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  • FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen
  • FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen
  • FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen
  • FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen
  • FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen
  • FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen
FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen

FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen

$1.50-$15.00/ Piece|1 Piece/Pieces(Min. Order)

Customization:

One-stop OEM Service（Min.Order: 1000 pieces）
View product details

FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Modular Design & Customization: Enables flexible integration into diverse electronic systems through a modular layout, supporting ODM/OEM customization for specific applications.
  • Multi-Connectivity Support: Equipped with a SIM card slot, power/data interfaces, and headers, facilitating IoT, mobile, and industrial automation applications.

Key features

  • 1. Material Technology

    • With FR4 material and OSP/HASL surface finishes, ensure durable, reliable soldering performance in consumer electronics applications compared to alternative materials and finishes*.

  • 2. Interactive Design

    • With a modular layout and customizable jumper pins, easily adapt the PCB to diverse consumer electronics projects, reducing design time versus non-modular boards*.

  • 3. Performance Parameters

    • High-density interconnect capability and reliable surface finishes (OSP/HASL) enable stable signal transmission and compatibility with complex circuit designs, outperforming basic PCB solutions*.

  • 4. Scenario Solutions

    • Designed for consumer electronics applications (e.g., IoT devices, wearables), the SIM card slot and multi-connector layout support mobile connectivity and versatile power/data integration for modern smart devices.

  • 5. Certification Standards

    • With EPR (Germany/France), RoHS, and UL certifications, meet stringent environmental and safety regulations, ensuring market readiness in Europe and globally*.

Product details

FC PCBA ODM OEM Integrated Circuit Board Motherboard Customized in Shenzhen

The FC PCBA ODM OEM Integrated Circuit Board Motherboard is a customizable PCB solution designed for consumer electronics, IoT devices, and industrial automation. Built with FR4 material and featuring modular design, it supports high-density components and connectivity options like SIM slots, making it ideal for mobile and data-driven applications.

Technical specifications

FeatureSpecificationApplication Scenario
MaterialFR4 (Flame Retardant 4)High thermal stability for industrial/automotive use
Surface FinishOSP (Organic Solderability Preservative) or HASL (Hot Air Solder Leveling)Cost-effective OSP for standard use; HASL for high-temperature environments
CertificationsEPR_Germany_Packing, EPR_France_Packing, RoHS, ULCompliance with EU environmental and safety standards
ConnectivitySIM card slot, power/data connectors, headers/socketsIoT devices, mobile electronics, modular systems
DesignModular layout with green solder maskEasy maintenance and customization for specific applications

Customization guide

Adjustable parameters include surface finish selection (OSP/HASL) for thermal or cost requirements, component density, and connector configurations to meet specialized needs like enhanced connectivity or regulatory compliance.

Get inspired

With its SIM card slot and dense component layout, this PCB is perfect for creating smart wearables or IoT sensors. The modular design allows rapid prototyping for consumer electronics or industrial control systems.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Signal DensityStandard (1000/sq m)+15% (1150/sq m)+30% (1300/sq m)
Thermal PerformanceBasic (85°C)Enhanced (+10°C)Premium (+20°C)
CertificationsRoHS, UL+EPR Germany/FranceAll certifications
Component DensityModerateHighUltra-High

Supplier's note

  1. Three Technical Breakthroughs:

    • Certification Compliance: Full EPR and RoHS adherence enables seamless entry into EU markets.
    • Surface Finish Flexibility: Choice between OSP (cost-effective) and HASL (thermal resilience) meets diverse project needs.
    • Modular Design: Simplifies customization for IoT or industrial applications without redesign costs.

  2. Optimal Version Selection:

    • Base Model: Ideal for cost-sensitive projects requiring basic thermal performance (e.g., entry-level consumer devices).
    • Advanced Model: Best for EU-certified IoT devices needing enhanced thermal stability (e.g., smart home sensors).
    • Pro Model: Targets high-performance applications like industrial automation, where ultra-high signal density and triple certifications ensure reliability in严苛 environments.

With the Pro Model’s premium thermal performance, you can handle high-power components in industrial systems. Pair its HASL finish with FR4 material for long-term durability in harsh conditions. The Advanced Model’s EPR certifications streamline compliance for European markets, while the Base Model keeps costs low for mass-produced consumer electronics.

Frequently asked questions

  • Which FC PCBA motherboard model suits consumer electronics with high connectivity needs?

  • How do I maintain the SIM card slot on the FC PCBA motherboard?

  • FR4 vs Aluminum PCB: Which is better for consumer electronics durability?

  • Can I customize the FC PCBA motherboard with a custom microcontroller?

  • Is the FC PCBA surface finish (OSP/HASL) RoHS-compliant?

  • Which FC PCBA motherboard is best for IoT devices requiring EPR compliance?

  • What’s the lead time for ODM FC PCBA motherboards with custom certifications?

  • Does the FC PCBA motherboard support power management for battery-operated devices?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Material CompositionHigh-reliability consumer electronicsFR4 epoxy laminate (ISO 178 flexural strength ≥ 185 MPa)Excellent thermal stability and flame resistance (UL 94 V-0 rated)Higher cost compared to basic materials
Surface FinishHigh-density interconnect applicationsIndustry: HASL (ASTM B201, 15-25 µm)Our Base: OSP (IEC 60068-2-78, 0.05-0.1 µm) ▲Our Advanced: Immersion Gold (IPC-4552, 3-5 µm) ▲▲ (superior corrosion resistance)
Compliance CertificationsEU market entryIndustry: RoHS (2011/65/EU)Our Base: RoHS + UL (UL 796) ▲Our Advanced: RoHS + UL + EPR Germany/France (WEEE 2012/19/EU) ▲▲ (full recyclability)
Modularity/CustomizationRapid prototypingIndustry: Fixed layoutsOur Base: Partial modular sections (ISO 9001) ▲Our Advanced: Full modular architecture (IEC 61131-2) ▲▲ (easy component upgrades)
Connectivity OptionsIoT devices with cellular connectivityIndustry: Basic USB/UARTOur Base: USB + I2C ▲Our Advanced: SIM slot + Bluetooth 5.0 + Wi-Fi 6 (IEEE 802.11ax) ▲▲ (seamless ecosystem integration)
Thermal ManagementHigh-power consumer electronicsIndustry: Natural convectionOur Base: Thermal vias (IPC-2221) ▲Our Advanced: Embedded heat sinks + forced air (ASTM E1461, ≥ 200 W/m·K) ▲▲ (optimal under load)

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