H9tp32a8 Font Library 162 Ball Emcp 32 8 Mobile Phone Memory Chip H9tp32a8jdac

Name: H9tp32a8 Font Library 162 Ball Emcp 32 8 Mobile Phone Memory Chip H9tp32a8jdac
Brand: Shenzhen Jiahuahuiming Trade Co., Ltd.
SKU: 1600809428632_1
Price: 0.01 USD
Availability: InStock
Rating: 4.8 (100 reviews)

Product overview

Core functionalities

Applicable scenarios

Unique advantages

High-Performance Memory Storage: Designed for embedded applications in mobile devices, the H9TP32A8JDAC is an 162-ball EMCP (Embedded Multi-Chip Package) memory chip offering compact, high-capacity storage and efficient data processing.
Integrated Circuit Optimization: Combines memory and control functionalities in a single package, enabling seamless operation in space-constrained electronic devices like smartphones and wearable tech.

Key features

1. Advanced Material Technology for Durability

With a corrosion-resistant black protective coating, this SKhynix H9TP32A8JDAC memory chip ensures reliable performance in diverse environments. Its compact, metal/plastic construction withstands thermal and mechanical stress better than standard plastic封装 chips*, enabling stable operation in mobile devices.

2. Space-Efficient Embedded Multi-Chip Package (EMCP) Design

The 162-ball EMCP design allows seamless integration into compact mobile phone architectures, saving 30% more space than traditional discrete memory solutions*. Its rectangular shape with rounded corners optimizes board layout for slim smartphones and wearable devices.

3. High-Performance Data Access for Mobile Applications

With a fast read/write speed optimized for mobile SoCs, this chip delivers quick app launches and smooth multitasking—up to 20% faster than legacy LPDDR4X modules*. Its 32GB capacity supports high-resolution displays and advanced AI features in modern smartphones.

4. Tailored for Mobile Device Constraints

Designed specifically for space-constrained mobile phones, this chip balances power efficiency and performance, enabling prolonged battery life without sacrificing functionality. Its low-power operation addresses the key challenge of battery-intensive applications like gaming or video streaming.

5. Industry-Standard Compliance for Trust

Certified to RoHS and JEDEC standards, this chip guarantees eco-friendly manufacturing and compatibility with global regulatory requirements. This ensures safe integration into consumer electronics while minimizing environmental impact compared to non-certified alternatives*.

Product details

The SK Hynix H9TP32A8JDAC is a compact 162-ball EMCP (Embedded Multi-Chip Package) memory chip designed for mobile devices. Combining 32GB NAND flash and 8GB LPDDR4X memory in a small form factor, it delivers high-performance storage and efficient data handling for smartphones and tablets.

Technical specifications

Feature	Specification	Application Scenario
Package Type	162-Ball EMCP	Space-constrained mobile devices
Memory Configuration	32GB NAND + 8GB LPDDR4X	Multi-tasking, app storage, OS operations
Operating Voltage	1.8V	Low-power mobile applications
Compliance Standard	JEDEC JESD22-C101 (reliability)	Industrial-grade quality assurance
Operating Temp.	-40°C to 85°C	Harsh environmental conditions

Customization guide

Adjustable parameters include memory density (e.g., 16GB+4GB for budget devices) and interface speed (e.g., LPDDR5 for high-end models) to meet specific power consumption or performance needs.

Get inspired

With its 162-ball EMCP package, this chip enables sleek, slim smartphone designs while supporting seamless multitasking. Its low-power LPDDR4X memory ensures prolonged battery life for users demanding both speed and efficiency.

Choose your model

Parameter	Base Model (H9TP32A8JDAC)	Advanced Model	Pro Model
Capacity	32GB + 8GB	64GB + 16GB	128GB + 32GB
Read Speed	1866Mbps	+25% (2333Mbps)	+50% (2800Mbps)*
Power Consumption	0.8W	-15%	-30%
Thermal Stability	85°C	95°C	105°C

Supplier's note

Technical Breakthroughs:
- High-Density Packaging: The 162-ball EMCP reduces footprint by 20% compared to traditional discrete chips.
- Low-Voltage Operation: 1.8V design cuts power use by 25% versus older LPDDR4 standards.
- Thermal Efficiency: Enhanced heat dissipation enables stable operation at 105°C in Pro models.
Version Selection Guidance:
- Base Model: Ideal for entry-level smartphones needing reliable performance without premium costs.
- Advanced Model: Targets mid-range devices requiring faster app loading (e.g., gaming phones).
- Pro Model: Best for flagship devices handling 4K video editing or AI workloads, with triple the endurance of industry benchmarks.

Example: With the Pro Model’s 2800Mbps read speed, users can stream 8K content seamlessly. Its 105°C thermal tolerance ensures stability even in high-power 5G setups.

Frequently asked questions

Which SKhynix memory chip model is best suited for mobile phones requiring 32GB storage capacity?
How do I ensure proper handling and storage of the H9TP32A8JDAC memory chip to maintain longevity?
What materials make the H9TP32A8JDAC chip suitable for high-reliability electronics compared to other memory chips?
Can the H9TP32A8JDAC memory chip be customized for specific IoT device requirements?
Is the H9TP32A8JDAC memory chip JEDEC-compliant and RoHS-certified?
Does the H9TP32A8JDAC support high-speed data transfer for 5G-enabled smartphones?
What makes the H9TP32A8JDAC’s compact size advantageous for wearable electronics?
How does the H9TP32A8JDAC handle thermal stress in automotive or industrial applications?

Product comparison

Category	Usage Scenarios	Characteristics	Advantages	Disadvantages
EMCP (Embedded Multi-Chip Package)	Budget smartphones, IoT devices	Combines 8GB LPDDR4X + 32GB eMMC (Industry Standard: 4GB+16GB ▲▲), 1.1V power (IEC 60068-2-6)	Space-efficient, lower BOM cost, simplified design	Limited upgradability, slower sequential read/write speeds
LPDDR5 Mobile DRAM	High-end smartphones, 5G devices	6.4 Gbps bandwidth (JEDEC Standard: 5.2 Gbps ▲), 1.05V power (JEDEC JESD209-5)	Faster data transfer, lower latency, energy-efficient	Higher cost, requires advanced power management circuits
eMMC Storage	Mid-range smartphones, automotive systems	2.7 Gbps interface (Industry: 1.8 Gbps ▲), 32-layer NAND (JEDEC JESD22-A116)	Compact form factor, reliable in harsh environments	Lower sequential speeds vs UFS, limited scalability
UFS 3.1 Flash Storage	Flagship smartphones, tablets	2.1 GB/s read (Industry: 1.5 GB/s ▲▲), 2.5V operation (JEDEC JESD220-3)	High sequential speeds, parallel processing capability	Higher cost, requires complex controller integration
Traditional NAND Flash	Enterprise storage, legacy systems	1.5 GB/s read (Industry: 1.2 GB/s ▲), 3.3V operation (JEDEC JESD219A)	Cost-effective for bulk storage, widely compatible	Large footprint, slower interface speeds, power-hungry
SK Hynix H9TP32A8JDAC (EMCP)	High-volume smartphones, wearables	162-ball BGA package (ISO 9001-certified), 32GB + 8GB (Industry: 16GB + 4GB ▲▲▲)	Optimized for compact devices, 20% lower power than竞品 (JEDEC JESD22-A116)	Customized capacity only, limited to specific form factors