(Electronic Components) CS3793EO

Name: (Electronic Components) CS3793EO
Brand: Shenzhen Winsome Electronic Technology Co., Ltd
SKU: 1600165040107_1
Price: 20.00 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Density Circuit Integration: Designed as a surface-mount device (SMD) package for integrated circuits, enabling compact and efficient circuit designs in electronic systems.
Reliable Performance: Utilizes robust materials like FR-4 and SMT technology to ensure thermal and mechanical stability, ideal for high-reliability applications.

Key features

1. Material Technology

With a rigid FR-4 PCB material, ensure durability and stability in high-stress environments compared to flexible substrates. The surface-mount design (SMD) leverages corrosion-resistant materials to maintain performance in industrial or harsh operating conditions.

2. Interactive Design

With surface-mount technology (SMT), design compact electronics with seamless multi-component integration, enabling modular circuit setups unlike bulky through-hole alternatives*.

3. Performance Parameters

With high-density packaging, achieve ~20% higher component integration* than traditional through-hole designs, enhancing performance in space-constrained devices like smartphones or IoT hardware.

4. Scenario Solutions

Designed for continuous operation in commercial manufacturing, enabling seamless integration into automated assembly lines for high-volume production. Ideal for applications requiring reliability in automotive, industrial, or consumer electronics sectors.

5. Certification Standards

Complies with industry standards for thermal and mechanical reliability, ensuring compatibility with certified electronic systems* (e.g., RoHS/WEEE compliance pending manufacturer confirmation).

Product details

The CS3793EO is a surface-mount device (SMD) integrated circuit (IC) designed for high-density, reliable electronic applications. Built on rigid FR-4 substrate material, this SMD package offers compact dimensions and superior thermal/mechananical performance, ideal for automated assembly in consumer electronics, industrial control systems, and IoT devices.

Technical specifications

Feature	Specification	Application Scenario
Material	FR-4 epoxy laminate	High-reliability PCBs requiring rigidity
Packaging Type	Surface-Mount Technology (SMT)	Automated assembly lines
Density	High-pin-count configuration	Space-constrained IoT or wearable devices
Thermal Performance	-40°C to +125°C operating range	Automotive or industrial environments
Assembly Compatibility	RoHS-compliant solder joints	Mass production of consumer electronics

Customization guide

Adjustable parameters include:

Pin configuration to match custom PCB layouts
Thermal pad design for heat-sensitive applications
Signal trace routing to optimize EMI performance

Get inspired

Leverage the CS3793EO’s SMD form factor to miniaturize your electronics while maintaining robust performance. Ideal for projects requiring dense circuitry without compromising on durability or scalability.

Choose your model

Parameter	Base Model	Advanced Model	Pro Model
Thermal Resistance	1.2°C/W	+15% (1.02°C/W)	+30% (0.84°C/W)*
Signal Integrity	Standard (100MHz)	Enhanced (200MHz)	Premium (400MHz)
Package Density	200 pins/m²	300 pins/m²	450 pins/m²
Operating Voltage	3.3V ±10%	5V ±5%	12V ±3%

Supplier's note

Technical Breakthroughs:
- Enhanced Thermal Resistance: The Pro Model’s 0.84°C/W rating outperforms industry benchmarks by 30%, enabling stable operation in high-temperature server farms.
- High-Frequency Compatibility: The Advanced Model’s 200MHz signal integrity ensures flawless data transmission in 5G communication modules.
- Ultra-Dense Packaging: The Pro Model’s 450 pins/m² density reduces board space by 40% compared to traditional QFP packages.
Optimal Version Selection:
- Base Model: Suitable for low-power IoT sensors or basic consumer devices where cost-efficiency is prioritized.
- Advanced Model: Ideal for mid-range industrial control systems requiring balanced performance and moderate power handling.
- Pro Model: Designed for high-reliability applications like aerospace electronics or data center servers, where extreme thermal and signal performance are critical.

With the Pro Model’s triple-certified chemical resistance, you can ensure safe handling of corrosive environments in automotive electronics. Pair its low thermal resistance with high-frequency capabilities to create next-gen 5G base stations that deliver 20% faster data rates than legacy systems.

Note: Comparative values assume industry-standard benchmarks at 1.8°C/W and 150MHz signal integrity.

Frequently asked questions

Which SMD package suits high-density circuit designs for consumer electronics?
How to ensure proper handling of SMD components during assembly?
FR-4 vs other materials: Which is better for PCBs in industrial equipment?
Can CS3793EO be customized for specific circuit requirements?
Is the CS3793EO SMD package RoHS compliant?
What makes SMD packages suitable for high-reliability electronics?
How does the CS3793EO address space constraints in compact devices?
Are there customization options for PCB layout with CS3793EO?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
Material & Construction	Industrial IoT, Aerospace, Consumer Electronics	Material: FR-4 (Industry) ▲ FR-4 + 1.6mm (Base) ▲ High-Tg FR-4 (Advanced) (ASTM D638, UL 746C)	Cost-effective (Industry); Enhanced durability (Base); Withstands 175°C (Advanced)	Limited thermal tolerance (Industry); Slightly heavier (Base); Higher cost (Advanced)
Packaging Density	Wearables, Mobile Devices, High-Density Servers	Density: 1,500 components/in² (Industry) ▲ 1,800 (Base) ▲ 2,000 (Advanced) (ISO 9804)	Space-efficient (Base); Maximized component integration (Advanced)	Higher production cost; Requires advanced assembly (Base/Advanced)
Reliability	Medical Devices, Automotive Systems	MTBF: 500,000 hrs (Industry) ▲ 800,000 (Base) ▲ 1,200,000 (Advanced) (MIL-HDBK-217)	Longer lifespan (Base); Mission-critical reliability (Advanced)	Higher cost for advanced materials and testing (Advanced)
Assembly Method	Mass Production, High-Volume Electronics	Process: Manual (Industry) ▲ Fully Automated SMT (Base) ▲ AI-Driven SMT (Advanced) (IEC 61181)	Faster production (Base); Zero-defect precision (Advanced)	Requires advanced machinery (Base/Advanced)
Thermal Performance	Automotive, Industrial Automation	Tj Max: 125°C (Industry) ▲ 150°C (Base) ▲ 175°C (Advanced) (JEDEC JESD51-2)	Operates in harsh environments (Advanced)	Higher material costs and design complexity (Advanced)
Customization Flexibility	Custom Solutions, Specialized Industries	Customization: Limited (Industry) ▲ Moderate (Base) ▲ Full (Advanced) (ISO 13485 for medical)	Tailored to niche applications (Advanced)	Longer lead times and higher engineering costs (Advanced)