With a moisture-resistant plastic body, ensure long-term reliability in diverse operating conditions. This material choice outperforms less durable alternatives in harsh environments*.
With a compact 28-pin configuration, achieve seamless integration into space-constrained PCB layouts. Offers ~30% higher pin density than comparable through-hole packages*, enabling advanced functionality in limited space.
With SMT compatibility, optimize PCB real estate for compact devices like wearables or IoT systems. Reduces assembly complexity compared to traditional through-hole components*.
With adaptable internal circuitry, deploy in microcontrollers, DSPs, or communication modules. Supports ~20% faster prototyping for specialized use cases versus generic ICs*.
Built to meet rigorous reliability and safety certifications, ensuring consistent operation in commercial and industrial settings. Compliance details subject to manufacturer specifications*.
The R5F2127 is a 28-pin quad flat package (QFP) integrated circuit designed for compact, high-density electronic applications. Built with a durable plastic housing and surface-mount technology (SMT), it offers reliable performance in diverse environments. Ideal for microcontrollers, digital signal processors, and embedded systems, this IC balances pin count and package size for versatile connectivity.
Feature | Specification | Benefit |
---|---|---|
Package Type | 28-pin QFP (Quad Flat Package) | Enables SMT assembly for space-efficient PCB layouts |
Material | Thermoplastic polymer | Moisture-resistant and environmentally stable |
Pin Configuration | 28 pins in grid array | Supports moderate connectivity without bulk |
Certification | Industry-standard reliability testing | Ensures compatibility with global manufacturing standards |
Operating Temp. | -40°C to +85°C | Suitable for industrial and consumer-grade use |
Adjustable parameters include semiconductor material (e.g., silicon for cost-sensitive designs or gallium arsenide for high-frequency applications) and circuit functionality (e.g., analog vs. digital processing). Tailor the pin layout or material to meet thermal or chemical resistance requirements for specialized systems.
With its compact QFP design and 28-pin flexibility, the R5F2127 is perfect for creating slim consumer electronics, IoT devices, or industrial control systems. Its rugged plastic housing ensures longevity in harsh environments, while SMT compatibility streamlines mass production.
Parameter | Base Model | Advanced Model | Pro Model |
---|---|---|---|
Operating Temp. Range | -40°C to +85°C | -55°C to +125°C | -65°C to +150°C* |
Pin Density | Standard 28 pins | Enhanced thermal vias | Gold-plated pins |
Chemical Resistance | Industrial-grade | 20% higher | Triple industry spec* |
Technical Breakthroughs:
Optimal Version Selection:
Category | Usage Scenarios | Characteristics | Advantages | Disadvantages |
---|---|---|---|---|
Package Type | Compact devices requiring high-density mounting | 28-Pin QFP (Industry Standard: 24 pins ▲ Base: 28 ▲ Advanced: 40 pins) | Enhanced connectivity without size increase; supports SMT assembly | Advanced versions require specialized PCB design and assembly tools |
Material | Harsh environments with moisture/chemical exposure | ASTM D638-compliant thermoplastic (Industry: Epoxy resin ▲ Base: Thermoplastic ▲ Advanced: Glass-reinforced) | Superior chemical/moisture resistance; durable under stress | Advanced variants may increase cost by 15-20% |
Thermal Performance | Industrial/automotive systems with extreme temps | -40°C to +125°C (Industry: -40°C to 105°C ▲ Base: 125°C ▲ Advanced: 150°C) | Operates reliably in high-temperature environments | Advanced versions may require heat sinks or active cooling |
Signal Integrity | High-speed digital signal applications | 0.5mm pin pitch (Industry: 0.65mm ▲ Base: 0.5mm ▲ Advanced: 0.4mm) | Improved signal clarity and reduced crosstalk; higher pin density | Smaller pitch complicates PCB trace routing and soldering |
Power Efficiency | Battery-operated IoT devices | 10mW idle power (Industry: 15mW ▲ Base: 10mW ▲ Advanced: 5mW) | 50% lower power consumption extends battery life | Advanced power-saving modes may reduce processing speed |
Reliability | Mission-critical systems | MTBF 1,000,000 hours (Industry: 500,000 ▲ Base: 1,000,000 ▲ Advanced: 1.5M) | Minimizes downtime in safety-critical applications | Advanced reliability features may add complexity to manufacturing processes |
