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  • FZH695 QSOP24 integrated circuit chip FZH695
  • FZH695 QSOP24 integrated circuit chip FZH695
  • FZH695 QSOP24 integrated circuit chip FZH695
  • FZH695 QSOP24 integrated circuit chip FZH695
  • FZH695 QSOP24 integrated circuit chip FZH695
  • FZH695 QSOP24 integrated circuit chip FZH695
FZH695 QSOP24 integrated circuit chip FZH695

FZH695 QSOP24 integrated circuit chip FZH695

  • 1 - 99 Pieces
    $1.68
  • 100 - 999 Pieces
    $1.48
  • >= 1000 Pieces
    $1.38

Customization:

Graphic customization（Min.Order: 5000 pieces）
Customized logo（Min.Order: 5000 pieces）
Customized packaging（Min.Order: 5000 pieces）
View product details

FZH695 QSOP24 integrated circuit chip FZH695

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Performance Signal Processing: The FZH695 QSOP24 integrated circuit chip is designed for advanced digital and analog signal processing, enabling efficient data transmission and control in electronic systems.
  • Versatile Connectivity: Equipped with 24 pins in a QSOP (Quad Small Outline Package) configuration, it supports multiple I/O interfaces for seamless integration into complex circuit designs.

Key features

  • 1. Material Technology

    • With silicon semiconductor material, you can achieve high reliability and efficient heat dissipation, ensuring stable performance in high-temperature environments* compared to through-hole mounted components.

  • 2. Interactive Design

    • With the compact QSOP24 package, you can achieve precise pin alignment and simplified surface mount assembly, reducing production time by up to 30%* compared to traditional DIP packages.

  • 3. Performance Parameters

    • With a high-frequency operating capability, you can process signals at speeds up to [X] MHz, enhancing system responsiveness by 40%* compared to standard ICs in similar applications.

  • 4. Scenario Solutions

    • With surface mount technology (SMT), you can integrate the FZH695 into space-constrained designs, enabling sleek, modern electronics like wearable devices or IoT modules.

  • 5. Certification Standards

    • With RoHS compliance, you can ensure environmental responsibility and meet regulatory requirements for global markets*.

Product details

FZH695 QSOP24 integrated circuit chip FZH695

The FZH695 QSOP24 integrated circuit chip combines compact design with robust performance, tailored for modern electronics. Its surface-mount technology (SMD) enables seamless integration into high-density PCB layouts, while its QSOP24 package ensures reliable operation in diverse applications.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeQSOP24 (24-pin Quad Flat)High-density digital systems, embedded devices
Mounting TypeSurface Mount (SMD)Automated assembly in consumer and industrial electronics
MaterialSilicon semiconductorReliable performance in power and logic circuits
Operating Temp-40°C to +85°CHarsh environmental conditions

Customization guide

Adjustable parameters such as thermal resistance and pin configuration can be tailored to meet specific power requirements or space constraints. For instance, optimizing thermal performance ensures compatibility with high-power applications.

Get inspired

With QSOP24 packaging, you can achieve dense PCB layouts while maintaining thermal efficiency. The SMD design simplifies mass production, making it ideal for IoT devices, automotive systems, and industrial controls.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal Resistance50°C/W40°C/W (-20%)30°C/W (-40%)
Max Power Handling1W1.5W (+50%)2W (+100%)
Operating Temp Range-40°C to +85°C-40°C to +105°C-55°C to +125°C

Supplier's note

  1. Technical Breakthroughs:

    • The Pro model’s 30°C/W thermal resistance outperforms industry benchmarks by 40%, enabling stable operation in high-heat environments.
    • The Advanced model’s 1.5W power handling (20% higher than traditional SMD ICs) supports compact power-dense designs.
    • The Base model’s cost-optimized design reduces BOM expenses by 15% while maintaining core functionality.

  2. Version Selection Guidance:

    • Base Model: Ideal for basic embedded systems or low-power IoT devices where cost is prioritized.
    • Advanced Model: Perfect for consumer electronics needing enhanced thermal performance, such as wearables or smart home devices.
    • Pro Model: Best suited for industrial automation, automotive, or aerospace applications requiring extreme temperature and power resilience.

With the Pro’s tripled thermal tolerance compared to legacy solutions, you can safely deploy in harsh environments. Pair its low thermal resistance with high power capacity to create ruggedized systems that outlast competitors.

Frequently asked questions

  • Which QSOP24 IC is best suited for high-density PCB designs in embedded systems?

  • What materials are used in the FZH695 QSOP24 IC, and how do they benefit performance?

  • Is the FZH695 IC RoHS-compliant for EU electronics projects?

  • Can the FZH695 QSOP24 IC be customized for specific digital applications?

  • Which IC package handles high-power applications better: QSOP24 or TO-220?

  • What makes the FZH695 SMD IC ideal for compact electronic devices?

  • How does the QSOP24 package of the FZH695 IC manage heat compared to DIP packages?

  • Is the FZH695 QSOP24 compatible with automated SMT assembly lines?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
TO-220 Power TransistorPower supplies, amplifiersPackage: TO-220 (100W+ power handling, JEDEC JESD22-B101)
Thermal: 1.5°C/W (IEC 60747-14)		▲ High power capacity ▲
Excellent heat dissipation		Bulky size (22.5mm × 10mm)
Less space-efficient
SOT-23 SMT TransistorPortable devices, embedded systemsSize: 3mm × 1.5mm (IPC-7351)
SMT-compliant (IPC-7351 Class 3)		Ultra-compact design ▲
Easy SMT assembly		Limited power handling (≤1W)
Delicate for manual handling
DIP 8-Pin ICPrototyping, through-hole boardsThrough-hole mounting
Manual soldering-friendly (IPC-A-610)		Easy prototyping ▲
Robust mechanical stability		Large footprint (14.3mm × 7.6mm)
Lower density
QSOP24 Base (FZH695)Compact electronics, IoT devicesPackage: QSOP24 (7mm × 5mm, 24 pins)
Frequency: 50MHz (IEC 60747-5-5)		High pin density ▲
Surface-mount compatibility		Moderate thermal performance (2.0°C/W)
Requires SMT assembly
QSOP24 Advanced (FZH695)High-performance systems, dense PCBsPackage: QSOP24 (7mm × 5mm)
Frequency: 100MHz ▲
Thermal: 0.8°C/W ▲		▲ 2× faster signal processing ▲
30% better thermal ▲
Same compact size		Higher cost ▲
Steeper learning curve for prototyping
High-Power SOT-223 TransistorSMT-based power circuitsPackage: SOT-223 (50W+, JEDEC)
Thermal: 0.8°C/W (IEC 60747-14)		▲ SMT-friendly high-power option ▲
Improved thermal vs SOT-23		Larger than SOT-23 (7mm × 4mm)
Costlier than standard SOT-23

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