(Electronic Component) PCM1791A

Name: (Electronic Component) PCM1791A
Brand: Shenzhen Orwintech Electronic Co., Ltd.
SKU: 62352317579_1
Price: 0.10 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

Digital Signal Processing: The 28-pin DIP package with dedicated ground and signal pin configurations ensures optimal signal integrity and power distribution, ideal for standard digital processing tasks.
Surface Mount Technology (SMT): Enables high-density PCB integration and automated manufacturing processes, supporting compact and reliable electronic designs.

Key features

1. Surface Mount Technology (SMT) Design

With surface mount technology (SMT), you can achieve high-density packaging and faster assembly compared to through-hole components*. This enables seamless integration into compact PCB designs while maintaining robust reliability.

2. Optimized 28-Pin DIP Layout

With the organized pin configuration (14 ground pins vs. 14 signal pins), you can simplify circuit design and reduce interference, ensuring precise signal routing for complex applications like digital audio processing or microcontroller systems.

3. Balanced Performance for Versatile Applications

With a moderate pin count and robust silicon-metal construction, you can handle a wide range of signals and power requirements, making it ideal for standard applications in consumer electronics, industrial controls, and embedded systems.

4. Reliability in High-Density Environments

Designed for surface-mount assembly, this IC ensures stable operation in space-constrained PCBs, offering superior mechanical durability compared to legacy through-hole alternatives*.

5. Compliance with Industry Standards

Built to meet standard certifications for electronic components*, this IC guarantees safety and compatibility across diverse applications, from audio devices to industrial automation systems.

Product details

The PCM1791A is a surface-mount integrated circuit (IC) housed in a 28-pin dual in-line package (DIP) with a robust SMT footprint. Designed for high-reliability applications, this IC combines compact form factor with versatile signal handling capabilities, making it ideal for digital circuits, microcontrollers, and embedded systems.

Technical specifications

Feature	Specification	Application Scenario
Surface Mount Tech	SMT-compatible DIP package	High-density PCB assembly for automation
Pin Configuration	28 pins (14+14 rows: 7 ground/7 signal)	Moderate-signal digital circuits
Material Composition	Silicon core with black epoxy coating	Harsh environments requiring durability
Thermal Performance	Operating temp: -40°C to +85°C	Industrial and automotive electronics

Customization guide

Adjustable parameters include pin functionality allocation (e.g., repurposing signal pins for power lines) and thermal interface materials to meet thermal management needs in specialized environments.

Get inspired

The PCM1791A’s balanced design bridges functionality and compactness, enabling engineers to build efficient systems for IoT devices, control units, or communication modules without compromising on performance.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Signal Integrity	Standard (100 MHz)	+15% (115 MHz)*	+30% (130 MHz)*
Thermal Resistance	50°C/W	43°C/W	35°C/W
Power Handling	0.5W	0.75W	1.0W

Supplier's note

Technical Breakthroughs:
- SMT Design: Enables 20% faster PCB assembly compared to through-hole alternatives.
- 28-Pin DIP: Balances pin density and physical size for cost-effective scalability.
- Epoxy Coating: Enhances corrosion resistance by 30% versus uncoated packages.
Version Selection Guide:
- Base Model: Ideal for standard digital applications (e.g., basic control systems) where cost optimization is critical.
- Advanced Model: Targets applications requiring improved thermal performance (e.g., automotive sensors) with moderate power demands.
- Pro Model: Optimized for high-frequency signal processing (e.g., audio codecs) and high-reliability industrial systems. With its 130 MHz bandwidth, it outperforms industry benchmarks by 25% in signal clarity.

*Comparative values vs. traditional DIP packages.

Frequently asked questions

Which 28-pin DIP IC suits audio applications like DACs or digital audio processing?
Is the PCM1791A SMT IC RoHS compliant and suitable for medical devices?
How does the PCM1791A’s SMT package compare to through-hole ICs for space-constrained PCBs?
Can the PCM1791A be customized for specific pin configurations or power ratings?
What applications are best suited for the PCM1791A’s 28-pin DIP architecture?
What considerations are needed when soldering the PCM1791A’s SMT package?
How does the PCM1791A ensure reliability in high-vibration environments?
Is the PCM1791A compatible with standard PCB manufacturing processes?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Pin Count & Packaging	High-density PCBs in consumer electronics	Industry: 18–24 pins (e.g., 16-pin DIP) ▲ Base: 28-pin DIP-SMT (IPC-7351) ▲ Advanced: 40-pin QFP-SMT (IPC-7351)	Enables integration of more functions (e.g., dual-channel signal processing)	Larger packages may limit PCB space in compact devices
Thermal Performance	Automotive/industrial systems	Industry: Tj max 105°C ▲ Base: Tj max 115°C ▲ Advanced: Tj max 125°C (with thermal pad)	Operates reliably in high-temperature environments (e.g., engine control units)	Advanced versions require heatsinks or forced cooling
Material Composition	Harsh environments (chemical exposure)	Industry: Standard epoxy (ASTM D543) ▲ Base: Epoxy + ceramic filler (ASTM D543, 50+ chemical exposures) ▲ Advanced: Hermetic sealing (ASTM B117 salt spray test)	Resists corrosion and chemicals (e.g., oil, solvents)	Advanced materials increase cost by ~30%
Assembly Compatibility	Mass production in automated lines	Industry: Through-hole dominant ▲ Base: SMT with 0.1" pitch ▲ Advanced: Fine-pitch SMT (0.05" pitch)	Reduces assembly costs by 20% (vs through-hole)	Fine-pitch requires advanced pick-and-place machines ($50k+/tool)
Customization Options	OEM-specific applications	Industry: Fixed pinouts ▲ Base: Adjustable pin functions (via firmware) ▲ Advanced: Fully customizable pin assignments (ASIC integration)	Tailored to unique applications (e.g., IoT sensors)	Customization adds 4–6 weeks to lead time
Reliability & Lifespan	Mission-critical systems (aerospace/medical)	Industry: MTBF 100,000 hours ▲ Base: MTBF 150,000 hours ▲ Advanced: MTBF 200,000 hours (per MIL-STD-217)	Minimizes downtime in safety-critical systems	Advanced versions may have longer lead times (12–16 weeks)