(ELECTRONIC COMPONENTS) 3P4J

Name: (ELECTRONIC COMPONENTS) 3P4J
Brand: Shenzhen Winsome Electronic Technology Co., Ltd
SKU: 1600981107129_1
Price: 0.56 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

Integrated Circuit Design: The 3P4J IC is engineered for high-performance electronic applications, using a QFN package for efficient space utilization and enhanced thermal management.
Surface Mount Technology: Designed for SMT, it facilitates high-density PCB layouts, crucial for modern electronic devices.

Key features

1. Advanced Material Technology

With a ceramic or plastic body, these integrated circuits provide excellent electrical insulation and mechanical support for reliable performance.

2. Enhanced Interactive Design

With a compact QFN package, you can achieve high-density PCB layouts, ideal for modern electronic devices requiring efficient space utilization.

3. Superior Performance Parameters

With a 20-pin configuration, these components offer a balanced pin count and board space, suitable for a wide range of applications.

4. Optimal Scenario Solutions

With a design suited for high-density PCBs, you can integrate multiple components in space-constrained devices like smartphones and laptops.

5. Robust Thermal Management

With improved thermal performance over traditional leaded packages, these ICs ensure better heat dissipation in demanding applications.

Product details

The 3P4J model represents a cutting-edge integrated circuit (IC) designed for high-density PCB layouts. Its compact QFN package ensures superior thermal performance and space efficiency, making it an ideal choice for modern electronic devices.

Technical specifications

Feature	Specification	Benefit
Package Type	Quad Flat No-Lead (QFN)	Ideal for space-constrained applications
Pin Count	20	Balance between pin count and board space
Material	Plastic/Ceramic	Provides electrical insulation and support
Mounting Style	Surface Mount Technology (SMT)	Facilitates high-density PCB layouts

Customization guide

Adjustable parameters such as pin configuration can be customized to meet specific application needs, ensuring optimal performance in diverse electronic environments.

Get inspired

With the 3P4J IC, you can efficiently manage space while enhancing thermal performance in your electronic designs. Ideal for portable devices where every millimeter counts.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Thermal Performance	Standard	+15%	+30%*
Pin Configuration	20 Pins	Enhanced	Premium

Supplier's note

The Pro version's thermal performance rating, which is 30% above industry standards, allows for safe operation in high-temperature environments. When paired with its compact size, this creates a reliable solution for space-critical applications. The Advanced Model's enhanced pin configuration offers flexibility for more complex circuit designs, making it ideal for tech-savvy users who require adaptability in their projects.

Frequently asked questions

Which model of electronic components suits high-density PCB layouts?
How to ensure proper maintenance and care for QFN packaged ICs?
What are the advantages of using a QFN package for electronic components?
Can I get custom configurations for the 3P4J IC?
Is the material used in the 3P4J IC package FDA-approved?
How do I choose the right electronic component for my application?
What makes the 3P4J IC stand out in terms of design?
How does the 3P4J IC improve thermal performance in electronic devices?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Silent Operation	Open-plan offices	0.5dB Noise Reduction (quieter than whisper)	Enhances focus and reduces distractions	May not be necessary in isolated rooms
Chemical-Resistant	Industrial environments	Withstands 50+ chemical exposures (ASTM D543)	Durable in harsh chemical settings	Higher cost compared to standard materials
Medium Weight	Portable electronics	285 GSM verified via ISO 3801	Easy to carry and handle	May be less durable than heavier models
High-Density PCBs	Space-constrained devices	Compact QFN package (20-pin configuration)	Ideal for smartphones and laptops	Challenging for manual soldering
Thermal Performance	High-heat applications	Enhanced heat dissipation (QFN design advantage)	Prolongs component lifespan	Requires additional thermal management
Surface Mount Tech	Modern electronics assembly	SMT for high-density layouts	Streamlines manufacturing processes	Requires precise manufacturing equipment

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