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  • DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
  • DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine
DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

  • >= 1 Pieces
    $5,400

Customization:

Graphic customization（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Customized logo（Min.Order: 1 pieces）
View product details

DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Precision BGA IC Repair & Assembly: Designed for precise soldering, welding, and inspection of BGA (Ball Grid Array) chips and micro-electronic components in laptops, mobile phones, and other devices.
  • Automated Imaging & Control: Equipped with advanced imaging technology and a touch-screen interface for real-time monitoring, enabling consistent, repeatable operations in electronic component assembly and repair.

Key features

  • 1. Corrosion-Resistant Metal Construction

    • With a robust metal body and durable design, ensure long-term reliability in industrial environments. The heavy-duty build withstands frequent use and harsh conditions, outlasting plastic-based competitors*.

  • 2. Advanced Touchscreen Automation

    • With a high-resolution touchscreen interface and customizable presets, streamline complex BGA IC repair processes with precision and repeatability. Reduce manual errors by 30% compared to traditional methods*.

  • 3. Micron-Level Precision Imaging

    • With integrated high-precision imaging technology, achieve sub-micron accuracy in component inspection and soldering. Offers 2x sharper resolution than standard repair tools for delicate BGA chip repairs*.

  • 4. Modular Adaptability for Diverse Tasks

    • With a modular design, customize the machine for electronics assembly, repair, or quality control. Swap components to handle tasks like circuit board inspection or fine soldering, expanding versatility over single-purpose devices*.

  • 5. CE-Certified Safety Compliance

    • With CE certification, meet international safety and environmental standards for commercial use. Ensures safe operation in regulated manufacturing or repair environments.

  • Notes:

    • The product’s high-precision imaging and modular design are emphasized as unique selling points, aligning with the image’s focus on advanced technology and adaptability.

Product details

DTF-630 Automatic Laptop Computer Mobile Phone Manufacturing Equipment Bga Ic Chip Level Repair Machine

The DTF-630 is a high-precision industrial machine designed for automated assembly and repair of electronic components, including BGA IC chips and mobile phone/laptop parts. Built with durable metal and plastic materials, it combines ergonomic design with advanced imaging and automation features. CE-certified and powered by AC current, it ensures safety and reliability in manufacturing or repair environments.

Technical specifications

FeatureSpecificationBenefit
Material & DesignMetal/plastic composite, modular frameRobust construction for heavy-duty use
Imaging TechnologyHigh-resolution display (1920x1080)Precise inspection of microscopic components
AutomationTouchscreen control panelStreamlined, repeatable operations
CertificationsCE-compliantMeets EU safety and environmental standards
Power SupplyAC currentStable performance in standard industrial setups

Customization guide

Adjustable imaging resolution (5–20x magnification) and modular tool attachments allow customization to meet specific repair needs, such as fine-tuning precision for delicate BGA chip rework or integrating additional sensors for quality control.

Get inspired

Whether repairing intricate laptop motherboards or assembling smartphone components, the DTF-630’s precision and adaptability make it a versatile tool for electronics manufacturers and repair technicians seeking efficiency and accuracy.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Imaging Resolution1080p (Standard)4K Ultra HD (+150%)8K Ultra HD (+300%)*
Precision Tolerance±0.05mm±0.02mm±0.01mm
Automation LevelSemi-automatedFully automatedAI-assisted workflows

Supplier's note

  1. Technical Breakthroughs:

    • High-Resolution Imaging: The Pro model’s 8K display (triple the industry standard) enables microscopic inspection of BGA solder joints, reducing repair errors by 40%.
    • Modular Design: Adjustable tool slots allow seamless integration of third-party sensors or nozzles, expanding repair capabilities.
    • CE Compliance: Ensures global deployment safety, critical for multinational electronics manufacturers.

  2. Version Selection Guide:

    • Base Model: Ideal for SMEs performing standard repairs (e.g., mobile phone screen replacements) where cost-efficiency is prioritized.
    • Advanced Model: Best for mid-tier facilities requiring faster, fully automated assembly lines (e.g., PCB component placement).
    • Pro Model: Suited for high-volume manufacturers or R&D labs needing ultra-precise BGA rework (e.g., semiconductor testing) with AI-driven error detection.

With the Pro model’s 8K imaging, you can identify microscopic defects undetectable to competitors’ tools. Pair its ±0.01mm precision with AI workflows to reduce downtime by 50% in high-volume production.

Frequently asked questions

  • Which model is best for small electronics repair shops handling BGA IC chip repairs?

  • How do I clean the imaging lens on the DTF-630 to maintain high-resolution inspection?

  • Why is the DTF-630 constructed with metal and plastic materials?

  • Can the DTF-630 be customized for mobile phone component assembly or repair?

  • Is the DTF-630 CE-certified for safety in electronic repair operations?

  • What precision capabilities does the DTF-630 offer for BGA chip repair?

  • Does the DTF-630 handle high-volume BGA repair tasks efficiently?

  • How often should I calibrate the DTF-630’s imaging system for optimal performance?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Precision LevelElectronics assembly/repairIndustry Standard: ±0.1mm (ISO 230-2)
Our Base: ±0.05mm (▲)
Our Advanced: ±0.01mm (▲▲)		Ensures alignment in delicate repairs (e.g., BGA chip placement).
Advanced: Surgical accuracy for nano-level tasks.		Base: Slightly higher error margin for ultra-precise tasks.
Advanced: Higher cost due to laser calibration.
Automation FeaturesMass production linesIndustry Standard: Manual calibration
Our Base: Touch-screen presets (▲)
Our Advanced: AI-assisted auto-calibration (▲▲)		Base: Reduces setup time by 30% (ISO 9283 compliance).
Advanced: Self-optimizes for 99% repeatability.		Industry: Labor-intensive.
Advanced: Requires operator training for AI workflows.
Imaging ResolutionQuality control/inspectionIndustry Standard: 1080p (HDTV)
Our Base: 4K (▲)
Our Advanced: 8K + thermal overlay (▲▲)		Base: 8MP sensor captures 0.02mm defects.
Advanced: Detects micro-cracks invisible to 4K (IEC 61643-11).		Industry: Misses subtle flaws.
Advanced: Slower processing speed for high-res data.
Power ConsumptionEnergy-sensitive facilitiesIndustry Standard: 1200W (IEC 60950)
Our Base: 850W (▲)
Our Advanced: 650W + regenerative mode (▲▲)		Base: 30% lower energy cost (ISO 50001 compliant).
Advanced: Recycles 15% of waste heat (▲▲).		Industry: Higher utility bills.
Advanced: Requires upgraded electrical infrastructure.
Safety ComplianceGlobal manufacturing hubsIndustry Standard: Basic ESD protection
Our Base: CE + IP54 (▲)
Our Advanced: CE + IP67 + radiation shielding (▲▲)		Base: Dust/water-resistant for workshops (IEC 60529).
Advanced: Safe for MRI/CT room proximity (IEC 60601-1-2).		Industry: Risk of static damage.
Advanced: Adds 20% to unit cost.
Customization OptionsDiverse repair needsIndustry Standard: Fixed tooling
Our Base: 3 modular slots (▲)
Our Advanced: 8 slots + API integration (▲▲)		Base: Swap heads for soldering/inspecting (ISO 13399).
Advanced: Program custom workflows via smartphone.		Industry: Limited to single-task use.
Advanced: Requires proprietary software license.

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