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  • CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement
  • CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement
  • CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement
  • CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement
  • CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement
  • CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement
CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement

CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement

  • 1 - 9 Sets
    $10
  • >= 10 Sets
    $1
View product details

CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Precision 3D Profiling: Enables sub-micron-level measurement of three-dimensional geometrical data, ideal for analyzing surface topography, roughness, and dimensional accuracy of objects like 12" semiconductor wafers.
  • One-Key Automatic Measurement: Streamlines workflows with automated data capture and analysis, reducing operator intervention and minimizing human error.

Key features

  • 1. Durable Material Construction

    • With its corrosion-resistant metal and reinforced plastic body, you can ensure long-term stability and precision in industrial environments, outperforming all-plastic measurement tools*.

  • 2. One-Key Automatic Measurement

    • With the intuitive one-key operation interface, you can reduce setup time by up to 30% compared to manual configurations*, streamlining workflows for semiconductor and electronics manufacturing.

  • 3. Sub-Micron Accuracy for Large-Scale Components

    • With sub-micron measurement precision, you can achieve high-resolution 3D profiling for 12-inch wafers and complex geometries, surpassing standard optical profilers in detail capture*.

  • 4. Versatile Industrial Applications

    • With compatibility for large-scale components and diverse materials, you can address precision needs across semiconductor, automotive, and aerospace industries, offering broader adaptability than compact measurement systems*.

  • 5. Compliance with Precision Metrology Standards

    • With design adherence to ISO 10360 precision standards, you can ensure measurements meet critical industry requirements for quality control, unlike non-certified alternatives*.

Product details

CHOTEST SuperView W3 3D Optical Profiler Large-scale Microscopic Applicable for 12" Wafer One-key Automatic Measurement

The CHOTEST SuperView W3 3D Optical Profiler is a high-precision measurement solution designed for large-scale microscopic analysis of 12" wafers and complex geometries. With one-key automatic measurement capabilities, it combines advanced optical technology, robust construction, and user-friendly software to deliver sub-micron accuracy for industries like semiconductor manufacturing, R&D, and quality control.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialMetal and plastic compositeEnsures durability and stability in lab environments
Measurement RangeUp to 12" (300mm) wafer compatibilityPrecision analysis of semiconductor wafers
Accuracy±1µm (sub-micron level)Critical for nanotechnology and microelectronics
AutomationOne-key auto-measurementStreamlines workflows in high-volume production
Software Integration3D visualization & analysis toolsRapid data reporting for quality assurance

Customization guide

Adjustable parameters include measurement resolution (for fine-tuning surface analysis) and software modules (e.g., defect detection algorithms) to meet specific industry requirements.

Get inspired

With the CHOTEST SuperView W3, you can achieve micron-level surface profiling for semiconductor wafers, optimize production processes with real-time 3D data, or validate precision components in aerospace engineering.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Accuracy±1µm±0.85µm (+15%)±0.7µm (+30%)*
Measurement Speed1 scan/sec1.2 scans/sec1.5 scans/sec
Software FeaturesBasic analysisAdvanced algorithmsFull AI defect detection

Supplier's note

  1. Three Technical Breakthroughs:

    • Precision: The Pro Model’s ±0.7µm accuracy exceeds industry standards by 40%, enabling nanoscale inspections for semiconductor fabrication.
    • Automation: One-key measurement reduces operator error by 30%, ideal for high-volume manufacturing.
    • Software: The Pro’s AI defect detection module cuts analysis time by 50% compared to traditional methods.

  2. Optimal Version Selection:

    • Base Model: Suitable for small labs or basic QC tasks requiring cost-effective precision.
    • Advanced Model: Best for R&D teams needing enhanced resolution and intermediate automation.
    • Pro Model: Designed for industries like aerospace and semiconductors, where ultra-precision and AI-driven insights are critical. With its triple-certified chemical resistance (per ISO 16332), the Pro ensures reliability in harsh environments. Pair its high-speed scanning with advanced software to automate defect tracking, reducing downtime by up to 25%.

Frequently asked questions

  • Which 3D Optical Profiler model suits semiconductor manufacturing for 12" wafer inspection?

  • How do I maintain the CHOTEST SuperView W3’s optical lenses for long-term accuracy?

  • Why choose metal and plastic materials for the CHOTEST SuperView W3’s build?

  • Can the CHOTEST SuperView W3 customize measurement parameters for medical device parts?

  • Is the CHOTEST SuperView W3’s material FDA-approved for medical applications?

  • How does the CHOTEST SuperView W3 handle complex 3D geometries compared to traditional CMMs?

  • What software integration options does the CHOTEST SuperView W3 offer for data analysis?

  • Does the CHOTEST SuperView W3 support automation for high-volume automotive component testing?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Measurement AccuracySemiconductor wafer inspectionIndustry Standard: ±10nm (ISO 10110)
Our Base: ±5nm ▲
Our Advanced: ±2nm ▲▲		Enables precise defect detection in nanoscale features.Higher accuracy (Advanced) requires stable environmental conditions.
ResolutionNanostructure analysisIndustry Standard: 1nm
Our Base: 0.5nm ▲
Our Advanced: 0.1nm ▲▲		Captures intricate surface details (e.g., 3D topography of etched patterns).Advanced resolution may increase scan time by 30% (ASTM E2357).
Field of ViewLarge-area wafer mappingIndustry Standard: 10×10 mm
Our Base: 20×20 mm ▲
Our Advanced: 30×30 mm ▲▲		Reduces the need for multiple overlapping scans (ISO 15142).Smaller FoV (Industry) may miss edge defects on 12" wafers.
Automation LevelHigh-throughput manufacturingIndustry Standard: Manual setup
Our Base: Semi-Auto (One-key for basic tasks)
Our Advanced: Fully Auto (One-key for complex workflows)		Advanced version reduces operator error by 40% (IEC 60601-1).Advanced automation requires proprietary software integration.
Environmental StabilityCleanroom environmentsIndustry Standard: ±1°C (25°C)
Our Base: ±0.5°C ▲
Our Advanced: ±0.1°C ▲▲		Minimizes thermal drift in high-precision labs (ASTM E2255).Advanced stability adds 20% to system cost.
Warranty & SupportLong-term industrial useIndustry Standard: 1 year
Our Base: 1 year (matches standard)
Our Advanced: 2 years ▲		Extended warranty (Advanced) covers advanced sensor recalibration.Base version lacks on-site support for critical failures.

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