Material Purity | Semiconductor fabrication, lab equipment | Industry Standard: 99.9% SiO₂ (ISO 17025) Our Base: 99.95% SiO₂ (ASTM E1359) Our Advanced: 99.99% SiO₂ (JIS R 3102) | ▲ Base: 0.05% purity boost for reduced impurities ▲ Advanced: 0.04% further improvement for high-precision optics | Higher purity increases cost by ~20–30% compared to industry standard |
Thickness | Lightweight fixtures, aerospace parts | Industry Standard: 3.0mm (ISO 3801) Our Base: 2.5mm (▲ 17% thinner) Our Advanced: 2.0mm (▲ 33% thinner) | ▲ Advanced: 20% weight reduction for easier handling in optical assemblies | Thinner sheets may require reinforcement for high-stress semiconductor tools |
Thermal Resistance | High-temperature furnaces, reactors | Industry Standard: 1200°C (ASTM C330) Our Base: 1250°C (▲ 4% higher) Our Advanced: 1300°C (▲ 8% higher) | ▲ Advanced: Withstands semiconductor furnace cycles without deformation | Prolonged exposure above 1250°C may require protective coatings for Base tier |
Chemical Resistance | Acidic/alkaline environments | Industry Standard: Resists 10+ chemicals (ASTM D543) Our Base: 20+ chemicals (▲ 100% more) Our Advanced: 30+ chemicals (▲ 50% over Base) | ▲ Advanced: Safe for harsh semiconductor etching chemicals like HF (0.5% concentration) | Base tier may degrade in prolonged contact with strong oxidizers like nitric acid |
Processing Flexibility | Custom optical lenses, sensor components | Industry Standard: Limited bending/punching Our Base: Precision bending (radius ≥50mm) Our Advanced: Ultra-precision welding (gap <0.1mm) | ▲ Advanced: Enables seamless integration into complex semiconductor tooling | Advanced tier requires specialized equipment, increasing lead times by 2–3 days |
Transparency & Frosted Finish | Lighting diffusers, display panels | Industry Standard: Opaque (transmittance <5%) Our Base: Frosted (transmittance 15–20%) Our Advanced: Diffused (transmittance 30% with light scattering) | ▲ Advanced: Ideal for evenly distributing light in medical imaging devices | Frosted finish may reduce optical clarity in high-precision semiconductor apps |