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  • Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic
  • Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic
  • Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic
  • Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic
  • Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic
  • Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic
Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic

Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic

  • 4 - 3003 Pieces
    $91.06
  • >= 3004 Pieces
    $45.53
View product details

Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Programmable Logic Control: A Complex Programmable Logic Device (CPLD) enabling flexible digital circuit design and real-time reconfiguration for diverse applications.
  • High-Speed Performance: Features a 7.5ns propagation delay, ensuring rapid signal processing and optimal functionality in demanding electronic systems.

Key features

  • 1. Material Technology

    • With a robust silicon core and protective coating, ensure long-term reliability in high-stress electronic environments.

  • 2. Interactive Design

    • With a symmetrical 125-pin QFP package design, optimize heat dissipation and electrical connectivity for stable performance in compact systems.

  • 3. Performance Parameters

    • With 7.5ns signal propagation delay, process data faster than standard CPLDs* to meet high-speed computing demands.

  • 4. Scenario Solutions

    • Designed for high-density applications, this chip supports complex functionalities in computing hardware like servers and computers, enabling efficient data processing and control.

  • 5. Certification Standards

    • Manufactured to industry standards for quality and performance*, ensuring compatibility with modern electronic systems.

Product details

Embedded ISPLSI-3160-125LQ IC CPLD 7.5NS 208QFP Integrated Circuits Chip Ic

The ISPLSI-3160-125LQ IC is a high-performance CPLD (Complex Programmable Logic Device) designed for embedded applications, featuring a 125-pin quad flat package (QFP) and a propagation delay of 7.5ns. Its surface-mount design and robust silicon construction enable reliable operation in compact, high-density electronic systems.

Technical specifications

FeatureSpecificationApplication Scenario
Package Type125-pin QFPHigh-density PCBs requiring compact form factors
Propagation Delay7.5nsReal-time signal processing in industrial systems
Pin Count125Complex connectivity for multi-functional devices
Mounting TypeSurface Mount (SMD)Automated assembly in mass-produced electronics
MaterialSilicon with protective coatingHarsh environments with thermal or mechanical stress

Customization guide

Adjustable parameters include pin configuration (to match custom PCB layouts) and package size (for space-constrained designs). ALLCHIPS offers tailored solutions for specialized applications, such as aerospace or medical electronics.

Get inspired

With its 125-pin QFP package and 7.5ns speed, this CPLD is ideal for embedded systems demanding high connectivity and fast response times—think industrial controllers, networking hardware, or IoT gateways.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Propagation Delay7.5ns6.0ns (+20% faster)4.5ns (+66% faster)*
Pin Count125144 (+15%)160 (+28%)
Power Consumption1.5W1.2W (-20%)0.9W (-40%)

Supplier's note

  1. Technical Breakthroughs:

    • 125-pin QFP: Enables dense connectivity for complex systems, outperforming traditional PLCC packages.
    • 7.5ns Propagation Delay: 20% faster than industry-standard CPLDs, ideal for real-time applications.
    • Surface Mount Design: Reduces assembly costs by 30% compared to through-hole alternatives.

  2. Optimal Version Selection:

    • Base Model: Suitable for standard embedded systems (e.g., consumer electronics) where cost efficiency is prioritized.
    • Advanced Model: Recommended for industrial automation or robotics requiring faster processing and expanded I/O.
    • Pro Model: Best for mission-critical applications (e.g., aerospace, medical devices) needing ultra-low latency and high reliability.

With the Pro Model’s 4.5ns delay, you can achieve 66% faster signal processing than baseline CPLDs, ensuring seamless operation in high-speed data pathways. Its 160-pin configuration paired with low power consumption makes it a game-changer for edge computing hardware.

Frequently asked questions

  • Which CPLD model is best for high-density applications requiring 125 pins?

  • How to store ISPLSI-3160-125LQ chips to prevent static damage during handling?

  • QFP vs. BGA: Which package is better for space-constrained PCB designs?

  • Does ALLCHIPS offer customization for ISPLSI-3160-125LQ pin configurations?

  • Is the ISPLSI-3160-125LQ compliant with RoHS and other industry standards?

  • What speed performance does the ISPLSI-3160-125LQ CPLD deliver for logic applications?

  • Why choose surface-mount packaging for the ISPLSI-3160-125LQ in PCB layouts?

  • Which applications benefit most from the ISPLSI-3160-125LQ’s 125-pin QFP design?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeHigh-density electronics (servers, GPUs)Industry: 100-pin QFPOur Base: 125-pin QFP ▲ (ISPLSI-3160-125LQ)Our Advanced: 144-pin BGA ▲▲ (enhanced thermal dissipation)
(Industry: 100 pins for standard applications)(▲ 25% more pins for complex systems)(▲▲ 44% pin increase; requires specialized assembly)
Propagation DelayReal-time data processing (networking)Industry: 10 ns (JEDEC JESD8-22)Our Base: 7.5 ns ▲ (faster response)Our Advanced: 5 ns ▲▲ (ultra-low latency)
(Slower for basic control systems)(▲ 25% faster than industry)(▲▲ 50% faster; may need advanced cooling)
Mounting ComplianceMass production (consumer electronics)Industry: IPC-A-610 Class 2Our Base: IPC-A-610 Class 3 ▲ (military-grade)Our Advanced: Class 3 + enhanced solder joints ▲▲ (vibration-resistant)
(Lower reliability for low-cost devices)(▲ 30% better solder integrity)(▲▲ 50% stronger joints; increases cost)
Thermal PerformanceHigh-power devices (servers, AI chips)Industry: 85°C max (per IEC 60749)Our Base: 105°C ▲ (industrial-grade)Our Advanced: 125°C ▲▲ (automotive/military use)
(Limited to ambient environments)(▲ 23% higher temp tolerance)(▲▲ 47% higher; requires heatsinks)
Logic DensityFPGA/CPLD reconfiguration (IoT systems)Industry: 500 logic cells (ASTM F1249)Our Base: 750 cells ▲ (mid-range flexibility)Our Advanced: 1,000 cells ▲▲ (complex FPGA-like designs)
(Basic reprogrammability)(▲ 50% more cells for customization)(▲▲ 100% increase; larger footprint)
Customization OptionsNiche applications (medical, aerospace)Industry: Standardized designsOur Base: Pin configuration adjustments ▲ (ALLCHIPS)Our Advanced: Full ASIC-like customization ▲▲ (custom die layouts)
(No tailoring for unique needs)(▲ 30% design flexibility)(▲▲ 100% customization; 2x lead time)

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.