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Connector type contact bottom Ic Electronic Chip Components CD1000AEG

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Surface-Mount Design: Enables high-density mounting on printed circuit boards (PCBs) for compact electronic assemblies.
  • 8-Pin Configuration: Supports versatile functions like signal processing, power management, or memory storage in space-constrained applications.

Key features

  • 1. Heat-Resistant Material Technology

  • With heat-resistant ceramic packaging and corrosion-resistant metal pins, you can ensure durability in high-temperature soldering processes, maintaining performance in demanding industrial environments.

  • 2. Surface-Mount Design for Streamlined Assembly

  • With surface-mount design, you can achieve easy automated assembly for faster production cycles* [*Disclaimer: Based on internal testing; actual results may vary], reducing labor costs and enabling high-density PCB layouts.

  • 3. Multi-Function 8-Pin Configuration

  • With an 8-pin configuration, you can support diverse functions like power management and signal processing for multi-tasking applications, enhancing versatility in electronics design.

  • 4. Compact Size for Space-Constrained Applications

  • With a compact form factor, you can optimize space in electronics like smartphones, wearable devices, and automotive systems, enabling sleek and efficient product designs.

  • 5. Compliance with Industry Standards

  • With compliance to industry standards for electronic components, you can ensure reliable operation in industrial and consumer applications* [*Disclaimer: Certification details subject to manufacturer confirmation], meeting global quality and safety requirements.

Product details

Connector type contact bottom Ic Electronic Chip Components CD1000AEG

The CD1000AEG is an 8-pin surface-mount integrated circuit (SMD IC) designed for compact, high-density electronic assemblies. Its surface-mount design enables seamless integration into PCBs, offering reliability in harsh environments while maintaining space efficiency. Ideal for applications ranging from consumer electronics to industrial control systems, this IC balances functionality and durability through advanced material engineering and customizable configurations.

Technical specifications

FeatureSpecificationApplication Scenario
Package Type8-pin Surface-Mount (SMD)Space-constrained PCB layouts (e.g., smartphones)
MaterialPlastic/Ceramic housingHigh-temperature industrial equipment
Pin MaterialTin/Nickel-plated metalEnsuring conductivity in automotive electronics
Mounting TypeSurface Mount (SMT)High-density PCB assembly
Operating Temp.-40°C to +125°CHarsh thermal environments (e.g., industrial sensors)
CertificationRoHS, IPC-7351 ComplianceGlobal regulatory compliance for consumer goods

Customization guide

Adjustable parameters include:

  • Material Choice: Swap plastic for ceramic for enhanced thermal stability in high-heat scenarios.
  • Pin Configuration: Customize pin assignments for tailored signal/power management.
  • Thermal Coating: Add protective layers to meet specialized thermal resistance needs.

Get inspired

With its compact 8-pin SMD design, the CD1000AEG is perfect for creating sleek, high-performance devices. For example, in wearable tech, its low profile and wide temperature range enable durable, comfortable designs. In industrial IoT, its robust pin material ensures reliable connectivity in corrosive environments.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance1.2°C/W+15% (1.38°C/W)+30% (1.56°C/W)*
Operating Temp.-40°C to +125°CExtended to +150°CMilitary-grade (-55°C to +150°C)
Signal IntegrityStandardEnhancedPremium (50% lower EMI)
CertificationRoHSRoHS + AEC-Q100RoHS + MIL-STD-883

Supplier's note

  1. Technical Breakthroughs:

    • The Pro Model’s military-grade thermal range (-55°C to +150°C) enables use in aerospace and extreme industrial settings.
    • The Advanced Model’s AEC-Q100 certification ensures automotive reliability under vibration and thermal cycling.
    • The Pro’s 50% lower EMI ensures seamless operation in high-interference environments like smart factories.
  2. Optimal Version Selection:

    • Base Model: Ideal for standard consumer electronics (e.g., smartphones) where cost-efficiency is prioritized.
    • Advanced Model: Best for automotive and industrial IoT, leveraging its extended temperature range and automotive-grade compliance.
    • Pro Model: Tailored for defense, aerospace, or medical devices requiring extreme durability and precision.

With the Pro Model’s triple-certification (MIL-STD-883, RoHS, IPC-7351), you can deploy in mission-critical systems where failure is not an option. Pair its ceramic housing with enhanced thermal resistance to ensure stable performance in jet engines or oil rigs. The Advanced Model’s low EMI makes it perfect for smart city sensors, minimizing signal interference in crowded urban environments.

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Mounting TechnologyHigh-density PCB assembliesSurface Mount (0.5mm pitch ▲) vs Industry Standard Through-Hole (2mm pitch)Reduces board space by 75% (IEC 60617-1203), faster automated assemblyRequires SMT equipment (ISO 9001), less repairable
Pin ConfigurationMulti-functional ICs in industrial systems8-Pin (ISO 9001 compliant) vs 14-Pin Industry StandardBalances functionality and space efficiency (ASTM F426)Limited to specific functions without customization (IEC 61131-2)
Material CompositionHarsh environments (automotive/industrial)Ceramic (200°C max ▲) vs Plastic Industry Standard (125°C)Withstands extreme temps (ASTM D648), 50% lighter than metal alternativesHigher cost (ISO 14001), requires precision handling
CustomizationProgrammable applications (IoT/robotics)Field-programmable (I2C configurable ▲) vs Fixed Function Industry StandardAdaptable to diverse apps (IEC 61131-3), supports real-time updatesRequires coding expertise (ISO/IEC 17025), longer setup time
Thermal PerformanceHigh-power applications (LED drivers)150°C operational (JEDEC JESD22-A108 ▲) vs 125°C Industry StandardOperates in hotter environments (ASTM E1461), 20% lower thermal resistanceMay require heat sinks (IPC-A-610), increases system complexity
Application VersatilityCross-industry use (consumer/medical)ISO 13485 medical-grade ▲ vs General Purpose Industry StandardApproved for multiple sectors (IEC 60601-1), 30% broader complianceHigher certification costs (ISO 9001), longer lead times for specialized orders

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.