China Factory Glass Abrasive Polishing Compound W28 Diamond Micron Powder Lapping Paste

Technical specifications

Customization guide

Adjust particle size to match surface finish requirements:

• 25µm/15µm: Ideal for rapid material removal in rough machining.
• 7µm/0.5µm: Achieve mirror-like finishes for precision components.
• Custom blends: Available upon request for specialized grit combinations.

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With HNNONGXIANG’s diamond paste, semiconductor manufacturers can polish silicon wafers to nanoscale smoothness, while jewelry artisans achieve flawless gemstone surfaces. The 0.5µm grade ensures defect-free finishes for high-end optical components.

Choose your model

Supplier's note

1. Technical Breakthroughs:

   • Precision Particle Control: ±5% uniformity in particle distribution ensures repeatable results.
   • Synthetic Diamond Core: 20% harder than natural diamond, extending tool life by 30%.
   • SEM-S2 Compliance: Meets semiconductor industry cleanliness standards, reducing defect rates by 40%.

2. Optimal Version Selection:

   • Base Model (25µm): For automotive or tooling industries requiring rapid material removal.
   • Advanced Model (15µm/7µm): Ideal for medical device polishing or aerospace component finishing.
   • Pro Model (0.5µm): Essential for semiconductor wafer polishing or high-end watchmaking, where nanoscale precision is critical.

With the Pro Model’s 0.5µm particles, you can achieve sub-micron surface roughness on silicon wafers—critical for advanced chip fabrication. Pair this with the compound’s chemical stability to ensure zero contamination during lapping. For jewelry artisans, the 7µm grade offers a balance between speed and finish quality, reducing polishing time by 25% compared to traditional abrasives.