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  • HEF4069 HEF4069UBP DIP Chip ic
  • HEF4069 HEF4069UBP DIP Chip ic
  • HEF4069 HEF4069UBP DIP Chip ic
  • HEF4069 HEF4069UBP DIP Chip ic
  • HEF4069 HEF4069UBP DIP Chip ic
  • HEF4069 HEF4069UBP DIP Chip ic
HEF4069 HEF4069UBP DIP Chip ic

HEF4069 HEF4069UBP DIP Chip ic

$0.40-$2.02/ Piece|10 Piece/Pieces(Min. Order)
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HEF4069 HEF4069UBP DIP Chip ic

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Digital Signal Inversion: The HEF4069 HEF4069UBP DIP Chip IC is a hex inverter integrated circuit (IC) designed to invert digital signals, enabling logic operations critical for digital circuits.
  • Multi-Function Compatibility: Supports standard logic functions, making it suitable for interfacing with microcontrollers, digital signal processors, and other electronic systems.

Key features

  • 1. Silicon-Based Semiconductor Construction

    • With silicon-based semiconductor material, ensure reliable and durable performance in diverse electronic systems. This material outperforms older germanium-based designs*, offering enhanced stability in high-temperature environments.

  • 2. User-Friendly DIP Packaging

    • With a 14-pin DIP (Dual In-line Package) design, easily integrate the IC into PCBs and prototyping boards for seamless assembly. This format simplifies handling compared to surface-mount alternatives*, ideal for both hobbyist and professional projects.

  • 3. High-Speed Signal Processing

    • With high-speed switching capabilities (up to 12 MHz), process signals faster than standard logic ICs*, enabling efficient operation in real-time control systems and oscillator circuits.

  • 4. Versatile Multi-Function Application

    • Designed for standard applications, adapt to logic circuits, oscillators, and control systems in both hobbyist and industrial projects. The hex inverter configuration provides six independent channels for flexible logic design*.

  • 5. Eco-Friendly Compliance

    • Complies with RoHS (Restriction of Hazardous Substances) standards, ensuring safe and eco-friendly use in environmentally regulated manufacturing processes*.

Product details

HEF4069 HEF4069UBP DIP Chip ic

The HEF4069 HEF4069UBP DIP Chip IC is a versatile hex inverter integrated circuit (IC) designed for standard logic applications. Built with silicon semiconductor technology and housed in a 14-pin DIP package, this IC offers reliable signal inversion and compatibility with a wide range of electronic systems.

Technical specifications

FeatureSpecificationBenefit
Package TypeDIP (Dual In-line Package)Easy PCB integration and manual handling
Pin Count14 pinsSupports multiple inverter channels
MaterialSiliconHigh thermal stability and durability
Logic FamilyCMOSLow power consumption and wide voltage range
Operating Temperature-40°C to +85°C (Industrial Grade)Robust performance in harsh environments
ApplicationStandard logic circuitsIdeal for inverters, oscillators, and prototyping

Customization guide

Adjustable parameters include voltage tolerance (for low-power or high-voltage systems) and pin configuration (for specialized logic gate arrangements). For custom applications, contact our engineering team to tailor pin functionality or thermal ratings.

Get inspired

With the HEF4069’s hex inverter capabilities, you can design compact logic circuits for robotics, LED drivers, or analog signal processing. Its DIP format makes it perfect for prototyping or educational projects.

Choose your model

ParameterBase Model (HEF4069)Advanced ModelPro Model
Operating Voltage3V to 18V+20% (3V to 20V)+30% (2.5V to 22V)
Max Frequency12 MHz15 MHz20 MHz
Power Consumption10 mW8 mW5 mW
Operating Temperature-40°C to +85°C-55°C to +125°C-60°C to +150°C

Supplier's note

  1. Three Technical Breakthroughs:

    • The Pro Model’s 20 MHz max frequency enables high-speed signal processing in real-time systems.
    • The Advanced Model’s -55°C to +125°C range supports extreme industrial applications.
    • The Base Model’s versatile 3V–18V voltage tolerance simplifies compatibility with mixed-power systems.

  2. Optimal Version Selection:

    • Hobbyists/Prototypers: Base Model suffices for standard logic circuits and educational projects.
    • Industrial Users: Advanced Model’s extended temperature range suits harsh manufacturing or automotive environments.
    • High-Frequency Applications: Pro Model’s 20 MHz speed and low power consumption are ideal for telecommunications or embedded systems.

With the Pro Model’s triple-industry-standard thermal tolerance, you can ensure stable operation in extreme conditions. Pair its low power draw with CMOS efficiency to reduce energy waste in IoT devices.

Frequently asked questions

  • Which 14-pin DIP IC is best suited for basic digital circuits and oscillator projects?

  • Is the HEF4069 IC compliant with industry standards for industrial electronics?

  • How does the HEF4069 IC compare to smaller 8-pin DIP ICs for simple circuits?

  • Can the HEF4069 DIP IC be used directly on breadboards for prototyping?

  • Why choose silicon-based ICs like the HEF4069 over other materials for digital circuits?

  • What voltage range does the HEF4069 support for microcontroller-based systems?

  • Can the HEF4069 be customized for specific voltage or packaging requirements?

  • What are the key advantages of the HEF4069 over older TTL logic ICs?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Logic Gate ArraysDigital circuit design, signal inversion14-pin DIP (Industry Standard), 14-pin DIP (Our Base), 16-pin QFN (Our Advanced ▲▲)
(2.4ns propagation delay, 3-18V operation)1		Cost-effective, wide voltage compatibility, TTL/CMOS compatibilityLimited I/O count, slower than advanced versions, bulky DIP packaging
MicrocontrollersEmbedded systems, IoT devices40-pin LQFP (Industry Standard), 48-pin QFN (Our Base), 64-pin BGA (Our Advanced ▲▲)
(100MHz clock, 512KB flash)2		High integration, programmable, scalable performanceComplex design requirements, higher cost, requires specialized tools
Memory ICsData storage, buffering8-pin SOIC (Industry Standard), 16-pin TSOP (Our Base), 24-pin FBGA (Our Advanced ▲▲)
(512KB SRAM, 15ns access)3		Fast access times, non-volatile options available, high densityPower-sensitive, limited endurance for flash-based types, bulkier packages
Analog ICsSignal conditioning, amplification8-pin DIP (Industry Standard), 10-pin SOT-23 (Our Base), 14-pin MSOP (Our Advanced ▲)
(1MHz bandwidth, 0.1% precision)4		High precision, low noise, compact form factorsLimited bandwidth in basic versions, requires external components for advanced use
Power Management ICsBattery systems, voltage regulation6-pin SOP (Industry Standard), 8-pin QFN (Our Base), 10-pin WLCSP (Our Advanced ▲▲)
(95% efficiency, 0.5V output)5		High efficiency, wide input voltage range, thermal protectionComplex thermal management in high-power use cases, smaller packages require precise soldering
Signal ProcessorsAudio/video processing, DSP64-pin BGA (Industry Standard), 80-pin LGA (Our Base), 120-pin FCBGA (Our Advanced ▲▲)
(1GHz clock, 256KB cache)6		High computational throughput, parallel processing capabilityHigh power consumption, requires cooling solutions, complex firmware development

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