Processor Performance | Industrial automation, embedded prototyping | Industry: 1.2GHz ARM Cortex-A9 (e.g., OMAP5) ▲ Our Base: 1GHz ARM Cortex-A8 (AM3354) ▲ Our Advanced: 1.2GHz Cortex-A8 (overclocked, AM3354+) | Base: Cost-effective for basic tasks; Advanced: Matches high-end workloads (▲1.2x Base clock) | Base may throttle under heavy loads; Advanced requires cooling solutions |
Memory Capacity | Data logging, IoT gateways | Industry: 64MB SRAM + 128MB Flash (e.g., STM32F7) ▲ Our Base: 32MB SRAM + 64MB Flash ▲ Our Advanced: 64MB SRAM + 128MB Flash | Advanced: Handles large datasets (▲2x Base SRAM); Base: Sufficient for light tasks | Base limits complex apps; Advanced increases cost |
Connectivity Options | IoT deployments, networked devices | Industry: USB 3.0, Gigabit Ethernet, Wi-Fi ▲ Our Base: USB 2.0, 10/100 Ethernet ▲ Our Advanced: USB 3.0, Gigabit Ethernet, CAN bus | Advanced: Industrial protocols (▲ adds CAN bus); Base: Simpler, cheaper | Base lacks high-speed interfaces; Advanced adds complexity |
Thermal Management | 24/7 industrial systems | Industry: Active cooling (50°C max, MIL-STD-810G) ▲ Our Base: Passive cooling (60°C max) ▲ Our Advanced: Active cooling (50°C max) | Advanced: Stable in high temps (▲ matches Industry); Base: Quieter, lower power | Base overheats under load; Advanced needs more space |
Durability/Resistance | Harsh environments (factories/outdoors) | Industry: IP67, -40°C to 85°C (MIL-STD-810G) ▲ Our Base: IP40, -20°C to 70°C (gold edges EN 60068-2-78) ▲ Our Advanced: IP65, -40°C to 85°C | Advanced: Survives extreme conditions (▲ adds IP65); Base: Cost-effective | Base corrodes in humidity; Advanced bulkier |
Development Support | Rapid prototyping, education | Industry: Full SDK + cloud integration (e.g., Jetson) ▲ Our Base: Basic SDK + limited tutorials ▲ Our Advanced: Full SDK + tutorials + community forums | Advanced: Accelerates prototyping (▲ adds tutorials); Base: Minimalist | Base lacks advanced tools; Advanced requires learning curve |