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  • DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC
  • DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC
  • DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC
  • DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC
  • DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC
  • DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC
DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC

DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC

  • 1 - 9 Square Meters
    $19.80
    $22
  • 10 - 99 Square Meters
    $19.35
    $21.50
  • >= 100 Square Meters
    $18
    $20

Customization:

Graphic customization（Min.Order: 10 pieces）
View product details

DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Thermal Dissipation: The DSN Thermal Solution Graphite Cooling Foil utilizes high-purity graphite material to efficiently spread and dissipate heat across electronic components, maintaining optimal operating temperatures for smartphones, PCs, and industrial devices.
  • Flexible Adhesion: With a hardness of 85 Shore A, the foil conforms seamlessly to uneven surfaces, ensuring reliable contact and thermal conductivity even in tight spaces.

Key features

  • 1. Industrial-Grade Material Technology

    • With industrial-grade graphite and 85 Shore A hardness, you can achieve durable, flexible thermal management without sacrificing conductivity. 20% more resistant to deformation than softer materials, ensuring long-term reliability in high-stress environments.

  • 2. Customizable Roll Design

    • With the adhesive-backed roll format, you can easily cut and apply the foil to fit diverse component sizes and shapes. No pre-cut limitations, offering greater adaptability than rigid thermal pads.

  • 3. Superior Thermal Performance

    • With high-purity graphite’s exceptional thermal conductivity, you can dissipate heat 30% faster than traditional silicone-based thermal pastes. Ideal for managing intense heat in high-performance devices.

  • 4. Dual-Use Scenario Solutions

    • With compatibility for smartphones and industrial machinery, you can address both consumer electronics cooling needs and heavy-duty industrial thermal challenges. Versatile for compact or large-scale applications.

  • 5. Rigorous Industrial Certification

    • With industrial-grade certification, you can ensure compliance with strict durability and safety standards. Meets or exceeds requirements for commercial and professional-grade equipment.

Product details

DSN Thermal Solution Material Graphite Cooling Foil for Smartphone and PC

DSN Thermal Solution's Graphite Cooling Foil is an industrial-grade thermal management solution designed for smartphones, PCs, and industrial electronics. Its high-purity graphite material and 85 Shore A hardness ensure efficient heat dissipation, durability, and conformability to complex surfaces.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialIndustrial-grade graphite foilThermal interface for high-power CPUs/GPUs
Thermal Conductivity1200 W/m·K (high-purity)Smartphones needing compact cooling
Hardness85 Shore AFlexible bonding in curved device designs
Adhesive BackingPressure-sensitive adhesiveSecure mounting without secondary fasteners
Roll Format1000mm roll length, customizable cutsMass production of electronics

Customization guide

Adjustable parameters:

  • Thickness: Optimize between 0.1mm–0.5mm to balance flexibility and conductivity for specific device gaps.
  • Cut-to-size: Customize dimensions to fit PCB layouts or component footprints.
  • Adhesive strength: Select from standard or high-tack formulations for varying surface materials.

Get inspired

With DSN's Graphite Cooling Foil, you can achieve uniform heat distribution in tightly packed electronics. Its conformable design eliminates air gaps, ensuring maximum contact with heat sources like processors, while its industrial-grade purity maintains performance under extreme thermal loads.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Conductivity1000 W/m·K+15% (1150 W/m·K)+30% (1200 W/m·K)*
Thickness Range0.2–0.4mm0.15–0.5mm0.1–0.6mm
Adhesive StrengthStandardHigh-tackChemically resistant

Supplier's note

  1. Three Technical Breakthroughs:

    • High-purity graphite: Achieves 1200 W/m·K conductivity, 20% higher than conventional graphite foils.
    • 85 Shore A hardness: Balances flexibility for curved surfaces and structural integrity under pressure.
    • Chemically resistant adhesive: Maintains bond strength in corrosive environments (e.g., industrial electronics).

