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  • (Electronic Component) STM32F107
(Electronic Component) STM32F107

(Electronic Component) STM32F107

$0.10-$0.49/ Piece|50 Piece/Pieces(Min. Order)

(Electronic Component) STM32F107

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Processing: The STM32F107 integrated circuit (IC) chip is designed to handle complex computational tasks and data processing, leveraging its 80-pin QFP package for high bandwidth and robust connectivity.
  • Embedded System Control: Optimized for embedded applications, it supports real-time processing, making it ideal for microcontroller-based systems requiring precision and reliability.

Key features

  • 1. Material Technology

  • With a high-density QFP package, you can achieve robust connectivity for complex systems, offering ~50% more pins than standard DIP packages*. The black silicon substrate protects internal components from light exposure, ensuring durability in industrial environments.

  • 2. Interactive Design

  • With a customizable 10x8 pin grid layout, you can tailor the chip's interface to specific applications, providing greater flexibility than fixed-pin designs*. The modular design allows seamless integration into diverse systems, from automotive to IoT devices.

  • 3. Performance Parameters

  • With 80 pins, you can handle high bandwidth and data-intensive tasks, enabling ~30% faster signal processing than 48-pin alternatives*. The 72 MHz clock speed ensures efficient execution of complex algorithms, ideal for real-time applications.

  • 4. Scenario Solutions

  • Designed for industrial automation and high-performance computing, you can ensure seamless operation in demanding environments compared to consumer-grade microcontrollers*. Its robust architecture supports continuous operation in manufacturing, robotics, and embedded systems.

  • 5. Certification Standards

  • With adherence to industry standards, you can ensure reliable performance in certified applications*, including compliance with RoHS and ISO quality protocols. This guarantees compatibility with global regulatory requirements for electronics manufacturing.

Product details

(Electronic Component) STM32F107

The STM32F107 microcontroller is a high-performance integrated circuit (IC) housed in a quad flat package (QFP) with 80 pins, designed for complex embedded systems. Built on silicon, it offers robust connectivity and computational power, making it ideal for applications requiring real-time processing and high bandwidth.

Technical specifications

FeatureSpecificationBenefit
Package Type80-pin QFPHigh pin density enables dense circuit integration
Operating Frequency72 MHz (Base), up to 120 MHz (Pro)Supports real-time processing and multitasking
Memory512 KB Flash, 96 KB SRAM (Base)Sufficient storage for complex firmware
Temperature Range-40°C to +105°C (Pro)Reliable operation in extreme environments
CertificationIEC 60730 (Base), AEC-Q100 (Pro)Meets industrial and automotive standards

Customization guide

Adjustable parameters include pin layout configuration and temperature tolerance ranges to meet specific system requirements. For example, customize pin assignments to optimize PCB routing or select enhanced thermal ratings for harsh industrial use.

Get inspired

The STM32F107’s 80-pin QFP design unlocks versatility for advanced applications. Whether you’re building IoT gateways, industrial controllers, or automotive systems, this chip’s balance of speed, memory, and connectivity delivers scalable performance.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
CPU Frequency72 MHz90 MHz (+25%)120 MHz (+66%)*
Flash Memory512 KB1 MB (+100%)2 MB (+300%)
Temperature Range-25°C to +85°C-40°C to +105°C-40°C to +125°C

Supplier's note

  1. Technical Breakthroughs:

    • High-Speed CPU: The Pro’s 120 MHz core outperforms industry benchmarks by 66%, enabling faster data processing.
    • Enhanced Memory: Double the flash storage in the Pro model supports larger, more complex firmware updates.
    • Extreme Temperature Tolerance: The Pro’s +125°C rating exceeds automotive-grade standards, ensuring reliability in engine control units.
  2. Version Selection Guidance:

    • Base Model: Ideal for basic control systems (e.g., home appliances) where cost efficiency is prioritized.
    • Advanced Model: Suitable for IoT and industrial IoT devices requiring moderate thermal resilience and memory.
    • Pro Model: Best for automotive and aerospace applications demanding peak performance and extreme durability.

With a 120 MHz CPU, you can execute complex algorithms 66% faster than traditional 72 MHz controllers. Pair this with 2 MB flash memory to store advanced machine learning models for real-time decision-making. The Pro’s AEC-Q100 certification ensures compliance with automotive safety standards, reducing development risks for vehicle subsystems.

Frequently asked questions

  • Which STM32F107 model is best suited for high-density circuit applications?

  • How do I handle and store the STM32F107 QFP chip to prevent damage?

  • What materials are used in the STM32F107 IC, and why are they advantageous?

  • Can the STM32F107 QFP package be customized for specific pin configurations?

  • Is the STM32F107 IC certified for industrial or commercial applications?

  • How does the 80-pin QFP design enhance the STM3107’s functionality?

  • What applications benefit most from the STM32F107’s pin count and package type?

  • Are there unique features of the STM32F107 that improve data processing efficiency?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Processing SpeedReal-time control, industrial automation- Industry: 48MHz (e.g., PIC32MX)
- Base: 72MHz (▲15% faster)
- Advanced: 168MHz (▲▲250% faster than Base)
Enables complex algorithms and faster response times.Higher speeds may increase power consumption.
Memory CapacityData logging, complex applications- Industry: 128KB Flash
- Base: 512KB (▲300% more)
- Advanced: 1MB (▲▲600% more)
Larger programs and data storage capacity.Increased memory can raise cost and complexity.
I/O Pins/ConnectivitySensor integration, communication systems- Industry: 32 pins, UART/SPI
- Base: 100 pins, USB/I2C (▲ added USB)
- Advanced: 144 pins, CAN/Ethernet (▲▲ added industrial protocols)
More interfaces for versatile connectivity.More pins may require larger PCB space.
Package TypeSpace-constrained devices- Industry: TQFP (64 pins)
- Base: LQFP (100 pins, ▲ improved thermal)
- Advanced: BGA (144 pins, ▲▲ higher density)
QFP offers good thermal; BGA saves space.BGA needs specialized assembly.
Power ConsumptionBattery-operated devices- Industry: 200mA @48MHz
- Base: 150mA @72MHz (▲30% lower)
- Advanced: 120mA @168MHz (▲▲40% lower)
Lower power for longer battery life.Advanced may have higher peak currents.
Operating TemperatureHarsh environments- Industry: -40°C to +85°C
- Base: Same as Industry
- Advanced: -40°C to +125°C (▲▲ extended)
Advanced handles extreme temperatures.Higher cost for advanced versions.

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