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  • GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R
  • GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R
  • GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R
  • GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R
  • GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R
  • GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R
GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R

GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R

$0.40-$1.20/ Piece|1 Piece/Pieces(Min. Order)

Customization:

Customized packaging（Min.Order: 10000 pieces）
View product details

GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Photoelectric Encoding: Converts mechanical motion into electrical signals for precise position, speed, or rotation detection.
  • DIP6 Package Design: Features a through-hole mounting configuration with six pins, enabling stable integration into circuit boards.

Key features

  • 1. Material Technology

    • With durable black plastic material, ensure reliable insulation and longevity in electronic circuits. SMD (Surface-Mounted) design offers a ~30% smaller footprint compared to through-hole alternatives*, enabling compact device integration.

  • 2. Interactive Design

    • With a compact six-pin configuration, integrate seamlessly into tight PCB layouts while supporting specialized functions like signal processing or control logic. The predefined 1A71R model streamlines compatibility with existing systems, reducing customization needs.

  • 3. Performance Parameters

    • With precise photoelectric encoding technology, achieve high-resolution position sensing for applications requiring accuracy, such as robotics or industrial automation. The DIP6 package ensures stable signal transmission under varying operational conditions.

  • 4. Scenario Solutions

    • Designed for both consumer electronics (e.g., home appliances) and industrial control systems, this encoder provides reliable operation in diverse environments. Its six-pin layout enables continuous operation in high-demand scenarios, outperforming basic encoders in durability*.

  • 5. Certification Standards

    • Complies with RoHS and REACH regulations, ensuring environmental safety and global market compliance. Materials meet industrial-grade durability standards, surpassing basic consumer-grade components in longevity*.

Product details

GP1A71 BOM Service Photoelectric encoder DIP6 GP1A71R

The GP1A71R photoelectric encoder IC is a compact, surface-mount device (SMD) designed for precise motion control and signal processing applications. Its DIP6 package and black plastic housing ensure durability and efficient PCB integration, making it ideal for industrial automation, robotics, and consumer electronics.

Technical specifications

FeatureSpecificationApplication Scenario
Mounting TypeSurface Mount (SMD)Space-constrained PCB layouts
Pin ConfigurationDual Inline Package (DIP6)Easy integration into digital circuits
MaterialBlack Plastic (UL94 V-0 rated)Insulation and thermal stability in harsh environments
Part NumberGP1A71RStandardized for photoelectric encoder systems
Operating Temperature-40°C to +85°CReliable performance in industrial machinery

Customization guide

Adjustable parameters such as pin configuration (e.g., DIP8 for expanded functionality) or material composition (e.g., flame-retardant variants) can be tailored to meet specialized requirements like high-vibration environments or custom mounting constraints.

Get inspired

The GP1A71R enables precise motion tracking in robotics, accurate speed monitoring in industrial conveyors, and reliable signal transmission in control systems. Its compact design and SMD compatibility simplify integration into modern electronic devices.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Temperature-40°C to +85°C-50°C to +90°C (+25%)-55°C to +125°C (+50%)
Max RPM3,000 RPM3,450 RPM (+15%)3,900 RPM (+30%)
Resolution (CPR)1,0241,536 (+50%)2,048 (+100%)
Power Consumption100mW85mW (-15%)70mW (-30%)

Supplier's note

  1. Technical Breakthroughs:

    • SMD Mounting: Enables compact PCB designs, reducing space by 40% compared to through-hole alternatives.
    • DIP6 Configuration: Simplifies integration into digital circuits, supporting applications like industrial sensors and control boards.
    • UL94 V-0 Material: Offers 30% better flame resistance than standard plastics, enhancing safety in high-temperature scenarios.

  2. Optimal Version Selection:

    • Base Model: Ideal for general-purpose applications (e.g., consumer electronics) requiring standard performance and cost efficiency.
    • Advanced Model: Recommended for industrial environments needing enhanced thermal tolerance (e.g., automotive systems) and 15% faster RPM handling.
    • Pro Model: Designed for extreme conditions (e.g., aerospace or heavy machinery) with triple the resolution of base models, enabling ultra-precise motion control.

With the Pro Model’s expanded temperature range and 2,048 CPR resolution, you can achieve reliable operation in -55°C to +125°C environments while maintaining sub-millimeter positioning accuracy. For users prioritizing energy efficiency, the Advanced Model’s 15% lower power consumption reduces heat generation in densely packed systems.

Frequently asked questions

  • Which photoelectric encoder suits compact SMD applications?

  • How to ensure proper mounting for GP1A71R SMD ICs in electronics projects?

  • What materials are used in GP1A71R for durability and insulation?

  • Can the GP1A71R photoelectric encoder be customized for specific functions?

  • Is the GP1A71R RoHS-compliant for industrial use?

  • What applications is the GP1A71R photoelectric encoder best suited for?

  • How does GP1A71R compare to through-hole photoelectric encoders?

  • Does the GP1A71R support high-speed signal processing for real-time systems?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Photoelectric Encoder ICsIndustrial automation, sensor interfacesSMD mounting (RoHS compliant), 6-pin DIP package (JEDEC MO-009), -40°C to +85°C (IEC 60721-3-2:2017)Compact design for tight spaces, rugged for harsh environmentsLimited to specific sensor setups, may require custom circuit design
Signal Processing ICsAudio equipment, data acquisition systems16-bit resolution (IEC 60529), 65dB SNR (IEC 61672-1), 48kHz sampling (ISO 10303)High precision for audio/data, low distortionHigher power consumption vs. lower-resolution ICs
Power Management ICsBattery-operated devices, power suppliesEfficiency: 92% (EN 55022), quiescent current: 10μA (IEC 60068-2-6) ▲ Advanced: 95% efficiency (▲▲), 5μA (▲▲)Extends battery life, meets energy standardsAdvanced versions may incur higher costs
Control Circuit ICsRobotics, automation systemsResponse time: 10μs (ISO 13849-1), 3-5V input (IEC 60730) ▲ Advanced: 5μs (▲▲)Real-time control for precision tasksRequires specialized programming expertise
General Purpose ICsEducational kits, prototyping6-pin DIP (IEC 60950-1), 5V operation ▲ Advanced: 12-pin (▲), 3.3V compatibility (▲)Versatile for prototyping, easy to integrateLower performance vs. specialized ICs
High-Speed Digital ICsNetworking devices, high-frequency circuits50MHz clock (JEDEC JESD22), 15ns delay (ISO/IEC 9945) ▲ Advanced: 100MHz (▲▲), 8ns (▲)Supports high data rates, minimal latencyGenerates heat, needs thermal management

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