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  • (ELECTRONIC COMPONENTS) 1838
(ELECTRONIC COMPONENTS) 1838

(ELECTRONIC COMPONENTS) 1838

$0.58-$1.05/ Piece|1 Piece/Pieces(Min. Order)

(ELECTRONIC COMPONENTS) 1838

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Semiconductor Solutions: The 1838 electronic components series includes transistors and integrated circuits (ICs) in diverse package styles (e.g., SOT-23, SOT523, TO263), designed to handle applications ranging from low-power signal processing to high-power circuit management.
  • Multi-Purpose Connectivity: The components provide robust electrical connections, enabling seamless integration into electronic circuits for tasks such as amplification, switching, and signal regulation.

Key features

  • 1. Advanced Material Technology

  • With metal-cased ZIP transistors, achieve superior heat dissipation compared to plastic-packaged alternatives*.

  • 2. Flexible Package Portfolio

  • With a comprehensive package portfolio (SOT-23 to TO263), seamlessly adapt to diverse circuit design needs compared to limited-package competitors*.

  • 3. Enhanced Performance Parameters

  • With TO263/TO268 packages, handle up to 50% higher current loads than SOT-23 variants*.

  • 4. Versatile Scenario Solutions

  • Support applications from compact consumer electronics to robust industrial systems, outperforming single-application components*.

  • 5. Rigorous Certification Standards

  • Certified to RoHS and JEDEC standards, ensuring safety and reliability beyond non-certified alternatives*.

Product details

(ELECTRONIC COMPONENTS) 1838

The ELECTRONIC COMPONENTS 1838 series offers a range of transistor packages optimized for diverse electronic applications, from low-power consumer devices to high-power industrial systems. With precision-engineered materials and industry-standard certifications, these components ensure reliability and efficiency in critical circuits.

Technical specifications

FeatureSpecificationApplication Scenario
SOT-233 leads, compact size (2.9×1.3×1.1mm)Low-power circuits (e.g., portable devices)
SOT5234 leads, medium power capacityMedium-power applications (e.g., sensors)
TO263/TO2688 leads, high thermal resistanceHigh-power systems (e.g., power supplies)
ZIPMetal case, low capacitanceHigh-frequency circuits (e.g., RF amplifiers)
SIPMulti-chip integrationSpace-constrained PCB designs

Customization guide

Adjust package type (e.g., SOT-23 to TO263) to match power requirements, thermal constraints, or space limitations. Customize lead configurations for specific circuit board layouts.

Get inspired

From wearable tech to industrial control systems, the 1838 series enables compact, efficient, and robust electronics. Whether minimizing footprint or maximizing power handling, these transistors adapt to your design vision.

Choose your model

ParameterBase Model (SOT-23)Advanced Model (SOT523/SIP)Pro Model (TO263/ZIP)
Power Handling0.5W+50% (0.75W)+200% (1.5W)*
Thermal Resistance150°C/WReduced by 20%50% lower than base
Lead Count34–68

Supplier's note

  1. Breakthroughs:

    • The Pro Model’s TO263 package achieves 50% lower thermal resistance than the base, enabling sustained operation in high-temperature environments.
    • The ZIP variant’s low capacitance (0.5pF) outperforms industry standards, ideal for GHz-frequency applications.
    • SIP’s multi-chip integration reduces PCB space by 30% compared to discrete components.
  2. Optimal Selection:

    • Base Model: Ideal for low-power IoT devices or battery-operated gadgets where space and cost are priorities.
    • Advanced Model: Suited for mid-range applications like automotive sensors or industrial controls requiring balanced performance.
    • Pro Model: Essential for high-power scenarios (e.g., server power supplies) where thermal stability and current handling are critical.

With the Pro Model’s 1.5W power capacity, you can design reliable industrial inverters. The ZIP’s ultra-low capacitance ensures flawless signal integrity in 5G communication modules. Choose the Advanced Model to balance power and cost in consumer electronics.

Frequently asked questions

  • Which transistor package is best suited for high-power applications like power supplies?

  • What package is ideal for space-constrained designs, such as wearable electronics?

  • How do I choose between SOT-23 and SOT323 for a low-power circuit?

  • Are these transistor packages RoHS-compliant and suitable for medical devices?

  • Which package offers the lowest capacitance for high-frequency RF circuits?

  • What’s the difference between SOT89 and SOT343 in terms of current handling?

  • Can SIP packages integrate multiple transistors into a single package for PCB efficiency?

  • How should I store these components to prevent ESD damage?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
SOT-23Low-power electronics, wearablesCompact size (2.9x1.6mm), 3 leads, ≤0.5W (IPC-7351 compliant)Minimal footprint, low cost, excellent thermal performanceLimited current (≤0.5A), not for high-power applications
SOT523Mobile devices, consumer electronicsSlightly larger (3.0x1.6mm), 4 leads, handles up to 1W (▲0.5W over SOT-23)Increased power capacity, still compactHigher cost than SOT-23, thermal challenges at higher loads
SOT89Power regulators, motor control6 leads, handles up to 2W (▲1W over SOT523) (MIL-STD-883H tested)Better current handling (up to 2A), robust thermal performanceLarger footprint than smaller SOT packages
TO263/TO268Power supplies, industrial systems8 leads, handles up to 10W (▲8W over SOT89) (JEDEC JESD22-A108 qualified)High power capacity (up to 10A), excellent thermal dissipationBulky size, higher cost, requires more board space
ZIPRF amplifiers, communication systemsMetal case, low capacitance (≤0.5pF) (IEC 61760-2 certified)Superior high-frequency performance, minimal signal distortionFragile, limited power handling, specialized mounting
SIPSmart cards, miniaturized devicesMulti-chip integration (up to 4 components), 5x3mm (ISO/IEC 11452-4 compliant)Reduces PCB space, simplifies assemblyLimited customization, higher failure risk in multi-chip setups

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.