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  • Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit
  • Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit
  • Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit
  • Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit
  • Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit
  • Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit
Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit

Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit

  • 1 - 999 Pieces
    $1
  • 1000 - 4999 Pieces
    $0.20
  • >= 5000 Pieces
    $0.10

Customization:

Customized logo（Min.Order: 1000 pieces）
Customized packaging（Min.Order: 1000 pieces）
Graphic customization（Min.Order: 1000 pieces）
View product details

Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Specialized Power Management Design: Engineered for high-current and high-frequency applications, featuring a circular pattern with central holes and vias to optimize power distribution and signal integrity in power banks and consumer electronics.
  • Durability & Compliance: Constructed with FR-4 material and immersion gold surface finish for enhanced thermal/electrical stability, while meeting RoHS and UL certifications for safety and environmental standards.

Key features

  • 1. Advanced Material Technology for Durability

    • With FR-4 flame-retardant material and immersion gold surface finish, ensure long-lasting durability and corrosion resistance in high-reliability environments. The immersion gold finish outperforms traditional HASL coatings in conductivity and oxidation resistance*, making it ideal for demanding applications.

  • 2. Custom Circular Design for Compact Efficiency

    • The unique circular layout with central holes and strategic via placement optimizes space utilization and enhances signal integrity, enabling seamless integration into compact devices like power banks. This design reduces interference compared to standard rectangular PCB layouts*, improving performance in confined spaces.

  • 3. Versatile Copper Thickness for Diverse Applications

    • With adjustable copper thickness (0.25–6 oz), accommodate power demands from low-current IoT devices to high-power industrial systems. This flexibility surpasses fixed-thickness PCBs*, supporting scalability across consumer and commercial electronics.

  • 4. Certified for Global Compliance and Safety

    • Complies with RoHS and UL standards, ensuring environmental safety and electrical reliability for global markets. These certifications provide a competitive edge over non-compliant alternatives*, simplifying regulatory approvals.

  • 5. High-Frequency Performance for Critical Applications

    • The immersion gold finish and vias enable stable high-frequency signal transmission, ideal for telecommunications or automotive electronics. This outperforms standard PCBs in noise-sensitive environments*, ensuring reliable operation under demanding conditions.

Product details

Custom OEM Electronic Board Printed Circuit Boards Manufacturing For Power Bank Circuit

The Custom OEM Electronic Board is a high-performance PCB designed for power bank circuits and consumer electronics. Built with FR-4 material and immersion gold surface finish, it offers durability, thermal stability, and customizable layouts to meet diverse application needs.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialFR-4 epoxy glass compositeHigh-reliability electronics (e.g., power banks, automotive systems)
Copper Thickness0.25–6 oz adjustablePower-dense devices (e.g., industrial chargers, high-current modules)
Surface FinishImmersion goldHigh-frequency circuits requiring oxidation resistance
Design LayoutCircular pattern with central viasCustomized component integration (e.g., connectors, sensors)
CertificationsRoHS, ULCompliance-driven consumer electronics manufacturing

Customization guide

Adjustable copper thickness (0.25–6 oz) to meet power density requirements. Customizable circular pattern design for component-specific integration. Surface finish options (e.g., ENIG) available for advanced corrosion protection.

Get inspired

With its modular design and robust materials, this PCB empowers engineers to build compact, high-performance power solutions—from consumer-grade power banks to industrial-grade charging systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Copper Thickness1 oz2 oz6 oz*
Surface FinishImmersion goldImmersion gold + ENIGENIG
Via DensityStandardHighUltra-dense
CertificationsRoHS, ULRoHS, UL, ISO 9001RoHS, UL, ISO 9001, MIL-STD

Supplier's note

  1. Technical Breakthroughs:

    • Immersion Gold Finish: Reduces oxidation by 40% compared to HASL, ensuring longevity in harsh environments.
    • FR-4 Material: Withstands temperatures up to 140°C, ideal for high-power applications.
    • Variable Copper Thickness: Enables 60% higher current capacity in Pro models vs. industry baselines.

  2. Version Selection Guide:

    • Base Model: Best for standard power banks and low-power consumer devices.
    • Advanced Model: Suitable for high-current applications (e.g., fast-charging docks) requiring ISO compliance.
    • Pro Model: Designed for industrial systems (e.g., automotive electronics) needing MIL-STD durability and ultra-high power handling.

*Pro Model’s 6 oz copper thickness exceeds industry standards by 30%, enabling 20% higher thermal dissipation.

Frequently asked questions

  • Which custom OEM electronic board suits high-power power bank applications?

  • How does the FR-4 material benefit power bank circuit boards?

  • Can I customize the layout of the OEM PCB for a specific power bank design?

  • Is the immersion gold surface finish better than ENIG for power bank PCBs?

  • Does the PCB comply with RoHS and UL certifications for consumer electronics?

  • What makes this PCB suitable for high-frequency power bank circuits?

  • Can I request a PCB with a non-standard copper thickness for my power bank?

  • How does the PCB’s design enhance power bank durability?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
High-Power PCBsPower Banks, EV ChargersCopper Thickness: 1.5oz (Base) ▲ 3oz (Advanced) (ASTM B419)Handles 25A+ currents ▲, 50% better heat dissipation (IPC-9592)Higher cost ▲, Requires precision drilling (ISO 2768)
Standard Consumer PCBsSmartphones, WearablesCopper Thickness: 0.5oz (ISO 14620)30% lower cost, 10A max currentLimited durability under vibration stress (IEC 60068-2-64)
High-Frequency PCBs5G Routers, Automotive SensorsDielectric Constant: 4.5 (Base) ▲ 4.2 (Advanced) (IPC-2141)20% reduced signal loss ▲, 5GHz+ compatibilityRequires expensive laminates (Taconic TFD-100)
Customizable PCBsIoT Modules, Specialty ElectronicsCircular Layout with 50+ Pads (IPC-6012)Tailored for niche applications, 40% higher component density ▲20% longer lead time, complex DFM requirements
Certified PCBsIndustrial Automation, Medical DevicesRoHS Compliance ▲ UL 94 V-0 Flame Rating (IEC 60695-11-10)Global market access, 50+ chemical resistance tests passed (ASTM F739)15% higher certification costs, rigorous traceability
High-Reliability PCBsAerospace, Military SystemsImmersion Gold Finish (ASTM B488) ▲ ENIG (Electroless Nickel)500+ solder cycles ▲, oxidation resistance ▲30% higher material cost, specialized plating equipment required

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