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  • EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic
  • EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic
  • EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic
  • EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic
  • EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic
  • EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic
EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic

EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic

$428.75-$2143.75/ Piece|10 Piece/Pieces(Min. Order)
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EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Programmable Logic Design: Enables customizable digital circuit configurations for FPGA-based solutions, supporting applications such as data processing, communication interfaces, and embedded control systems.
  • High-Performance Computing: Integrates reconfigurable logic and a central processing unit (CPU) for versatile electrical functionality, including real-time data handling and device communication.

Key features

  • 1. Advanced Material Technology

    • With a corrosion-resistant fiberglass-epoxy PCB base, ensure durable and stable operation in harsh industrial environments. The green PCB material provides superior thermal conductivity compared to standard plastic substrates*, enabling efficient heat dissipation.

  • 2. Programmable Architecture for Custom Solutions

    • With a reconfigurable FPGA (Field-Programmable Gate Array) design, create multi-functional circuits tailored to specific applications. Unlike fixed-function chips, this allows dynamic adjustments for evolving project needs*.

  • 3. High-Performance Thermal Management

    • With a PCB engineered for enhanced thermal conductivity, maintain stable performance under continuous operation. This ensures reliability in high-demand scenarios like real-time data processing or embedded systems*.

  • 4. Versatile Scenario Adaptability

    • Designed for diverse applications—from telecommunications to industrial automation—this chip integrates seamlessly into custom systems. Its modular design outperforms general-purpose ICs in specialized use cases*.

  • 5. Compliance with Industry Standards

    • Certified to meet quality and safety standards for electronic components, ensuring compatibility with global manufacturing protocols. This guarantees reliable performance in regulated industries*.

Product details

EP3C40F780C6N EP3C40F780C6 Programmable Gate Array EP3C40F780C6 Chip ic

The EP3C40F780C6 Programmable Gate Array chip is a high-performance FPGA designed for versatile integration into electronic systems. Built on a durable fiberglass-epoxy PCB, it combines robust thermal management with customizable logic elements to meet diverse application needs.

Technical specifications

FeatureSpecificationApplication Scenario
Material CompositionFiberglass-epoxy composite PCBHigh-reliability electronics requiring thermal stability
Logic Elements (LE)36K LE (Base Model)Embedded systems, IoT devices, and control systems
I/O Pins180 (Base Model)Connectivity in compact circuit designs
Package TypeFBGA (Fine-pitch Ball Grid Array)High-density packaging for space-constrained devices
Compliance StandardsRoHS, CE, Industrial GradeGlobal manufacturing compliance and ruggedized use cases

Customization guide

Adjust the central component (e.g., CPU, memory controller) to meet specific application needs such as IoT devices or industrial control systems. Solder pad configurations can be tailored for seamless integration into custom circuit boards.

Get inspired

Explore the versatility of our programmable gate arrays. With customizable logic elements and robust thermal management, these chips empower innovation in embedded systems, communication devices, and more.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Logic Elements36K LE41K LE (+15%)46.8K LE (+30%)
Memory Density3.3Mb3.8Mb (+15%)4.3Mb (+30%)
I/O Pins180207 (+15%)234 (+30%)
Thermal Dissipation2.5W2.8W (+12%)3.2W (+28%)

Supplier's note

  1. Technical Breakthroughs:

    • Thermal Efficiency: The fiberglass-epoxy PCB ensures 20% better heat dissipation than traditional FR4 materials, enabling stable operation in high-temperature environments.
    • Compact Packaging: FBGA reduces footprint by 15% compared to QFP packages, ideal for wearable and portable devices.
    • Custom Logic Scaling: Adjustable logic elements allow users to optimize resource allocation for specific workloads.

  2. Version Selection Guide:

    • Base Model: Suitable for basic FPGA applications (e.g., sensor interfaces) where cost efficiency is prioritized.
    • Advanced Model: Ideal for complex designs requiring enhanced I/O (e.g., industrial automation) with 15% more memory and logic.
    • Pro Model: Targets high-performance systems (e.g., AI edge computing) with 46.8K LE—30% higher than the Base—ensuring scalability for advanced algorithms.

With the Pro Model’s triple-industry-standard thermal rating, you can deploy in harsh environments while maintaining reliability. Pair its dense logic elements with FBGA packaging to achieve compact, high-performance solutions.

Frequently asked questions

  • Which programmable gate array suits small-scale electronics projects?

  • How to store EP3C40F780C6 chips to prevent damage?

  • What materials make the EP3C40F780C6N PCB superior to standard boards?

  • Can the EP3C40F780C6N’s central component be customized?

  • Is the EP3C40F780C6N compliant with industry standards?

  • What applications are best suited for the EP3C40F780C6N?

  • Does the EP3C40F780C6N handle high-temperature environments?

  • Can the EP3C40F780C6N integrate with legacy systems?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
FPGA (EP3C40F780C6N)Prototyping, reconfigurable systems10,000 logic cells (JEDEC JESD99)
200+ I/O pins (IEC 60793)
5W power (ISO 17772)		Fully reprogrammable (▲ vs Industry Standard)
Dynamic reconfiguration		Higher power consumption (▲ vs MCU)
Higher cost per unit
ASICHigh-volume consumer electronicsCustom-designed architecture
1W power (ISO 17772)
10nm process (SEMATECH)		Lower power (▲ vs FPGA)
Cost-effective at scale		Non-reconfigurable
Long design cycles
CPLDGlue logic, small-scale control systems1,000 logic cells (JEDEC JESD99)
50 I/O (IEC 60793)
0.5W (ISO 17772)		Low power (▲ vs FPGA)
Simple design		Limited capacity (▲ vs FPGA)
Less flexible for complex applications
MCU (Microcontroller)IoT devices, embedded control32-bit CPU (ARM Cortex-M4)
128KB flash (JEDEC JESD89)
0.1W (ISO 17772)		Ultra-low power (▲ vs FPGA)
Compact form factor		Limited reconfigurability
Lower computational power
DSP (Digital Signal Processor)Audio/video processing, telecom1GHz clock speed (JEDEC JESD99)
8 parallel MAC units (IEEE 1687)		High computational speed (▲ vs MCU)
Efficient signal processing		Specialized use cases
Higher cost compared to general-purpose CPUs
GPUGraphics rendering, AI training2048 cores (NVIDIA CUDA)
320GB/s memory bandwidth (JEDEC JESD207)		Massive parallel processing (▲ vs CPU)
Ideal for AI/ML workloads		High power consumption (▲ vs MCU)
High cost for specialized applications

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.