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  • China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine
  • China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine
  • China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine
  • China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine
  • China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine
  • China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine
China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine

China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine

  • >= 1 Sets
    $35,999

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
View product details

China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Precision Polishing: Single-side polishing of silicon carbide wafers with micron-level accuracy, ensuring smooth surface finishes for semiconductor and industrial applications.
  • CNC Automation: Computer numerical control enables multi-axis rotation and customizable processing parameters, streamlining workflows for consistent results.

Key features

  • 1. Corrosion-Resistant Metallic Frame for Industrial Durability

    • With a corrosion-resistant metallic body, this machine maintains structural integrity in harsh industrial environments, ensuring long-term reliability. Its modular design allows customization for diverse material processing needs, outperforming rigid, non-modular competitors.*

  • 2. Programmable Digital Control Panel for Precision Automation

    • With a touchscreen interface and multi-program presets, operators can automate polishing processes with precise parameter adjustments. This reduces manual intervention compared to traditional manually controlled machines.*

  • 3. High-Speed Rotational Performance for Ultra-Precision Polishing

    • Achieve surface finishes within ±0.1µm tolerance thanks to high-speed rotating discs, outperforming standard lapping machines by up to 30% in precision for silicon carbide wafers.*

  • 4. Modular Design for Versatile Scenario Solutions

    • Designed for semiconductor manufacturing, this machine adapts to both single-side polishing of silicon carbide wafers and other precision components, offering greater flexibility than single-purpose machines.*

  • 5. ISO-Certified Safety Compliance

    • Equipped with safety labels, emergency stop switches, and ventilation systems, this machine meets ISO 13849 safety standards, ensuring operator protection during high-speed operations—a feature lacking in many entry-level models.*

Product details

China Factory CNC Surface Lapping Grinding Polishing Silicon Carbide Wafers Precision Single Side Polishing Machine

The China Factory CNC Surface Lapping Grinding Polishing Machine is designed for precision single-side polishing of silicon carbide wafers and other hard materials. With its modular design, advanced cooling system, and programmable controls, it delivers consistent surface finishes while prioritizing operator safety and efficiency.

Technical specifications

FeatureSpecificationBenefit
Control PanelDigital display with programmable controlsEnhanced automation and user-friendly operation
Lapping TechnologyHigh-precision rotating discsAchieves surface roughness <0.8μm
Modular DesignInterchangeable processing modulesVersatile for diverse material types
Cooling SystemDual-channel active coolingMaintains optimal temperature during use
Safety FeaturesIP54-rated enclosure + emergency stopISO 13849 compliance and accident prevention
Warranty1-year manufacturer warrantyComprehensive support and service

Customization guide

Adjustable spindle speed and pressure parameters to meet specific material hardness or thickness requirements.

Get inspired

Ideal for precision polishing of silicon carbide wafers and other hard materials, this machine combines advanced automation with robust safety features to ensure consistent quality and operator safety in semiconductor manufacturing.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed120 RPM+15% (138 RPM)+30% (156 RPM)*
Precision Level1.5μm1.0μm0.5μm
Automation LevelSemi-automatedFully automatedAI-assisted
Cooling EfficiencyStandardEnhanced (+10%)Premium (+20%)*
Safety ComplianceBasicISO 13849ISO 13849 + CE

Supplier's note

  1. Technical Breakthroughs:

    • Modular Design: Customizable modules enable rapid adaptation to different wafer sizes or material types.
    • Advanced Cooling: The Pro model’s premium cooling system extends tool life by 25% compared to industry standards.
    • Safety Features: Redundant safety protocols (e.g., emergency stop, IP54 enclosure) reduce accident risks by 40%.

  2. Version Selection Guide:

    • Base Model: Ideal for small-scale production or low-volume R&D labs requiring basic precision.
    • Advanced Model: Suited for medium-scale manufacturing needing full automation and ISO compliance.
    • Pro Model: Best for high-precision semiconductor production, where AI-assisted adjustments and 20% faster cooling ensure unmatched reliability.

Example Use Case: With the Pro model’s 0.5μm precision and AI-driven adjustments, you can achieve ultra-smooth silicon carbide wafers for LED manufacturing, reducing post-processing defects by 30%.

Frequently asked questions

  • Which CNC lapping machine suits small-scale silicon carbide wafer production?

  • How do I maintain the cooling system of a CNC silicon carbide polishing machine?

  • Can this machine polish both silicon carbide and aluminum wafers?

  • Does the machine offer customization for unique wafer dimensions?

  • Is the polishing machine ISO-certified for precision manufacturing?

  • How does the machine ensure safety during high-speed polishing?

  • Can I integrate this CNC lapping machine into an existing production line?

  • What warranty support comes with the precision single-side polishing machine?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Precision LevelSemiconductor Manufacturing±2μm tolerance (ISO 1302 Class 1) ▲▲
±5μm tolerance (ISO 1302 Class 3) ▲
±10μm tolerance (Industry Standard)		Advanced: Ultra-precise for silicon carbide wafers (critical for semiconductors)
Base: Meets most industrial standards		Advanced: Higher cost due to diamond-coated abrasives
Rotation SpeedHigh-Volume Production300 RPM (ISO 23743 Class A) ▲▲
200 RPM (ISO 23743 Class B) ▲
100 RPM (Industry Standard)		Faster processing cycles (reduces downtime by 40%)Higher RPM requires more frequent maintenance (every 500 hours vs 1,000 hours for Base)
Cooling EfficiencyContinuous OperationLiquid-cooled (ΔT ≤5°C) ▲▲
Air-cooled (ΔT ≤15°C) ▲
No active cooling (Industry Standard)		Prevents thermal distortion in silicon carbide wafersAdvanced: Adds 20% to upfront cost for cooling systems
Material CompatibilityCeramic/Metal Hybrid ManufacturingSupports 5+ materials (silicon carbide, alumina, steel) ▲▲
3 materials (steel, aluminum, brass) ▲
1 material (steel)		Versatile for R&D labs and mixed-material productionAdvanced: Requires specialized training for material-specific settings
Automation LevelSmart FactoriesFully automated (ISO 10369 Level 4) ▲▲
Semi-automated (ISO 10369 Level 2) ▲
Manual (Industry Standard)		Reduces labor costs by 60% and integrates with IoT platformsAdvanced: Requires PLC programming expertise
Safety FeaturesHazardous Material HandlingReal-time sensor monitoring (IEC 61508 SIL 3) ▲▲
Basic E-stop + sensors (IEC 61508 SIL 1) ▲
No sensors (Industry Standard)		Prevents accidents in high-risk environmentsAdvanced: Adds 15% to installation time for sensor calibration

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