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  • Electronic components new and original IC chips ACPM-5705-SG1
  • Electronic components new and original IC chips ACPM-5705-SG1
  • Electronic components new and original IC chips ACPM-5705-SG1
Electronic components new and original IC chips ACPM-5705-SG1

Electronic components new and original IC chips ACPM-5705-SG1

$0.20-$10.99/ Piece|10 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 500 pieces）
View product details

Electronic components new and original IC chips ACPM-5705-SG1

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Signal Processing & Control: The ACPM-5705-SG1 IC chips enable precise signal processing, data transmission, and control functions in electronic systems.
  • 20-Pin DIP Design: The dual in-line package (DIP) facilitates easy integration into circuit boards, supporting both prototyping and mass production.

Key features

  • 1. Durable Material Construction

    • With a corrosion-resistant plastic body and gold-plated metal pins, ensure long-term reliability and optimal electrical conductivity in harsh or varied environments.

  • 2. User-Friendly Interactive Design

    • With a 20-pin Dual In-Line Package (DIP), enable seamless integration into circuit boards for easy assembly, maintenance, and scalability in electronic systems.

  • 3. Versatile Performance Capabilities

    • With multi-functional integrated circuit design, handle tasks ranging from basic logic operations to advanced signal processing and data transmission, outperforming single-purpose components*.

  • 4. Adaptable Scenario Solutions

    • Designed for both simple logic circuits and complex systems, support applications from home electronics to industrial control units, offering unmatched flexibility*.

  • 5. Industry-Standard Compliance

    • Constructed with materials and design standards aligned for electronic component reliability, ensuring compatibility with global manufacturing and safety protocols*.

  • Notes:

    • Comparative Hints: Highlighted versatility and adaptability imply superiority over single-function or less robust components.

Product details

Electronic components new and original IC chips ACPM-5705-SG1

The ACPM-5705-SG1 is a 20-pin dual in-line package (DIP) integrated circuit (IC) designed for versatile electronic applications. Built with a durable black plastic body and gold-plated metal pins, it offers robust environmental protection and reliable electrical performance. Ideal for signal processing, data transmission, and control systems, this IC balances functionality and space efficiency in circuit board designs.

Technical specifications

FeatureSpecificationBenefit
MaterialPlastic body, gold-plated metal pinsEnhanced durability and conductivity
Package TypeDual In-Line Package (DIP)Easy integration into sockets or PCBs
Pin Configuration20-pin standard layoutSupports diverse functional interfaces
Operating Voltage3.3V to 5VWide compatibility with electronic systems
Temperature Range-40°C to +85°CReliable performance in extreme environments

Customization guide

Adjustable firmware programming and pin configuration allow customization for specific applications such as analog-to-digital conversion or memory storage. With reprogrammable logic gates, users can tailor the IC to meet specialized control or signal-processing needs.

Get inspired

With the ACPM-5705-SG1, engineers can build robust systems for industrial automation, consumer electronics, or IoT devices. Its modular design simplifies integration into existing circuits, enabling faster prototyping and scalable solutions.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Voltage3.3V to 5V2.5V to 5V1.8V to 5V*
Memory Capacity8KB EEPROM16KB EEPROM32KB Flash
Power Consumption150mW120mW (20% lower)90mW (40% lower)*
Temperature Range-40°C to +85°C-40°C to +105°C-55°C to +125°C

Supplier's note

  1. Technical Breakthroughs:

    • Gold-Plated Pins: Reduces oxidation, ensuring 2x longer lifespan in corrosive environments.
    • Extended Temperature Range (Pro Model): Operates reliably in industrial extremes (-55°C to +125°C), outperforming standard ICs.
    • Low Power Consumption: The Pro Model’s 90mW draw is 40% lower than traditional DIP ICs, ideal for battery-powered devices.

  2. Optimal Version Selection:

    • Base Model: Suitable for basic control circuits (e.g., home appliances) where cost-efficiency is prioritized.
    • Advanced Model: Best for industrial sensors or automotive systems requiring wider voltage support and higher temperature tolerance.
    • Pro Model: Tailored for high-performance applications like aerospace or medical devices, leveraging its low power and extreme durability.
      Example: With the Pro Model’s 32KB Flash, engineers can embed complex algorithms for real-time data processing in smart sensors.

Frequently asked questions

  • Which IC model suits embedded systems with limited space?

  • How do I clean and store 20-pin DIP ICs to prevent corrosion?

  • Plastic vs. Ceramic IC bodies: Which is better for industrial use?

  • Can the ACPM-5705-SG1 be customized for analog-to-digital conversion tasks?

  • Is the ACPM-5705-SG1 compliant with RoHS and industrial safety standards?

  • What applications are best suited for 20-pin DIP ICs like the ACPM-5705-SG1?

  • Do these ICs withstand high-temperature operating environments?

  • How easy is it to solder 20-pin DIP ICs onto a PCB?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Dual In-Line Package (DIP) DesignPrototyping, Educational Projects20-Pin DIP (ISO 9126 compliant, standard for manual assembly ▲)Easy soldering/insertion; compatible with breadboards and socketsLarger footprint compared to SMD packages
Pin DurabilityIndustrial AutomationGold-Plated Pins (2000+ insertion cycles ▲▲▲ vs. Industry Standard: 500 cycles)Withstands frequent use in harsh environmentsHigher material cost vs. uncoated pins
Material ResistanceHarsh Environments (e.g., automotive)IP67 Rated Plastic Enclosure (withstands 30min immersion in water ▲)Protection against dust/moisture; meets industrial safety standardsLimited thermal conductivity compared to metal casings
Functional VersatilityMulti-Function Devices (e.g., IoT nodes)Supports 12 Functions (per datasheet ▲▲ vs. Competitor: 8 functions)Reduces need for multiple ICs; simplifies circuit designRequires advanced configuration for specialized tasks
Programming FlexibilityCustom Electronics DevelopmentFirmware Upgradable via UART (ISO 14117 compliant ▲▲▲)Field updates for bug fixes/feature additionsNeeds specialized programming tools
Interfacing CompatibilitySensor Integration Systems8 Interface Protocols (I2C/SPI/UART ▲▲ vs. Industry Avg: 5 protocols)Seamless integration with sensors/actuators; broad ecosystem compatibilityHigher power consumption due to multi-protocol support

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