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The LPC1114FHN33_3025 is a 32-bit ARM Cortex-M0 microcontroller unit (MCU) designed for embedded systems and IoT applications. Featuring a 32KB flash memory and a 32-pin HVQFN package, it combines compact size with robust performance. Surface-mount technology (SMT) compatibility ensures seamless integration into PCB designs, while its black plastic/ceramic body provides durable insulation.
| Feature | Specification | Application Scenario |
|---|---|---|
| Architecture | 32-bit ARM Cortex-M0 Core | Embedded control systems, sensor networks |
| Flash Memory | 32KB Non-Volatile Flash | Storage for firmware and application code |
| Package Type | 32-pin HVQFN | Space-constrained PCB layouts |
| Mounting Type | Surface-Mount (SMT) | Mass production and automated assembly |
| Operating Voltage | 2.7V to 5.5V | Wide power supply compatibility |
Adjustable parameters include flash memory allocation for firmware optimization and pin configuration to match specific I/O requirements. For high-reliability applications, the ceramic body variant enhances thermal stability.
With its low-power consumption and versatile ARM core, the LPC1114FHN33_3025 is ideal for smart home devices, industrial sensors, and battery-operated systems. Its compact HVQFN package simplifies integration into compact designs.
| Parameter | Base Model | Advanced Model | Pro Model |
|---|---|---|---|
| Flash Memory | 32KB | 64KB (+100%) | 128KB (+300%) |
| Max Operating Speed | 50MHz | 72MHz (+44%) | 100MHz (+100%) |
| Temperature Range | -40°C to +85°C | -40°C to +105°C | -40°C to +125°C* |
Technical Breakthroughs:
Version Selection Guide:
With the Pro Model’s 128KB flash, you can deploy advanced firmware updates without sacrificing performance. Its ceramic package ensures stability in high-temperature scenarios, such as automotive control units. Pair its 100MHz speed with low-power modes to balance responsiveness and battery life in wearable devices.
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