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  • Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture
  • Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture
  • Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture
  • Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture
  • Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture
  • Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture
Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture
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Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture

  • 10 - 99 Pieces
    $0.34
    $0.42
  • 100 - 999 Pieces
    $0.28
    $0.35
  • >= 1000 Pieces
    $0.20
    $0.25

Customization:

Customized packaging（Min.Order: 1000 pieces）
Customized logo（Min.Order: 1000 pieces）
Graphic customization（Min.Order: 1000 pieces）
View product details

Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Power Audio Amplification: Delivers 30W output, designed to amplify audio signals for clear and powerful sound reproduction in electronic devices.
  • Power Management & Signal Processing: Integrates power regulation and signal processing capabilities, enabling efficient voltage/current control and signal filtering/amplification in circuits.

Key features

  • 1. Material Technology

    • With metal and plastic encapsulation, ensure enhanced durability and protection against environmental factors like moisture and temperature fluctuations.

  • 2. Interactive Design

    • With an 8-lead SOIC package, you can achieve a 30% smaller footprint than through-hole components*, enabling compact PCB design for space-constrained devices.

  • 3. Performance Parameters

    • Delivering 30W output power, you can achieve 50% higher audio output compared to similar-sized amplifiers*, ensuring clear sound in high-demand applications.

  • 4. Scenario Solutions

    • Optimized for both home audio systems and commercial applications, this IC provides consistent performance in diverse environments, from portable speakers to public address systems.

  • 5. Certification Standards

    • Complies with industry-standard specifications for audio amplification, ensuring compatibility with global electronic manufacturing requirements.

Product details

Electronic Components Audio Amplifier Ic Chips LPA2101 LPA2101SPF 30W ESOP8 Chip Manufacture

The LPA2101 audio amplifier IC is a compact, surface-mount integrated circuit (SOIC-8 package) designed for standard audio applications. Delivering 30W of power output, it combines reliability with space efficiency, making it ideal for PCB designs requiring high-density integration. Its surface mount technology (SMT) enables seamless assembly in electronic devices, while its robust thermal and electrical performance ensures stable operation across diverse environments.

Technical specifications

FeatureSpecificationBenefit
Package TypeSOIC-8 (8-Lead)Compact design for space-constrained PCBs
Power Output30WDrives mid-to-high fidelity audio systems
Mounting TypeSurface Mount (SMT)Simplifies automated assembly processes
Operating Temp-40°C to +85°CEnsures reliability in extreme environments
Input Voltage5V to 12V DCCompatible with standard power supplies

Customization guide

  • Adjustable Lead Spacing: Customize pin pitch to optimize PCB layout density.
  • Material Tweaks: Specify thermal-resistant encapsulation for high-power scenarios.
  • Pin Configuration: Modify lead assignments to align with signal routing needs.
    Example: With a 0.65mm lead spacing adjustment, you can fit the IC into ultra-compact IoT device designs.

Get inspired

Enhance audio clarity in portable speakers, home theater systems, or industrial sound equipment. The LPA2101’s balanced power and thermal efficiency make it a go-to for engineers prioritizing performance without sacrificing space.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Output30W+15% (34.5W)*+30% (39W)*
Efficiency80%85%90%
Thermal Resistance120°C/W100°C/W80°C/W*
Signal-to-Noise75dB80dB85dB

Supplier's note

  1. Three Breakthroughs:

    • SOIC-8 Package: 20% smaller than DIP alternatives, enabling space savings.
    • 30W Output: Delivers 15% higher power than competing standard amplifiers.
    • Low Thermal Resistance: 30% better heat dissipation than industry benchmarks.

  2. Optimal Version Selection:

    • Base Model: Ideal for standard audio applications (e.g., entry-level speakers) where cost-efficiency is critical.
    • Advanced Model: Targets portable devices (e.g., Bluetooth speakers) needing 85% efficiency for extended battery life.
    • Pro Model: Designed for high-power systems (e.g., automotive audio) requiring 39W output and 80°C/W thermal performance to handle continuous operation.

Example Use Case: The Pro version’s 80°C/W thermal resistance enables safe operation in car stereos, even during prolonged high-volume playback. Paired with its 39W output, it ensures distortion-free audio in noisy environments.

Frequently asked questions

  • Which audio amplifier IC suits compact audio systems requiring 30W output?

  • Is the LPA2101SPF compliant with industry safety standards?

  • How does the LPA2101SPF compare to DIP-package amplifiers?

  • Can the LPA2101SPF be customized for specific PCB designs?

  • What applications are best suited for the LPA2101SPF 30W chip?

  • How is the LPA2101SPF mounted on PCBs for reliability?

  • Does the LPA2101SPF handle thermal stress in high-power scenarios?

  • What warranty or technical support is provided for the LPA2101SPF?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Power OutputHigh-fidelity audio systems, home theatersIndustry: 25WOur Base: 30W ▲ (IEC 60065 compliant)Our Advanced: 35W ▲▲ (5W boost over base)
Noise LevelProfessional recording studiosIndustry: 45 dBAOur Base: 38 dBA ▲ (quieter than fridge hum)Our Advanced: 35 dBA ▲▲ (below whisper level)
Package SizeCompact devices like smartphonesIndustry: 6x6mmOur Base: 5x5mm ▲ (30% smaller)Our Advanced: 4.5x4.5mm ▲▲ (space-saving)
Operating TemperatureIndustrial environmentsIndustry: -20°C to 70°COur Base: -30°C to 85°C ▲Our Advanced: -40°C to 105°C ▲▲ (harsh environments)
EfficiencyBattery-powered devicesIndustry: 80%Our Base: 85% ▲Our Advanced: 90% ▲▲ (reduces power waste)
Customization OptionsOEM audio equipmentIndustry: 3 configurationsOur Base: 5 configurations ▲Our Advanced: 10+ ▲▲ (tailored solutions)

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