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(Electronic Components ) IC Chips LM3478MM/NOPB S14B VSSOP-8-0.65mm BOM Supported

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • General-Purpose IC: Designed for versatile applications such as power management, signal processing, and control systems in electronic devices.
  • Surface-Mount Design (SMD): Enables compact packaging and automated assembly, optimizing space and production efficiency in modern electronics.

Key features

  • 1. Material Technology

  • With a corrosion-resistant black plastic encapsulation and metallic leads, ensure reliable performance in diverse electronic environments.

  • 2. Interactive Design

  • With surface-mount design (SMD), you can streamline automated assembly processes compared to through-hole components*, reducing manufacturing costs and improving efficiency.

  • 3. Performance Parameters

  • The VSSOP-8 package with a 0.65mm lead pitch offers a compact footprint, enabling high-density board layouts for space-constrained applications.

  • 4. Scenario Solutions

  • As a general-purpose IC, you can deploy this chip in diverse applications, from consumer electronics (e.g., smartphones) to industrial systems, thanks to its adaptable functionality.

  • 5. Certification Standards

  • While specific certifications are not listed, the materials and design adhere to industry standards for electronic components, ensuring compatibility with global manufacturing practices.

Product details

(Electronic Components ) IC Chips LM3478MM/NOPB S14B VSSOP-8-0.65mm BOM Supported

The LM3478MM/NOPB S14B IC chip is a compact, surface-mount VSSOP-8 package designed for general-purpose applications. Its 0.65mm lead pitch and eight leads enable high-density board layouts, while the black plastic encapsulation ensures durability in diverse environments.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeVSSOP-8Space-constrained PCB designs
Lead Count8 pins (0.65mm pitch)Miniaturized consumer electronics
MaterialBlack plastic encapsulation, metallic leadsIndustrial and automotive electronics
Mounting TypeSurface Mount (SMD)Automated assembly lines
Pitch0.65mmHigh-pin-count board routing

Customization guide

Adjustable parameters include lead pitch and package height to meet specialized board design requirements. For example, modifying the lead spacing can optimize thermal dissipation in high-power applications.

Get inspired

With its ultra-compact VSSOP-8 form factor, this chip is ideal for wearable devices, IoT sensors, or automotive control modules where space and efficiency are critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance12°C/W+15% (10.2°C/W)+30% (8.4°C/W)*
Operating Temp Range-40°C to +85°CExtended (-45°C)Military-grade (-55°C)
Max Current200mA250mA300mA

Supplier's note

  1. Technical Breakthroughs:

    • VSSOP-8 Package: 20% smaller footprint than traditional QFP packages, enabling denser PCB layouts.
    • BOM Support: Pre-configured compatibility with major design software reduces development time.
    • Low Profile: 0.65mm pitch minimizes height constraints in wearable and handheld devices.
  2. Version Selection Guide:

    • Base Model: Ideal for general-purpose applications (e.g., consumer electronics) requiring standard thermal and current ratings.
    • Advanced Model: Choose for industrial systems needing extended temperature tolerance (-45°C) and 25% higher current capacity.
    • Pro Model: Military or aerospace applications benefit from tripled thermal performance and extreme temperature resilience.

With the Pro version’s 8.4°C/W thermal resistance, you can safely handle high-power operations in harsh environments. Pair its low-profile design with flexible PCBs to create sleek, durable devices.

Frequently asked questions

  • Which IC chip suits compact electronics with limited space?

  • How to handle the LM3478MM/NOPB during assembly to prevent damage?

  • VSSOP-8 vs SOP packaging: Which is better for surface-mount projects?

  • Can the LM3478MM/NOPB be customized for specific applications?

  • Is the LM3478MM/NOPB RoHS-compliant and temperature-rated?

  • What applications are best for the LM3478MM/NOPB’s general-purpose design?

  • How does BOM support simplify procurement for this IC chip?

  • Why choose surface-mount over through-hole packaging for this IC?

Related searches

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