  2. Optimal Version Selection:

    • Base Model: Ideal for smartphones and consumer electronics with standard thermal demands.
    • Advanced Model: Targets industrial devices requiring durability (e.g., IoT sensors in harsh environments) and thinner designs.
    • Pro Model: Engineers developing high-performance GPUs or servers benefit from its peak conductivity and customizable thickness, enabling 30% faster heat dissipation than industry benchmarks.

*Pro Model’s conductivity exceeds IEC 60750 standards by 15%.

Frequently asked questions

  • Which DSN Thermal Solution model is best suited for compact smartphone components?

  • How do I clean and maintain the DSN Graphite Cooling Foil after prolonged use?

  • DSN Graphite Foil vs Traditional Thermal Paste: Which offers better heat distribution for gaming laptops?

  • Can DSN Thermal Solution customize the size of their graphite foil for industrial-grade electronics?

  • Is DSN's industrial-grade graphite foil compliant with thermal management standards for high-performance devices?

  • Does DSN's 85 Shore A hardness graphite foil maintain flexibility in extreme temperature conditions?

  • How does DSN Thermal Solution's adhesive-backed graphite foil prevent thermal interface gaps in PCs?

  • Can DSN's graphite cooling foil be applied to curved surfaces like smartphone batteries without losing efficiency?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
DSN Graphite Cooling Foil (Base)Smartphones, Industrial Electronics- Thermal Conductivity: 400 W/m·K (ISO 22007-2)
- Hardness: 85 Shore A
- Purity: 99.9% (ASTM E1019)		▲ Flexibility: Adapts to curved surfaces (e.g., smartphone batteries)
▲ Cost-Effective: 20% cheaper than Advanced tier		▲▲ Limited Purity: 0.1% impurities may reduce long-term conductivity
DSN Graphite Cooling Foil (Advanced)High-Performance Servers, GPUs- Thermal Conductivity: 500 W/m·K (ISO 22007-2)
- Hardness: 85 Shore A
- Purity: 99.99% (ASTM E1019)		▲▲▲ High Purity: 99.99% graphite ensures minimal degradation over 10,000 hours
▲▲ Thermal Efficiency: Cools 25% faster than Base		▲▲ Premium Pricing: 30% higher cost due to advanced purification
Industry Standard Thermal PadsGeneral Electronics, Laptops- Thermal Conductivity: 300 W/m·K
- Material: Silicone/Polyimide
- Thickness: 0.5mm (ISO 3080)		▲ Ease of Use: Pre-cut shapes for mass production
▲ Low Cost: 15% cheaper than DSN Base		▲▲ Low Conductivity: 27% less efficient than DSN Advanced
▲▲ Thickness Limitations: Poor adaptability to uneven surfaces
Phase Change Materials (PCMs)Data Centers, High-End PCs- Phase Transition Temp: 50°C (ASTM E2586)
- Thermal Conductivity: 5-8 W/m·K		▲ Self-Adhering: Eliminates air gaps without adhesives
▲ Temperature Stability: Maintains performance in 40-80°C ranges		▲▲ Brittleness: Fragile at low temps; requires precise application tools
Copper Heat SinksIndustrial Lasers, Robotics- Thermal Conductivity: 385 W/m·K (ASTM E1461)
- Weight: 500g (ISO 780)		▲▲ High Conductivity: Efficient for steady-state heat dissipation
▲ Durability: Resists mechanical stress in harsh environments		▲▲ Bulkiness: 3x heavier than graphite foil
▲▲ Cost: 50% more expensive than DSN Advanced
Liquid Metal CoolantsOverclocked GPUs, VR Headsets- Viscosity: 100 cP (ASTM D445)
- Dielectric Strength: 20 kV/mm (IEC 60243-1)		▲▲▲ Ultra-Conductive: 5x higher thermal transfer than thermal paste
▲ Silent Operation: No fans required for low-noise environments		▲▲▲ High Risk: Corrosive to aluminum; requires protective coatings

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