Memory Capacity | High-Performance Computing, Servers | Industry: 8GB DDR3 ▲ Base: 16GB DDR4 ▲ Advanced: 64GB DDR4 (JEDEC compliant) | Supports large data processing, multitasking, and complex applications. | Higher power consumption; requires robust power supply. |
Material Composition | Industrial Electronics, IoT Devices | Industry: FR-2 (lower cost) ▲ Base: FR-4 (ISO 17027 compliant) ▲ Advanced: Aluminum-backed FR-4 | Enhanced durability, thermal stability, and EMI resistance. | Higher cost compared to basic materials; requires precise manufacturing. |
Compliance Certifications | Global Markets, Regulatory Compliance | Industry: Basic RoHS ▲ Base: RoHS + UL ▲ Advanced: RoHS + UL + EPR (Germany/France) + REACH | Ensures market准入 in EU and North America; reduces legal risks. | Higher certification costs; longer lead times for advanced tiers. |
Thermal Management | High-Power Devices, Embedded Systems | Industry: Passive cooling ▲ Base: Heat sinks ▲ Advanced: Active cooling (IEEE 519 compliant) | Prevents overheating in dense component setups; extends component lifespan. | Adds complexity to design; may increase size/weight. |
Customization Options | Specialized Electronics, Prototyping | Industry: Limited layout changes ▲ Base: Layout + component adjustments ▲ Advanced: Full customization (IPC-7351) | Tailored to specific applications (e.g., robotics, medical devices). | Requires detailed specs from clients; extended production timelines. |
Power Delivery (PoE) | Networked Devices, IoT Sensors | Industry: No PoE ▲ Base: PoE (IEEE 802.3af, 15.4W) ▲ Advanced: PoE+ (IEEE 802.3at, 30W) | Simplifies installation for IP cameras, access points, and smart sensors. | Requires compatible PoE injectors/hubs; limited to Ethernet-based systems. |