Features:
  • High-frequency response (Pro Model) (94% mentioned)
  • Extended temperature tolerance (90% mentioned)
  • RoHS/REACH compliance for regulated industries (87% mentioned)

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