Material Composition | High-current industrial equipment | Industry Standard: Steel (conductivity: 8.0 MS/m) Our Base: Brass (17.0 MS/m▲) Our Advanced: Gold-plated Brass (20.0 MS/m▲▲) | ▲ Base: 112% higher conductivity than steel. ▲▲ Advanced: 15% better corrosion resistance. | ▲ Base: 20% cost increase vs steel. ▲▲ Advanced: 40% premium for gold plating. |
Contact Material | Data-sensitive devices (e.g., routers) | Industry Standard: Tin-plated copper (resistance: 0.02Ω) Our Base: Brass (0.015Ω▲) Our Advanced: Gold-plated brass (0.01Ω▲▲) | ▲ Base: 25% lower resistance. ▲▲ Advanced: 30% better signal integrity. | ▲ Base: Requires stricter soldering. ▲▲ Advanced: Fragile plating during assembly. |
Orientation | Compact IoT devices | Industry Standard: Straight (space efficiency: 1.0) Our Base: Right Angle (1.5▲) Our Advanced: Right Angle + 90° bend (2.0▲▲) | ▲ Base: Saves 30% PCB space. ▲▲ Advanced: Enables vertical mounting. | ▲ Base: 15% higher cost. ▲▲ Advanced: Limited compatibility with legacy systems. |
Connector Type | Modular smart home systems | Industry Standard: Generic headers (locking: none) Our Base: Pin headers (locking: optional) Our Advanced: Latched pin headers (locking: mandatory▲) | ▲ Advanced: 50% lower disconnection risk. Base: Cost-effective for non-vibrational use. | Advanced: 25% bulkier than base. Industry: Risk of accidental unplugging. |
Core Configuration | High-power appliances (e.g., HVAC) | Industry Standard: Single-core (current: 2A) Our Base: Dual-core (3.5A▲) Our Advanced: Quad-core (5A▲▲) | ▲ Base: Handles 75% more power. ▲▲ Advanced: Supports industrial-grade loads. | ▲ Base: 20% heavier. ▲▲ Advanced: Requires thicker wiring. |
Pitch | High-density PCB layouts | Industry Standard: 1.25mm (density: 80 contacts/cm²) Our Base: 1.0mm (100 contacts/cm²▲) Our Advanced: 0.5mm (200 contacts/cm²▲▲) | ▲ Base: 25% denser packing. ▲▲ Advanced: 150% higher component density. | ▲ Base: Delicate solder joints. ▲▲ Advanced: Requires specialized tools. |