(Electronic Component) BCM2835

Name: (Electronic Component) BCM2835
Brand: Shenzhen Orwintech Electronic Co., Ltd.
SKU: 62124329216_1
Price: 3.00 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Performance Processing: The BCM2835 is a versatile integrated circuit (IC) designed for signal routing, power distribution, and advanced operations such as high-speed processing and data encryption.
Reliable Connectivity: Features uniform solder ball arrangements ensure stable electrical connections, enabling seamless integration into complex circuit boards for optimal functionality.

Key features

1. Material Technology

With lead-free solder and a corrosion-resistant surface finish, ensure environmental compliance and durable connections.

2. Interactive Design

With customizable design patterns, tailor performance for specialized applications.

3. Performance Parameters

With high-speed processing and advanced encryption capabilities, handle complex tasks efficiently.

4. Scenario Solutions

With rugged, adaptable design, operate reliably in both consumer electronics and industrial environments.

5. Certification Standards

With RoHS certification, meet global environmental and safety regulations.

Product details

The BCM2835 is a high-reliability integrated circuit (IC) designed for diverse electronic applications. With a lead-free surface finish and precision-engineered solder balls, it ensures environmental compliance and robust connectivity. Its modular design supports customization for specialized performance requirements, making it ideal for devices ranging from consumer electronics to industrial systems.

Technical specifications

Feature	Specification	Application Scenario
Material	Lead-free, greenish-brown surface finish (RoHS compliant)	Consumer electronics, automotive systems
Solder Balls	Uniform distribution, high-quality construction	High-reliability industrial equipment
Design Patterns	Customizable routing paths and power distribution	IoT devices, specialized circuit boards
Size/Shape	Square form factor (standard IC dimensions)	Compact devices like smartphones or sensors
Thermal Performance	Operates reliably up to 85°C (Base Model)	High-temperature environments

Customization guide

Adjustable parameters include operating frequency (up to 1.3 GHz) and power consumption (0.8–1.5 W), enabling tailored solutions for specific use cases such as low-power IoT devices or high-speed computing modules.

Get inspired

The BCM2835’s modular design and robust solder ball configuration make it a versatile choice for next-gen electronics. Whether you’re building energy-efficient wearables or rugged industrial controllers, this IC delivers the reliability and adaptability needed for modern applications.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Processing Speed	1 GHz	+15% (1.15 GHz)	+30% (1.3 GHz)
Power Efficiency	1.2 W/W	1.0 W/W	0.85 W/W
Thermal Resistance	85°C	95°C	105°C

Supplier's note

Three Technical Breakthroughs:
- Lead-free surface finish: Ensures RoHS compliance and reduces environmental impact.
- Uniform solder ball distribution: Enhances connectivity reliability in vibration-prone environments.
- Advanced semiconductor architecture: Delivers 30% faster processing in Pro models compared to industry benchmarks.
Optimal Version Selection:
- Base Model: Ideal for basic applications like sensors or low-power IoT devices.
- Advanced Model: Suitable for moderate workloads, such as smart home controllers requiring 15% higher efficiency.
- Pro Model: Tailored for high-demand scenarios like industrial automation, where tripled thermal resistance (105°C) ensures stable operation in harsh conditions.

With the Pro Model’s 105°C thermal resistance, you can ensure uninterrupted performance in factory equipment. Pair this with its 1.3 GHz processing speed to handle complex real-time data analytics. For wearable devices, the Base Model’s compact size and low power draw (1.2 W/W) optimize battery life.

Frequently asked questions

Which BCM2835 model is best suited for high-reliability electronic devices like industrial equipment?
How does the lead-free surface finish of the BCM2835 benefit eco-conscious projects?
Can the BCM2835 be customized for specific power requirements or frequencies?
Is the BCM2835 certified for use in medical or automotive electronics?
What makes the BCM2835 suitable for compact electronic devices like smartphones?
How does the BCM2835 ensure reliable connections on circuit boards?
Can the BCM2835’s design patterns be modified for custom functionality?
What technical support is available for integrating BCM2835 into complex systems?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Surface Finish & Material Compliance	Environmental regulations compliance	Industry: Lead-containing (IPC-6012)	Base: Lead-free (RoHS ▲), Advanced: RoHS+REACH (▲▲)	Base meets global RoHS; Advanced adds EU REACH compliance.
		Advanced: Full EU REACH compliance (reduces chemical risks)	Base may not fully comply with regions enforcing REACH.
Solder Ball Count & Distribution	High-density electronics	Industry: 400 balls (IPC-7351 Class 2)	Base: 450 balls (▲12.5% denser)	Advanced: 550 balls (▲▲37.5% denser, IPC-7351 Class 3)
			Advanced supports ultra-high-pin-count applications.	Higher manufacturing costs for Advanced.
Operating Temperature Range	Industrial/automotive environments	Industry: -30°C to 80°C (IEC 60068-2-1)	Base: -40°C to 85°C (▲16% broader)	Advanced: -55°C to 105°C (▲▲75% broader, MIL-STD-810H)
			Base/Advanced reduce downtime in harsh climates.	Advanced may require cooling solutions.
Power Efficiency	Battery-powered IoT devices	Industry: 1.2W typical (JEDEC JESD22-A108)	Base: 1.0W (▲16% savings)	Advanced: 0.8W (▲▲33% savings, IEC 62301)
			Advanced ideal for energy-constrained systems.	Advanced may trade off thermal performance.
Design Pattern Complexity	High-speed data processing	Industry: 4-layer routing (IPC-2221 Class 2)	Base: 6-layer routing (▲50% capacity)	Advanced: 8-layer routing (▲▲100% capacity, IPC-2221 Class 3)
			Advanced enables GHz-range signal integrity.	Requires advanced PCB fabrication tools.
Customization Flexibility	Embedded systems/IoT	Industry: Fixed functions (no reconfiguration)	Base: 30% reconfigurable logic (▲)	Advanced: Fully programmable (▲▲, supports FPGA-like adaptability)
			Advanced enables real-time firmware updates for AIoT.	Advanced requires specialized design expertise.