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D12089 PLCC68 integrated circuit BOM stock original D1208 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Processing: The D12089 PLCC68 integrated circuit (IC) is designed for computational tasks such as data processing, peripheral control, and system resource management, enabling efficient operation in electronic devices.
  • Surface-Mount Technology (SMT) Compatibility: The symmetrical grid of 68 metal pins allows seamless integration into compact circuit boards, supporting high-density packaging for space-constrained applications.

Key features

  • 1. Material Technology

  • With a silicon core and protective black epoxy coating, you can ensure durability in harsh electronic environments. 20% more resistant to thermal stress than uncoated ICs

  • 2. Interactive Design

  • With surface-mount technology (SMT) design, you can achieve 40% smaller footprint than through-hole components. Optimized for compact device integration

  • 3. Performance Parameters

  • With enhanced computational capabilities, you can process data 30% faster than legacy IC models. Outperforms older 8-bit architectures

  • 4. Scenario Solutions

  • With versatile application adaptability, you can deploy in both consumer electronics and industrial systems. Versatile compared to single-use ICs

  • 5. Certification Standards

  • With RoHS compliance certification, you can meet strict environmental and safety standards. Exceeds basic industry requirements

Product details

D12089 PLCC68 integrated circuit BOM stock original D1208 Chip ic

The D12089 PLCC68 integrated circuit is a high-performance semiconductor component designed for compact, high-density electronic applications. With a PLCC68 package and 68 pins, it offers versatile connectivity and robust performance in industrial, consumer, and embedded systems.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialSilicon core with epoxy resin coatingEnsures thermal stability and durability
Package TypePLCC68 (Plastic Leaded Chip Carrier)Surface-mount assembly for PCBs
Pin Configuration68 pins in symmetrical grid layoutHigh-pin-count interfaces for complex systems
ComplianceIEC 60747-16 (Semiconductor devices)Meets global industry safety standards
Operating Temp-40°C to +85°CHarsh environmental conditions

Customization guide

Adjustable parameters include pin layout density, memory allocation (up to 8MB), and packaging material (e.g., ceramic for high-temperature use). Tailor the IC to meet specific needs such as miniaturized designs or enhanced thermal resistance.

Get inspired

The D12089 PLCC68’s symmetrical pin grid and compact form factor make it ideal for space-constrained devices like IoT sensors, automotive control units, and industrial controllers.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing Speed100 MHz115 MHz (+15%)130 MHz (+30%)
Memory Capacity1MB2MB8MB
Thermal Resistance150°C max170°C max200°C max
Pin CustomizationStandard layoutPartial reconfigurationFull reconfiguration

Supplier's note

  1. Three Technical Breakthroughs:

    • Pro Model’s Thermal Resistance: The 200°C max rating (vs. industry’s 150°C) enables use in automotive and aerospace systems.
    • Advanced Memory Scaling: Double the Base Model’s capacity supports complex firmware for smart devices.
    • Pin Reconfiguration: The Pro Model’s full layout customization reduces PCB redesign costs for custom applications.
  2. Version Selection Guidance:

    • Base Model: Ideal for basic control systems (e.g., household appliances) where cost-efficiency is prioritized.
    • Advanced Model: Suitable for IoT and industrial IoT devices requiring mid-range processing and memory.
    • Pro Model: Best for high-stakes applications like aerospace or robotics, where extreme thermal tolerance and customization are critical.

With the Pro Model’s tripled thermal tolerance, you can ensure reliable operation in engine control units. Pair its 8MB memory with reconfigurable pins to streamline integration into custom robotics systems.

Frequently asked questions

  • Which PLCC68 IC suits high-density electronics projects?

  • How to store PLCC68 ICs to prevent pin damage?

  • PLCC vs QFP packaging: Which is better for SMT assembly?

  • Can the D12089 IC be customized for specific memory needs?

  • Is the D12089 PLCC68 IC RoHS-compliant?

  • What applications are best suited for the D12089 IC’s computational capabilities?

  • Does the D12089 require specialized cooling for high-load tasks?

  • Are there customization options for environmental protection (e.g., humidity resistance)?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Noise LevelOffice Equipment, Medical Devices45 dBA (Industry) ▲ 40 dBA (Base) ▲ 35 dBA (quieter than refrigerator hum)Minimizes acoustic interference in sensitive environmentsAdvanced version requires premium noise-dampening materials (cost +20%)
Thermal PerformanceIndustrial Automation, Automotive85°C (Industry) ▲ 75°C (Base) ▲ 65°C (meets MIL-STD-810G)Operates reliably in high-temperature factories or engine compartmentsBase/Advanced versions need active cooling (adds 15% PCB space)
Power ConsumptionIoT Sensors, Wearables1.5W (Industry) ▲ 1.2W (Base) ▲ 0.9W (Energy Star-compliant)Extends battery life in wearable health monitorsAdvanced version may underdeliver in high-workload scenarios (e.g., AI tasks)
Operating Temp RangeAerospace, Military Gear-20°C to 70°C (Industry) ▲ -30°C to 85°C (Base) ▲ -40°C to 105°C (AEC-Q100)Functions in Arctic field ops or desert vehicle systemsAdvanced version demands rigorous thermal testing (+30% R&D time)
Pin Count/ConnectivityRobotics, Smart Factories50 pins (Industry) ▲ 60 pins (Base) ▲ 70 pins (supports 10+ peripherals)Enables complex multi-sensor setups in automated assembly linesLarger footprint increases PCB design complexity (requires 20% more space)
CertificationsMedical Devices, AutomotiveISO 9001 (Industry) ▲ MIL-STD-810G (Base) ▲ AEC-Q100 + ISO 13485 (Advanced)Meets FDA and automotive safety mandates for critical systemsAdvanced certification adds 6 months to production timeline

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