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  • For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits
  • For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits
  • For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits
  • For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits
  • For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits
  • For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits
For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits

For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits

$0.88-$1.00/ Piece|1 Piece/Pieces(Min. Order)
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For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Programmable Logic Solutions: Designed for flexible hardware customization in Xilinx Spartan-6 FPGAs, enabling reconfigurable digital circuit design and prototyping.
  • 3D IC Integration: Supports advanced 3D integrated circuits (ICs) for high-density, multi-layered chip designs, optimizing performance and space efficiency in complex systems.

Key features

  • 1. Corrosion-Resistant Metallic Packaging

    • Material Technology

  • 2. Reconfigurable Logic Architecture

    • Interactive Design

  • 3. 3D IC Integration for Enhanced Performance

    • Performance Parameters

  • 4. Versatile Scenario Solutions

    • Scenario Solutions

  • 5. Certified Genuine Components

    • Certification Standards

Product details

For xilinx spartan 6 FPGAs and 3D ICs In Stock Original and New Ic Integrated Circuits

The Xilinx Spartan® 6 FPGA and 3D IC packaging solution combines robust protection with precise engineering, designed for high-reliability applications. The metallic foil and cylindrical container ensure environmental safeguarding, while customizable labeling enables seamless integration into diverse workflows.

Technical specifications

FeatureSpecificationBenefit
Packaging MaterialAluminum foil with metallic containerWith moisture/light protection, you can preserve component integrity during storage/transport.
Labeling SystemQR code + barcodes + customizable textWith trackable labeling, you can streamline inventory management and quality control.
ApplicationFPGA/3D IC integrationWith compatibility for Xilinx Spartan 6, you can deploy in embedded systems, industrial control, and high-density logic designs.

Customization guide

Adjust label content (e.g., specifications, safety warnings, or application codes) to meet specialized requirements for industry-specific certifications or custom traceability protocols.

Get inspired

Leverage the Spartan 6 FPGA’s low-power architecture and 3D IC integration for compact, high-performance designs. Ideal for applications ranging from aerospace systems to smart IoT devices.

Choose your model

ParameterBase Model (Spartan-6 LX Series)Advanced Model (Spartan-6 LX45)Pro Model (Spartan-6 LX230T)
FPGA Density10,000–45,000 LCs45,000 LCs230,000 LCs
I/O Count100–200 pins200 pins400 pins
Package TypeTQFP/BGAEnhanced BGA with thermal pads3D IC stacked die for 20% smaller footprint*

Supplier's note

  1. Technical Breakthroughs:

    • 3D IC Stacking: The Pro Model’s 3D architecture reduces latency by 30% compared to 2D FPGAs, enabling high-speed data processing.
    • Low-Power Design: Spartan-6’s 90nm process ensures 40% lower power consumption than prior generations, ideal for battery-operated systems.
    • Customizable I/O: The Pro Model’s 400 pins offer 100% more connectivity options, supporting complex multi-channel applications.

  2. Optimal Version Selection:

    • Base Model: Suitable for cost-sensitive projects (e.g., basic IoT sensors) requiring up to 45,000 LCs.
    • Advanced Model: Ideal for moderate-density applications (e.g., industrial controllers) needing enhanced thermal management.
    • Pro Model: Choose for high-performance tasks (e.g., AI accelerators) where 230,000 LCs and 3D stacking deliver unmatched compute density.

*Compared to industry-standard 2D FPGA packages.

Frequently asked questions

  • Which Xilinx FPGA model is best suited for low-power embedded systems?

  • How should Xilinx Spartan 6 FPGAs be stored to maintain their integrity?

  • What are the benefits of aluminum packaging for ICs compared to plastic?

  • Can the labels on the Spartan 6 FPGA packaging be customized with company branding?

  • Are these ICs compliant with RoHS and other international standards?

  • What makes the cylindrical container design effective for protecting 3D ICs?

  • How does the metallic packaging ensure protection against environmental damage?

  • Can I request custom labeling with specific technical specifications for bulk orders?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Programmable Logic Devices (FPGA)Rapid prototyping, embedded systems4 DSP slices ▲
450 MHz max frequency (meets PCIe Gen2)
1000+ I/O pins (exceeds 800-pin industry standard)		Flexible reconfiguration via JTAG (IEEE 1149.1)
Low latency for real-time apps		Higher power consumption (2.5W vs. ASIC’s 1.2W)
Costly licensing for tools
High-Performance Computing (HPC)Data centers, AI accelerators28 nm process ▲
180,000 LUTs (vs. 100,000 in Spartan 3)
48-bit address space (ISO/IEC 2382)		Parallel processing for ML workloads
Scalable for FPGA clusters		Limited memory bandwidth (128 MB vs. GPU’s 16 GB)
Requires custom coding
Industrial AutomationRobotics, sensor networks-40°C to 100°C temp range (MIL-STD-810G)
ESD protection (IEC 61000-4-2)		Rugged for harsh environments
Low power for edge devices		Complex integration with legacy systems
Slower than PLCs for simple tasks
3D Stacked MemoryMobile devices, VR headsets16-layer stack ▲
1.2 Tbps bandwidth (JEDEC JESD22-C112)
0.8 mm profile (RoHS-compliant)		High density for compact designs
Low latency access to memory		Thermal throttling risks (85°C max)
Higher cost per bit vs. 2D NAND
Multi-Chip Modules (MCM)Wearables, IoT sensors0.5 mm pitch BGA ▲
200 µm interconnect spacing (IPC-7351)
10% smaller footprint		Space-saving for miniaturized devices
Improved signal integrity		Fragile during soldering
Complex thermal management
Embedded SystemsAutomotive ECUs, medical devicesASIL-B compliance (ISO 26262)
256 KB Block RAM (IEEE 1687)
50+ safety features		Safety-certified for critical systems
Low power (0.5W idle mode)		Limited customization post-production
Higher BOM cost vs. MCU solutions

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