(Electronic Component) KD501

Name: (Electronic Component) KD501
Brand: Shenzhen Orwintech Electronic Co., Ltd.
SKU: 62354294798_1
Price: 0.10 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Power Handling: Designed to manage high currents and voltages in power electronics, enabling reliable operation in applications like power amplifiers, switching power supplies, and industrial control systems.
Efficient Heat Dissipation: Equipped with aluminum/copper metal heat sinks to regulate thermal performance, ensuring stable functionality even under heavy load conditions.

Key features

1. Advanced Heat Dissipation Technology

With high thermal conductivity aluminum/copper heat sinks, ensure efficient heat dissipation in high-power applications.

2. High-Performance Reliability

With robust high-current and voltage handling capabilities, operate reliably in demanding electronics systems like power amplifiers and industrial equipment.

3. Versatile Scenario Adaptability

Designed for continuous operation in commercial and industrial settings, ensuring stable performance under heavy loads.

4. Customizable Mounting Design

With modular mounting design featuring adjustable screws and mounting holes, easily integrate into diverse electronic systems for tailored applications.

5. Compliance with Industry Standards

Complies with standard industry certifications (e.g., RoHS compliance), ensuring safety and reliability in electronics manufacturing.

Product details

The KD501 electronic component is a high-performance semiconductor device designed for power electronics and high-frequency applications. Mounted on durable metal heat sinks, it combines robust thermal management with customizable mounting options to ensure reliable operation in demanding environments.

Technical specifications

Feature	Specification	Benefit
Material	Aluminum/copper heat sinks, silicon IC	Enhanced thermal conductivity and durability
Heat Dissipation	Metal heat sinks with optimized fins	Reduces operating temperature by 20%
Mounting System	Blue screws and adaptable mounting holes	Easy integration into diverse systems
Application	Standard integrated circuits	Suitable for power amplifiers and supplies

Customization guide

Adjustable parameters include:

Screw type (e.g., stainless steel for corrosive environments)
Mounting hole spacing to fit custom brackets
Heat sink material (aluminum for cost efficiency or copper for premium thermal performance)

Get inspired

With KD501’s robust heat dissipation and flexible mounting, engineers can design reliable power systems for industries like automotive, telecommunications, and industrial automation.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Max Current	20A	+15% (23A)	+30% (26A)*
Thermal Resistance	1.2°C/W	0.9°C/W	0.6°C/W
Mounting Flexibility	Standard holes	Adjustable spacing	Custom hole patterns

Supplier's note

Technical Breakthroughs:
- Heat Sink Design: The Pro model’s copper heat sinks achieve 30% lower thermal resistance than industry standards, enabling safe operation in high-temperature environments.
- Adaptable Mounting: The Advanced model’s adjustable screw spacing allows seamless integration with non-standard brackets.
- Material Choice: Base models use aluminum for cost-effective thermal management, while Pro models leverage copper for extreme performance.
Version Selection Guide:
- Base Model: Ideal for standard applications (e.g., consumer electronics) where cost efficiency is prioritized.
- Advanced Model: Best for moderate-power systems requiring enhanced thermal performance (e.g., industrial control units).
- Pro Model: Tailored for high-power scenarios like electric vehicle inverters, where tripled chemical resistance (vs. industry norms) ensures longevity under harsh conditions.

*Pro Model’s 26A rating exceeds industry benchmarks by 20%.

Frequently asked questions

Which KD501 electronic component model is best suited for high-power applications requiring efficient heat dissipation?
How do I maintain the heat sinks of the KD501 semiconductor components to prevent overheating?
What materials are used in the KD501’s heat sinks, and why are they better than plastic alternatives?
Can the KD501’s mounting screws be customized for different heat sink configurations?
Is the KD501 integrated circuit compliant with industry safety standards for power electronics?
How does the KD501 handle high currents compared to standard transistors without heat sinks?
What applications are the KD501’s cylindrical and flat-base semiconductor designs optimized for?
Can the KD501’s mounting holes be adapted for non-standard electronic systems?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Thermal Performance	High-temperature industrial systems	Operating Temp Range: -40°C to 125°C (▲1 vs Industry -20°C to 100°C)	Ensures reliability in extreme environments (e.g., automotive engines).	Requires additional cooling in very hot climates (e.g., desert operations).
Power Efficiency	Battery-powered devices	Power Consumption: 0.5W (▲2 vs Industry 1.2W)	Extends battery life by 60% (tested in IoT sensors).	May limit peak performance in high-demand scenarios.
Signal Integrity	High-speed data networks	Signal-to-Noise Ratio: 60dB (▲3 vs Industry 45dB)	Reduces data errors by 70% in noisy environments (e.g., industrial machinery).	Requires complex circuit design for optimal performance.
Package Design	Compact electronics	Package Size: 5x5mm (▲1 vs Industry 8x8mm)	Saves 69% PCB space (ideal for wearable devices).	Smaller size may reduce heat dissipation efficiency.
Environmental Resistance	Outdoor equipment	Moisture Resistance: IP67 (▲2 vs Industry IP54)	Waterproof/dustproof for rugged use (e.g., construction tools).	Higher cost due to sealing requirements (+15% material cost).
Compatibility	Multi-vendor systems	Pin Compatibility: 100% with Industry Standard (▲0)	Seamless integration with legacy systems (e.g., legacy PLCs).	No unique features over competitors; relies on standardization.