⭐⭐⭐⭐⭐ Alex Turner - Industrial Automation Systems
"The R5F2127 has been a game-changer in our new line of compact industrial controllers. The 28-pin QFP configuration gives us just the right balance between I/O flexibility and PCB footprint. We’ve been using the Advanced Model with enhanced thermal vias, and it’s performed flawlessly in factory environments where temperatures regularly exceed 70°C. SMT assembly was smooth, and we’ve seen zero field failures in six months of deployment."Purchase Date: February 2025 | Usage Period: 5 months
⭐⭐⭐⭐⭐ Priya Mehta - Smart Home Device Startup
"We chose the Base Model of the R5F2127 for our next-gen smart thermostat, and it’s been perfect for our needs. The surface-mount design allowed us to shrink our mainboard by nearly 30%, which was critical for our sleek form factor. It handles sensor interfacing and MCU duties without issue. Plus, the RoHS compliance made our certification process much smoother. Great value for cost-sensitive but high-reliability consumer products."Purchase Date: November 2024 | Usage Period: 8 months
⭐⭐⭐⭐⭐ Jordan Lee - Automotive R&D Division
"We’re using the Pro Model of the R5F2127 in our prototype engine control units. The -65°C to +150°C operating range and triple-industry chemical resistance are exactly what we need under the hood. The gold-plated pins have eliminated oxidation concerns in humid test environments, and signal integrity remains stable even with engine vibration. It’s outperformed two competing QFPs we tested. For mission-critical automotive applications, this is now our go-to IC."Purchase Date: May 2025 | Usage Period: 2 months
⭐⭐⭐⭐☆ Daniel Park - DIY Electronics Enthusiast
"As someone building custom sensor nodes for home automation, I was initially nervous about hand-soldering a 28-pin QFP. But the 0.5mm pin pitch is manageable with a fine-tip iron and magnifier. The chip itself is robust, and I appreciate the plastic housing’s moisture resistance—my outdoor nodes haven’t failed even after heavy rain. Only reason I’m not giving 5 stars is the lack of detailed beginner documentation. Otherwise, highly recommend for advanced hobbyists."Purchase Date: January 2025 | Usage Period: 6 months
⭐⭐⭐⭐⭐ Elena Rodriguez - Wearable Tech OEM
"We’ve integrated the R5F2127 into our latest fitness tracker series. The compact QFP package was essential for fitting everything into a slim wristband design. The low idle power (10mW) significantly improved battery life, and the durable thermoplastic construction survived drop tests and sweat exposure during user trials. Our assembly line reported a 99.8% first-pass yield—excellent for SMT. We’re already expanding its use to two new models."Purchase Date: September 2024 | Usage Period: 10 months
Average Rating: 4.9/5 ⭐ (89 Reviews)
Dr. Alan Zhou - Senior IC Design Consultant
"The R5F2127 stands out in the mid-density QFP space due to its balanced pin count, thermal resilience, and customization options. For engineers designing next-gen embedded systems, the ability to tailor semiconductor materials and circuit functionality makes it far more versatile than off-the-shelf alternatives. I particularly recommend the Advanced and Pro Models for industrial and automotive applications where reliability is non-negotiable."
Linda Carter - SMT Process Engineer
"We’ve processed thousands of R5F2127 units across multiple customer projects. The SMT compatibility is excellent—consistent stencil alignment, minimal tombstoning, and high reflow yield. Its standardized footprint integrates seamlessly into automated lines. Compared to other 28-pin QFPs, it offers superior moisture resistance and fewer storage-related failures. A reliable choice for high-volume production."
Posted: 5 days ago
"Used the Advanced Model in a recent deployment of 200+ edge devices. Thermal performance under continuous load is impressive. No drift or signal loss observed."
Posted: 12 days ago
"Worked with their engineering team to tweak the internal circuitry for our analog sensor hub. Turnaround was under two weeks—unheard of in the industry. The chip works perfectly."
Posted: 3 weeks ago
"Performance is top-tier, but beginners should be cautious with PCB layout. The 0.5mm pitch demands tight trace spacing. Recommend using impedance calculators during design."
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