Full Automatic Epoxy Resin Pump and Motor Based Rotating Red Glue Dispenser Machine for Mobile Phone Shells

Technical specifications

Customization guide

Adjustable parameters such as dispensing speed (0.5–5ml/min), rotation angle (0–360°), and material viscosity thresholds allow customization to meet specific production needs. For example, slower speeds ensure precise bonding in delicate electronics, while higher angles improve coverage in complex geometries.

Get inspired

With its modular design and high-precision motor, this machine transforms adhesive application for industries like consumer electronics, automotive, and aerospace. Whether you need to seal phone shells or assemble intricate components, this dispenser ensures consistency and reduces waste.

Choose your model

Supplier's note

1. Three Breakthroughs:

   • Certification Compliance: The 2006/42/EC certification ensures seamless integration into EU-regulated factories.
   • Modular Precision: The Pro model’s ±0.01mm accuracy enables bonding in high-tolerance electronics (e.g., smartphone screens).
   • Scalable Load Capacity: The Pro’s 12kg load handles heavy-duty tasks, outperforming industry benchmarks by 30%.

2. Version Selection Guide:

   • Base Model: Ideal for small-scale production or low-viscosity adhesives (e.g., basic phone shell assembly).
   • Advanced Model: Suitable for medium-volume tasks requiring ISO 9001 quality assurance (e.g., automotive component bonding).
   • Pro Model: Best for high-precision, heavy-load applications (e.g., aerospace parts or premium smartphone assembly). With its triple-certification, it ensures safety and reliability in complex environments.

With the Pro’s 30% higher precision than industry standards, you can achieve flawless adhesion in delicate electronics. Pair its robust load capacity with epoxy resin compatibility to handle even the most demanding assembly lines.