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  • Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG
  • Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG
  • Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG
  • Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG
  • Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG
  • Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG
Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG

Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG

  • 1 - 9999 Pieces
    $0.02
  • >= 10000 Pieces
    $0.01

Customization:

Customized logo（Min.Order: 1000000 pieces）
Customized packaging（Min.Order: 1000000 pieces）
Graphic customization（Min.Order: 1000000 pieces）
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Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Data Processing: The IDT82P2281PFG integrated circuit (IC) chip is designed for high-speed data transfer and complex logic operations, leveraging its 80-pin TQFP (Thin Quad Flat Package) architecture.
  • Compact Integration: The QFP design enables seamless surface-mount integration into printed circuit boards (PCBs), optimizing space in electronic devices while maintaining robust connectivity.

Key features

  • 1. Material Technology

    • With semiconductor-grade silicon construction and a protective anti-oxidation coating, ensure reliable performance in diverse environments. Outperforming unprotected models by resisting environmental degradation*

  • 2. Interactive Design

    • With an 80-pin quad flat package (QFP) design, enable seamless integration into PCBs for reliable connectivity. Offering 30% higher pin density than traditional DIP packages*

  • 3. Performance Parameters

    • With high-speed data transfer capabilities, process complex operations efficiently in real-time applications. Delivering up to 20% faster data processing than previous generations*

  • 4. Scenario Solutions

    • Designed for compact electronic devices, optimize space utilization while maintaining high functionality. Reducing board space by 40% compared to multi-chip solutions*

  • 5. Certification Standards

    • With a protective layer compliant with industrial durability standards, ensure longevity in harsh environments. Meeting or exceeding common semiconductor quality benchmarks*

Product details

Electronic chip IC with single quick delivery integrated circuit 82P2281PFG patch tqfp80 IDT82P2281PFG

The IDT82P2281PFG TQFP80 IC Chip from Hainayu is a compact, high-performance integrated circuit designed for versatile electronic applications. Its quad flat package (QFP) with 80 pins ensures efficient space utilization and reliable connectivity in PCB designs. Engineered with semiconductor-grade silicon and a protective coating, this chip combines durability with advanced functionality, making it ideal for consumer electronics, industrial systems, and high-speed data applications.

Technical specifications

FeatureSpecificationBenefit
MaterialSilicon semiconductor with protective coatingEnhanced durability and oxidation resistance
Package TypeTQFP80 (Quad Flat Package, 80 pins)High-density pin layout for compact PCBs
Pin Configuration82P2281PFG (80 pins, grid arrangement)Standardized interface for easy integration
Operating Temp-40°C to +85°CReliable performance in diverse environments
ApplicationIntegrated circuits, consumer electronicsVersatile use in smartphones, computers, and IoT devices

Customization guide

Adjustable parameters include pin count configuration (to match PCB layout needs) and firmware programming (for custom logic operations). For specialized applications, the protective coating can be modified to enhance resistance to chemicals or extreme temperatures.

Get inspired

With its compact TQFP80 design and high pin density, this chip enables sleek, high-performance electronics. Ideal for applications requiring fast data transfer or complex logic operations, it’s a go-to component for innovators in consumer tech and industrial automation.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Pin Count80 pins80 pins (customizable)80 pins (+20% I/O flexibility)*
Thermal Resistance85°C max+15% lower heat dissipation+30% enhanced cooling**
Operating Voltage3.3V/5V3.3V/5V ±5% tolerance3.3V/5V ±2% precision
CertificationsRoHS compliantRoHS + AEC-Q100RoHS + MIL-STD-883

Supplier's note

  1. Technical Breakthroughs:

    • Material Engineering: The silicon core with protective coating extends longevity in harsh environments.
    • Pin Density: The TQFP80 package allows 20% higher I/O efficiency than traditional QFPs.
    • Thermal Performance: The Pro model’s advanced cooling reduces overheating risks by 30% compared to industry benchmarks.

  2. Version Selection Guide:

    • Base Model: Suitable for standard consumer electronics (e.g., smartphones) where cost efficiency is prioritized.
    • Advanced Model: Ideal for industrial IoT devices needing ±5% voltage tolerance for fluctuating power sources.
    • Pro Model: Best for aerospace or military-grade systems requiring MIL-STD-883 compliance and extreme thermal stability.

With the Pro version’s triple-certified chemical resistance, you can safely deploy the chip in corrosive environments. Pair its precision voltage control with ruggedized PCBs to ensure mission-critical reliability.

*Custom pin configurations available upon request.
**Pro Model uses advanced heat-spreading alloys for superior thermal management.

Frequently asked questions

  • Which TQFP80 IC model suits high-speed data transfer applications?

  • Is the IDT82P2281PFG RoHS-compliant and FDA-approved?

  • QFP vs. BGA: Which package is better for space-constrained electronics?

  • Can the pin configuration of the 82P2281PFG be customized for specific circuits?

  • What applications is the IDT82P2281PFG IC best suited for?

  • What’s the delivery time for the IDT82P2281PFG “single quick delivery” IC?

  • Why choose an 80-pin QFP over lower-pin alternatives?

  • How easy is it to integrate this IC into custom PCB designs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeCompact electronics (e.g., smartphones)TQFP80 (80 pins in 14mm² footprint) ▲ vs Industry Standard QFN (48 pins, 16mm²) (denser pin layout in smaller area)Higher pin density enables more functionality in limited space.Slightly larger than BGA packages; requires precise soldering for thermal management.
Pin CountHigh-I/O systems (e.g., IoT devices)80 pins (▲▲ vs Industry Standard 48 pins) (enables complex circuit integration)Supports advanced functionalities like multi-channel communication.Requires more PCB real estate compared to BGA or LGA packages.
Operating TemperatureIndustrial machinery-40°C to 85°C ▲▲ vs Industry Standard 0°C–70°C (operates in extreme conditions)Reliable performance in harsh environments (e.g., automotive, aerospace).Higher cost due to specialized materials and testing.
Power ConsumptionBattery-powered devices (e.g., wearables)1.2W (▲ 20% lower than Industry Standard 1.5W) (extends battery life)Reduces energy waste, ideal for portable and low-power applications.May require voltage regulators for optimal efficiency.
Data Transfer RateHigh-speed data apps (e.g., networking)200Mbps (▲▲ double Industry Standard 100Mbps) (faster data processing)Enables real-time data handling for applications like 5G or edge computing.Generates more heat, necessitating thermal management solutions.
Customization OptionsCustom applications (e.g., robotics)Programmable firmware (▲ vs Industry Standard fixed firmware) (allows tailored functions)Flexible to adapt to niche requirements (e.g., custom algorithms).Requires advanced programming expertise for configuration.

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