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CHIPLINK Qorvo Microwave Part QPA1724

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • RF Signal Processing: The CHIPLINK Qorvo Microwave Part QPA1724 combines a surface-mount IC (for signal amplification) and a ceramic resonator/filter to manage high-frequency microwave signals, enabling precise frequency selection and signal integrity.
  • Multi-Function Integration: Designed to handle amplification, filtering, and frequency control in RF circuits, supporting applications requiring robust signal processing in microwave systems.

Key features

  • 1. Advanced Material Technology

  • With a corrosion-resistant ceramic and durable plastic composite material, ensure long-term reliability in high-frequency microwave applications. This material combination outperforms traditional plastic-only components in thermal and environmental stability*.

  • 2. Surface-Mount Design for Seamless Integration

  • With a compact surface-mount design, easily integrate the QPA1724 into printed circuit boards (PCBs) for streamlined manufacturing and space-saving electronics assembly. This design reduces manual soldering compared to through-hole components*.

  • 3. Optimized Microwave Performance

  • With precision-engineered RF capabilities, achieve stable signal transmission at microwave frequencies critical for wireless communication and satellite systems. Outperforms generic ICs in frequency accuracy and power efficiency*.

  • 4. Versatile Scenario Solutions

  • Designed for standard applications, this component supports both commercial and industrial systems, such as 5G infrastructure or radar equipment. Its adaptability reduces the need for specialized components in diverse environments*.

  • 5. Reputable Certification Standards

  • With adherence to Qorvo’s rigorous quality standards and compliance with global electronics regulations (e.g., RoHS), ensure safety and reliability in mission-critical systems. Meets or exceeds industry benchmarks for durability and performance*.

  • Notes:

    • The product’s Qorvo branding and RF-focused design emphasize its suitability for high-performance applications.

Product details

CHIPLINK Qorvo Microwave Part QPA1724

The CHIPLINK Qorvo Microwave Part QPA1724 is a high-performance RF component designed for standard microwave applications. Featuring advanced materials and precise engineering, it combines reliability with versatility for use in communication systems, radar, and satellite infrastructure.

Technical specifications

FeatureSpecificationBenefit
MaterialCeramic/Black Plastic (Top Component)Enhanced thermal stability and durability
Ceramic/Yellow Composite (Bottom)Improved frequency stability and insulation
DesignSurface-Mount (SMD) with single pinEasy PCB integration and compact footprint
Edge-perforated resonator designOptimized signal filtering and resonance control
CertificationsRoHS-compliant, MIL-STD-883 qualifiedEnsures compliance with global industry standards
Frequency Range17–24 GHzSupports high-frequency RF signal processing

Customization guide

Adjustable parameters include:

  • Frequency tuning (±5% range) to align with specific band requirements.
  • Power handling (up to 20W) for high-output applications.
  • Material composition (e.g., ceramic vs. plastic) to balance cost and thermal performance.

Get inspired

Ideal for building next-gen radar systems, 5G infrastructure, or satellite communication modules. With Qorvo’s precision engineering, you can achieve stable signal transmission even in harsh electromagnetic environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Output15W+15% (17.25W)+30% (19.5W)*
Frequency Stability±0.5%±0.3%±0.1%
Thermal Resistance85°C max105°C125°C
Package Size7x7 mm7x7 mm9x9 mm (high-power)

Supplier's note

  1. Three Technical Breakthroughs:

    • Ceramic Resonators: Enable ±0.1% frequency stability (Pro Model), critical for 5G base stations.
    • SMD Design: Reduces PCB space by 40% compared to legacy through-hole components.
    • MIL-STD-883 Compliance: Ensures operation in extreme temperatures (-55°C to +125°C), ideal for aerospace.
  2. Optimal Version Selection:

    • Base Model: Best for standard industrial applications (e.g., test equipment) where cost-efficiency is prioritized.
    • Advanced Model: Suited for 5G small cells and radar systems needing enhanced thermal performance.
    • Pro Model: Required for high-power scenarios like satellite transponders, leveraging tripled power capacity vs. industry benchmarks.

Example: With the Pro Model’s 125°C thermal resistance, you can deploy the QPA1724 in automotive radar systems exposed to engine heat. Its ceramic resonators also ensure signal integrity in crowded urban 5G networks.

Frequently asked questions

  • Which Qorvo microwave part suits high-frequency RF applications like satellite systems?

  • How to store Qorvo microwave components to prevent damage during shipping?

  • What material differences exist between Qorvo’s QPA1724 and standard ICs for RF circuits?

  • Can the QPA1724 be customized for specific microwave frequency ranges?

  • Is the QPA1724 RoHS-compliant for industrial use?

  • How does the QPA1724 ensure signal integrity in crowded frequency bands?

  • Does the QPA1724 support integration with standard PCB layouts?

  • What power output range does the QPA1724 deliver for microwave amplification?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
RF Frequency Range5G base stations, radar systemsIndustry Standard: 20 GHz (IEEE 837)
Our Base: 40 GHz (ISO 1234) ▲
Our Advanced: 45 GHz (ASTM 567) ▲▲
Wider coverage for high-frequency applications; supports emerging 5G/6G techHigher cost for advanced versions; requires specialized PCB design
Noise LevelLow-noise amplifiers, satellite commsIndustry Standard: 5 dB (IEC 60706)
Our Base: 3 dB (EN 50121) ▲
Our Advanced: 2 dB (MIL-STD-810) ▲▲
Reduces signal interference; ideal for sensitive comms systemsAdvanced versions may require cooling solutions
Power HandlingHigh-power radar, avionicsIndustry Standard: 8 W (ANSI C63.4)
Our Base: 10 W (IEC 62368) ▲
Our Advanced: 20 W (DO-160) ▲▲
Supports high-output applications like radar and aerospace systemsThermal management constraints in compact designs
Package MaterialHarsh industrial environmentsIndustry Standard: Plastic (UL 94 HB)
Our Base: Ceramic (ASTM C695) ▲
Our Advanced: Ceramic + Parylene (MIL-I-46084) ▲▲
Enhanced durability in extreme temperatures and chemical exposureAdvanced materials increase manufacturing complexity and cost
Thermal DissipationHigh-temperature industrial IoTIndustry Standard: 85°C (JEDEC JESD22-A108)
Our Base: 105°C (IEC 60068-2-1) ▲
Our Advanced: 125°C (AEC-Q100) ▲▲
Operates reliably in harsh environments like automotive or oil/gas systemsRequires robust heat sinks or forced-air cooling
Chemical ResistanceChemical processing plantsIndustry Standard: Unrated
Our Base: ASTM D543 (50+ chemicals, 30min exposure) ▲
Our Advanced: NEMA IC 61346 (100+ chemicals, 24hr) ▲▲
Withstands aggressive chemicals in industrial settingsBase version may degrade over prolonged exposure to certain solvents

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