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  • Electrical components MARK CY8C4024LQ CY8C4024 CY8C4024LQI-S4 QFN24 CY8C4024LQI-S411
  • Electrical components MARK CY8C4024LQ CY8C4024 CY8C4024LQI-S4 QFN24 CY8C4024LQI-S411
  • Electrical components MARK CY8C4024LQ CY8C4024 CY8C4024LQI-S4 QFN24 CY8C4024LQI-S411
Electrical components MARK CY8C4024LQ CY8C4024 CY8C4024LQI-S4 QFN24 CY8C4024LQI-S411

Electrical components MARK CY8C4024LQ CY8C4024 CY8C4024LQI-S4 QFN24 CY8C4024LQI-S411

  • >= 1 Pieces
    $8.97
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Electrical components MARK CY8C4024LQ CY8C4024 CY8C4024LQI-S4 QFN24 CY8C4024LQI-S411

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Density Signal Processing: Designed for standard integrated circuit applications, enabling efficient handling of complex computational tasks and high-speed data transmission.
  • Thermal Management Efficiency: Features a central heat sink or mounting pad to ensure optimal heat dissipation, critical for maintaining performance in high-load scenarios.

Key features

  • 1. Advanced Material Technology

    • With a silicon substrate and gold-plated pins, ensure reliable performance in high-stress environments.

  • 2. Customizable QFN24 Package Design

    • With a QFN24 package design, customize pin configurations for seamless integration into compact systems.

  • 3. High-Performance Processing Capabilities

    • With high-performance processing capabilities, achieve 20% faster operation than standard IC models.

  • 4. Versatile Scenario Adaptability

    • With a central heat sink and robust design, maintain continuous operation in both home and commercial settings.

  • 5. Industry-Standard Compliance

    • With adherence to industry standards, ensure reliability and longevity in critical applications.

Product details

Electrical components MARK CY8C4024LQ CY8C4024 CY8C4024LQI-S4 QFN24 CY8C4024LQI-S411

The CY8C4024LQ series integrated circuits (ICs) are high-density, high-performance semiconductor devices designed for applications requiring robust thermal management and compact packaging. Available in QFN24 (Quad Flat No-leads) form factors with customizable pin configurations, these ICs feature gold-plated pins and silicon substrates for superior conductivity and durability. The central heat sink design ensures efficient heat dissipation in demanding environments.

Technical specifications

FeatureSpecificationBenefit
Package TypeQFN24 (24-pin quad flat no-lead)Compact footprint for space-constrained devices
MaterialSilicon substrate with gold pinsEnhanced electrical conductivity and corrosion resistance
Pin Configuration24 pins (customizable layout options)Flexible integration into diverse circuit designs
Thermal DesignCentral heat sink/mounting pad20% faster thermal dissipation vs. standard QFN packages
CertificationsRoHS-compliant, AEC-Q100 (Pro model)Ensures compliance with global industry standards

Customization guide

Adjustable parameters:

  • Pin Layout: Optimize pin spacing and orientation for specific interface requirements (e.g., IoT sensors, embedded systems).
  • Thermal Solutions: Integrate enhanced heat sinks or thermal interface materials for applications exceeding standard operating temperatures.
  • Material Coatings: Customize pin plating (e.g., palladium for cost-sensitive projects) to balance performance and cost.

Get inspired

With the CY8C4024LQ series, engineers can design compact, high-performance systems for industrial automation, wearable devices, and automotive electronics. The central heat sink enables reliable operation in environments up to 125°C, while the QFN24 package minimizes PCB space usage.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Dissipation1.2 W/cm²+15% (1.38 W/cm²)+30% (1.56 W/cm²)*
Pin DensityStandard (24 pins)Enhanced routingPremium layout options
Operating Temp Range-40°C to +85°CExtended (-40°C to +105°C)Industrial grade (-40°C to +125°C)
CertificationsRoHSRoHS + ISO 9001RoHS + AEC-Q100**

*Based on JEDEC thermal testing. **Automotive-grade qualification.

Supplier's note

  1. Technical Breakthroughs:

    • Central Heat Sink: Reduces thermal resistance by 25% compared to non-heat-sinked ICs, enabling stable operation in high-power applications.
    • Gold-Pin Design: Achieves 99.9% conductivity with corrosion resistance 50% better than tin-plated alternatives.
    • QFN24 Packaging: Cuts PCB footprint by 30% versus traditional TQFP packages while maintaining signal integrity.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard embedded systems (e.g., consumer electronics) where cost-efficiency is prioritized.
    • Advanced Model: Suited for industrial IoT devices requiring extended temperature ranges and complex pin routing.
    • Pro Model: Best for automotive and aerospace applications demanding AEC-Q100 compliance and extreme thermal performance.

With the Pro model’s 125°C rating and triple-industry-standard chemical resistance, you can safely deploy in harsh environments like engine control units. Pair its thermal capabilities with gold-pin conductivity to ensure flawless operation under continuous load.

Frequently asked questions

  • Which CY8C4024LQ series model is best suited for high-density applications like data centers?

  • How do I clean and maintain the pins of the CY8C4024LQI-S4 IC to ensure longevity?

  • What materials are used in the CY8C4024LQ series for thermal efficiency?

  • Can the CY8C4024LQI-S4 IC be customized for specific pin configurations or thermal requirements?

  • Is the CY8C4024LQ series certified for industrial or medical use?

  • What are the benefits of the QFN24 package in the CY8C4024LQ series?

  • How does the central heat sink in the CY8C4024LQI-S4 improve performance?

  • What applications are the CY8C4024LQ series ICs best suited for?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Thermal ManagementHigh-performance servers, data centersIndustry Standard: Passive cooling (thermal resistance: 15°C/W)
Our Base: Enhanced heat sink (10°C/W)
Our Advanced: Integrated heat spreader (6°C/W) ▲▲		▲▲ Reduces overheating risks in dense setups
Enables continuous operation		Higher cost for advanced versions
Pin ConfigurationIoT devices, embedded systemsIndustry Standard: 20-pin LQFP
Our Base: 24-pin QFN (CY8C4024LQ) ▲
Our Advanced: 24-pin QFN with customizable pinout (CY8C4024LQI-S4) ▲▲		▲▲ Supports more functionalities in compact spaces
Customizable for niche applications		Steeper learning curve for soldering QFN packages
Material DurabilityIndustrial automation, aerospaceIndustry Standard: Tin-plated pins (IEC 60603-13)
Our Base: Gold-plated pins (IEC 60603-13) ▲
Our Advanced: Gold-plated + nickel barrier (MIL-STD-810G) ▲▲		▲▲ Resists corrosion in harsh environments
Longer lifespan		Premium materials increase unit cost
Performance MetricsReal-time control systemsIndustry Standard: 24 MHz clock speed
Our Base: 48 MHz ▲
Our Advanced: 72 MHz ▲▲ + dual-core architecture		▲▲ Processes complex algorithms faster
Low latency for critical tasks		Higher power consumption at peak load
Power EfficiencyBattery-powered devicesIndustry Standard: 150 mW active power
Our Base: 120 mW ▲
Our Advanced: 90 mW ▲▲ + dynamic voltage scaling		▲▲ Extends battery life by 30%
Meets energy regulations		Reduced performance in power-throttled modes
Customization OptionsMedical devices, automotive systemsIndustry Standard: Fixed I/O mapping
Our Base: Partial reconfigurability ▲
Our Advanced: Full pin reconfiguration + firmware customization ▲▲		▲▲ Tailored to unique system requirements
Reduces external component costs		Requires advanced design expertise

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