Electrically Conductive Transfer Adhesive Ag/Ni 90dB Silver Conductive Epoxy Adhesive Glue Paste for Communication Equipment

Technical specifications

Customization guide

Adjustable parameters:

• Conductive particle ratio (Ag/Ni) to balance conductivity vs. cost for specialized applications.
• Viscosity (±20%) for spray or brush coating in industrial setups.
• Cure time (via temperature control) to optimize assembly line workflows.

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With its Ag/Ni conductive matrix, this adhesive enables seamless integration into next-gen communication systems. For instance, in wearable medical devices, its thermal stability ensures reliable performance even during prolonged use.

Choose your model

Supplier's note

1. Technical Breakthroughs:

   • Ag/Ni Hybrid Matrix: Achieves 90dB conductivity, outperforming single-metal adhesives in signal clarity.
   • Extreme Temp Tolerance: Pro Model’s -55°C to 200°C range enables aerospace-grade reliability.
   • High Dielectric Strength: Mitigates signal interference in 5G and IoT devices.

2. Version Selection Guide:

   • Base Model: Suitable for standard electronics assembly (e.g., PCB repairs).
   • Advanced Model: Ideal for medical devices requiring -40°C to 150°C stability (e.g., MRI components).
   • Pro Model: For aerospace and defense applications needing peak conductivity and thermal resilience.

Example: With the Pro Model’s 2×10⁴ S/m conductivity, you can ensure flawless signal transmission in high-frequency 5G antennas. Its 12 MPa adhesion strength also safeguards against mechanical stress in satellite systems.