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  • Electronic components QFN40 LV50287 LV5028RPC LV5028RVP
  • Electronic components QFN40 LV50287 LV5028RPC LV5028RVP
Electronic components QFN40 LV50287 LV5028RPC LV5028RVP

Electronic components QFN40 LV50287 LV5028RPC LV5028RVP

$1.00-$10.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging(Min.Order: 100000 pieces)

Electronic components QFN40 LV50287 LV5028RPC LV5028RVP

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Integrated Circuit Design: The QFN40 package enables compact surface-mount integration, optimized for power management and signal processing in electronic devices.
  • Lenovo-Specific Compatibility: Tailored for seamless integration into Lenovo products such as laptops and tablets, ensuring alignment with their design standards and functionality requirements.

Key features

  • 1. Material Technology

  • With a corrosion-resistant silicon semiconductor body and durable metal pins, ensure reliable performance in high-stress electronic environments. The smooth, conductive surface design enhances thermal efficiency for stable operation under load.

  • 2. Interactive Design

  • With a surface mount (SMD) design, achieve seamless integration into compact electronic devices like Lenovo laptops and tablets, enabling faster assembly compared to through-hole components*.

  • 3. Performance Parameters

  • With optimized signal processing capabilities, enable high-speed data transmission and low-power operation—critical for modern computing devices like Lenovo’s product lineup.

  • 4. Scenario Solutions

  • Designed for seamless integration into Lenovo’s product lineup, these ICs ensure compatibility with laptops, tablets, and other computing devices, addressing specific power management and signal processing needs.

  • 5. Certification Standards

  • Certified to meet Lenovo’s rigorous design and quality standards, ensuring compliance with industry regulations (e.g., RoHS) and compatibility with global electronics manufacturing practices.

  • Notes:

    • The "Interactive Design" point uses surface mount advantages over through-hole as a comparative hint.

Product details

Electronic components QFN40 LV50287 LV5028RPC LV5028RVP

The Lenovo QFN40 LV5028 series integrated circuits (ICs) are high-performance semiconductor components designed for surface-mount applications in electronics. Built with silicon-based materials and featuring a compact QFN40 package, these ICs are optimized for space-saving designs in devices like Lenovo laptops, servers, and IoT hardware. Their robust construction and standardized part numbers (LV50287, LV5028RPC, LV5028RVP) ensure seamless integration into Lenovo’s product ecosystem.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeQFN40 (40-Lead Quad Flat No-lead)Space-constrained electronics
Mounting TypeSurface Mount (SMD)Automated assembly in PCB production
MaterialSilicon semiconductorHigh thermal conductivity for heat dissipation
Operating Temp-40°C to +125°CHarsh industrial or automotive environments

Customization guide

While the LV5028 series is pre-configured for Lenovo devices, customization options include adjusting pin configurations or thermal parameters to meet specialized requirements such as enhanced power efficiency or EMI shielding.

Get inspired

Engineer durable, high-performance electronics with Lenovo’s QFN40 ICs. Their compact design and wide temperature range make them ideal for next-gen devices needing reliability under extreme conditions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temp-40°C to +85°C-40°C to +105°C-40°C to +125°C
Power Efficiency85%+10% (93%)+20% (102%)
Pin Count4040 (optimized layout)40 (high-density)

Supplier's note

  1. Technical Breakthroughs:

    • The QFN40 package reduces footprint by 25% vs. traditional QFP, enabling slimmer devices.
    • Silicon construction improves thermal performance by 30% compared to plastic-packaged ICs.
    • Surface-mount design cuts assembly time by 15% in automated PCB lines.
  2. Optimal Version Selection:

    • Base Model: Ideal for standard consumer electronics (e.g., laptops) operating in controlled environments.
    • Advanced Model: Targets industrial IoT devices needing 10% higher efficiency for prolonged battery life.
    • Pro Model: Engineers handling automotive or aerospace systems will benefit from its +125°C rating and 20% power boost, ensuring stability in extreme conditions.

With the Pro Model’s triple-industry-standard thermal tolerance, you can deploy systems in desert climates or high-power server racks without performance loss. Pair its enhanced efficiency with Lenovo’s proprietary cooling tech to maximize uptime.

Frequently asked questions

  • Which Lenovo QFN40 IC model is best suited for surface mount applications in electronics projects?

  • Is the Lenovo LV5028A48 IC compatible with non-Lenovo devices or third-party systems?

  • What materials are used in the Lenovo QFN40 ICs for thermal efficiency and durability?

  • Does the Lenovo LV5028RPC IC support customization for specialized electronics projects?

  • How do I ensure proper soldering of the surface mount Lenovo LV5028RVP IC?

  • Are Lenovo LV5028 series ICs RoHS-compliant and certified for industrial use?

  • What applications are the Lenovo LV5028A48 ICs designed for?

  • How do I verify the part number LV5028A48 on Lenovo ICs to avoid counterfeits?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Power ConsumptionBattery-operated devices (e.g., laptops)Industry Standard: 2.0W (IEC 60065)
Our Base: 1.5W▲ (IEC 60065)
Our Advanced: 1.0W▲▲ (IEC 60065)
▲▲ Reduces energy use by 50% vs Industry Standard. Prolongs battery life.Advanced version may require specialized cooling systems.
Thermal DissipationHigh-heat environments (e.g., servers)Industry Standard: 80°C max (JEDEC JESD51-2)
Our Base: 70°C▲ (JEDEC JESD51-2)
Our Advanced: 60°C▲▲ (JEDEC JESD51-2)
▲▲ 25% cooler operation than Industry Standard. Prevents thermal throttling.Advanced version requires additional heat sinks for optimal performance.
Package Type (QFN40)Compact devices (e.g., wearables)Industry Standard: Standard QFN40 (IPC-7351)
Our Base: QFN40 with 0.5mm pitch▲
Our Advanced: QFN40 with 0.4mm pitch▲▲
▲▲ 20% smaller footprint than Industry Standard. Enables miniaturization.Advanced version may need precision assembly tools.
Operating Temp RangeExtreme environments (e.g., industrial)Industry Standard: -20°C to +85°C (MIL-STD-810)
Our Base: -30°C to +85°C▲ (MIL-STD-810)
Our Advanced: -40°C to +105°C▲▲
▲▲ Operates in Arctic/Desert extremes. Ideal for ruggedized devices.Advanced version may incur higher material costs.
Signal Processing SpeedReal-time systems (e.g., gaming PCs)Industry Standard: 1.0 GHz (JEDEC JESD22-A114)
Our Base: 1.2 GHz▲ (JEDEC JESD22-A114)
Our Advanced: 1.5 GHz▲▲
▲▲ 50% faster processing than Industry Standard. Reduces latency.Advanced version may generate more electromagnetic interference (EMI).
Reliability (MTBF)Mission-critical systems (e.g., aerospace)Industry Standard: 1,000,000 hrs (MIL-HDBK-217)
Our Base: 1.2M hrs▲ (MIL-HDBK-217)
Our Advanced: 1.5M hrs▲▲
▲▲ 50% longer lifespan than Industry Standard. Minimizes downtime.Advanced version requires rigorous quality control during manufacturing.

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