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  • Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber
  • Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber
  • Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber
  • Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber
  • Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber
  • Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber
Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber

Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber

$0.30-$15.00/ Set|1 Set/Sets(Min. Order)

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
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Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Cooling: Designed to manage extreme thermal loads for high-end GPUs (NVIDIA 4080/4090) and CPUs in notebooks, leveraging copper liquid cooling and vapor chamber technology for optimal heat dissipation.
  • Modular Heat Dissipation System: Features a flat mounting plate with customizable holes and a ribbed vertical heat sink to maximize surface area and airflow efficiency.

Key features

  • 1. Material Technology

    • With copper and aluminum construction, achieve superior heat dissipation compared to traditional aluminum-only designs*. The combination of copper’s high thermal conductivity and aluminum’s lightweight properties ensures efficient cooling for high-performance components like NVIDIA 4080/4090 GPUs.

  • 2. Customizable Design

    • With precision CNC machining capabilities, design bespoke heat sinks tailored to specific thermal management needs*. The ribbed surface and modular flat plate allow customization for mounting configurations or heat dissipation optimization.

  • 3. Performance Parameters

    • With enhanced thermal conductivity (up to 400 W/m·K for copper), reduce component temperatures 30% faster than standard aluminum heat sinks*. The ribbed structure maximizes surface area for airflow, maintaining optimal performance under continuous operation.

  • 4. Scenario Solutions

    • With ribbed surface technology and lightweight aluminum, maintain peak performance in high-intensity scenarios like gaming notebooks or industrial servers*. The flat plate’s adaptable mounting holes ensure compatibility with rapid prototyping and compact electronic systems.

  • 5. Certification Standards

    • With materials compliant with ISO 9001 manufacturing standards, ensure durability and reliability for critical applications*. Copper and stainless steel options meet food-grade and eco-friendly certifications for specialized industries.

  • Notes:

    • The product’s CNC machining and material flexibility (e.g., copper, titanium) enable superior heat dissipation and customization over generic heat sinks.

Product details

Customized Notebook CPU Cooler Heat Sink Copper Liquid Cooling 4080 4090 vapor Chamber

Our Customized Notebook CPU Cooler Heat Sinks are precision-engineered for high-performance thermal management in advanced electronics. Designed using copper vapor chambers and CNC-machined materials like aluminum and titanium, these components ensure efficient heat dissipation in compact spaces. Ideal for rapid prototyping and high-end applications like GPU cooling (NVIDIA 4080/4090), they combine lightweight materials with customizable designs to meet diverse thermal demands.

Technical specifications

FeatureSpecificationBenefit
MaterialAluminum, Copper, Titanium, Stainless Steel, Brass, Bronze, Alloy SteelHigh thermal conductivity (Copper: 385 W/m·K), lightweight (Aluminum: 2.7 g/cm³), corrosion resistance (Stainless Steel)
DesignRibbed vertical fins, flat mounting plate with customizable holes40% increased surface area for heat dissipation; modular mounting flexibility
ProcessCNC Milling, Turning, Wire EDM, Laser MachiningPrecision tolerances (±0.001mm), complex geometries achievable
Surface TreatmentAnodized coating, chemical etching, polishingEnhanced durability, reduced thermal interface resistance, smooth attachment surfaces
CertificationsISO 9001, RoHS compliantGuaranteed quality for global electronics manufacturing standards

Customization guide

Adjustable parameters:

  • Hole patterns (size/spacing) to match PCB layouts
  • Rib density/height to optimize airflow and thermal performance
  • Material thickness (0.5–5mm) for weight vs. conductivity trade-offs
  • Surface finishes (e.g., black anodizing for EMI shielding)

Get inspired

Maximize thermal efficiency in your next project with our modular heat sinks. Whether you’re prototyping a gaming laptop cooler or designing industrial-grade GPU enclosures, our customizable solutions pair advanced materials with precision engineering to keep components running cool under extreme loads.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal ConductivityAluminum (205 W/m·K)Copper (385 W/m·K)Copper-Titanium Hybrid (+30% efficiency vs. Base)*
Weight250g (Aluminum)320g (Copper)280g (Lightweight hybrid)
Max Heat Dissipation50W80W120W
Surface FinishMatte anodizedPolished copperNanocoating for low friction

Supplier's note

  1. Key Breakthroughs:

    • The Pro Model’s copper-titanium hybrid construction achieves 30% higher thermal efficiency than aluminum, critical for 4090 GPU cooling.
    • Wire EDM precision enables 0.001mm tolerances, ensuring seamless integration with compact notebook designs.
    • Ribbed fin arrays reduce airflow resistance by 20% compared to flat heat sinks, enhancing passive cooling.

  2. Version Selection Guide:

    • Base Model (Aluminum): Ideal for rapid prototyping or low-power applications where cost and speed are priorities.
    • Advanced Model (Copper): Best for mid-range GPUs (e.g., 4080) requiring balanced performance and durability.
    • Pro Model: Tailored for high-end systems (e.g., 4090) needing extreme cooling under sustained loads. Its nanocoating also reduces dust buildup in industrial environments.

Pro Model’s hybrid material reduces weight by 20% compared to pure copper while maintaining conductivity.

Frequently asked questions

  • Which model of the customized notebook CPU cooler heat sink is best suited for NVIDIA 4090 GPUs?

  • How do I clean the frothing nozzle of the copper liquid cooling chamber?

  • What’s the difference between copper and aluminum in heat sinks for laptops?

  • Can I customize the mounting holes and rib design for my rapid prototyping project?

  • Is the heat sink FDA-approved for medical electronics applications?

  • Does the heat sink support thermal performance standards for gaming laptops?

  • What surface treatments are available for the aluminum heat sink components?

  • How does the vapor chamber design improve cooling compared to traditional heat sinks?

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