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HUAWEI EX2 TN82EX2 TN8D000EX2 EX4 for Huawei PTN 1900 PTN1900 PTN 3900 PTN3900

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Telecommunications Processing: Designed for high-capacity telecommunications and networking equipment, this electronic circuit board facilitates efficient data transmission and processing.
  • Heat Management: Equipped with large heatsinks, the board ensures optimal performance by effectively dissipating heat generated during operation.

Key features

  • 1. Advanced Material Technology

  • With a green FR4 PCB, you benefit from excellent electrical properties and mechanical strength, ensuring reliable performance in telecommunications applications.

  • 2. Efficient Heat Management

  • With integrated large heatsinks, you can achieve efficient heat dissipation, maintaining optimal performance even under high-power conditions.

  • 3. High-Capacity Connectivity

  • With multiple connectors, you can easily integrate this board into complex systems, enhancing connectivity and system expandability.

  • 4. Robust Performance Parameters

  • With large integrated circuits and power components, you can rely on high-capacity processing and stable power supply, ideal for demanding telecommunications tasks.

  • 5. Modular Design for Flexible Integration

  • With precise mounting points and labeling, you can ensure seamless integration and maintenance within network systems, supporting structural stability and efficient operations.

Product details

HUAWEI EX2 TN82EX2 TN8D000EX2 EX4 for Huawei PTN 1900 PTN1900 PTN 3900 PTN3900

The HUAWEI EX2 TN82EX2 TN8D000EX2 EX4 is designed for high-performance telecommunications applications, specifically for Huawei PTN 1900 and PTN 3900 systems. This circuit board is engineered with advanced components to ensure reliable and efficient operation in demanding networking environments.

Technical specifications

FeatureSpecificationBenefit
MaterialGreen FR4Excellent electrical properties and mechanical strength
Integrated Circuits (ICs)Large ICs for processingHigh-speed data handling and control functions
Resistors & CapacitorsSignal conditioning & power managementStable and efficient power distribution
ConnectorsMultiple interface pointsEnhanced connectivity with other systems
HeatsinksLarge heatsinksEfficient heat dissipation for prolonged operation
Power SuppliesCapacitors and transformersStable power supply for consistent performance

Customization guide

Adjustable mounting points allow for easy installation into various chassis or racks to meet specific structural and connectivity needs.

Get inspired

With the HUAWEI EX2 TN82EX2 TN8D000EX2 EX4, you can achieve unparalleled performance in high-capacity telecommunications systems, ensuring robust connectivity and reliable data processing.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing PowerStandard ICs+15% Enhanced Performance+30% Superior Processing*
Heat DissipationBasic HeatsinksImproved CoolingPremium Heat Management*
ConnectivityStandard ConnectorsEnhanced Interface OptionsMaximum Connectivity*

Supplier's note

The Pro Model's heat dissipation feature, with heat management triple the industry standard, enables safe and efficient handling in high-power scenarios. When paired with its superior processing power, this creates an optimal solution for demanding telecommunications applications. Choose the Advanced Model for enhanced performance, suitable for medium-scale operations seeking improved data throughput and connectivity.

Frequently asked questions

  • Which HUAWEI EX2 model is best for large telecommunications systems?

  • How do I maintain the HUAWEI EX2 circuit board for optimal performance?

  • What are the advantages of FR4 material in the HUAWEI EX2 circuit board?

  • Can I customize the HUAWEI EX2 board for specific telecommunications requirements?

  • Is the HUAWEI EX2 circuit board compliant with industry standards for telecommunications equipment?

  • How does the HUAWEI EX2 handle heat generation in high-capacity telecom systems?

  • What connectivity options does the HUAWEI EX2 offer for telecommunications systems?

  • Are there specific mounting requirements for the HUAWEI EX2 in telecom equipment racks?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
High-Capacity NetworkingData Centers, TelecommunicationsLarge PCB with FR4 material, multiple ICs, and heatsinksHigh performance, robust heat dissipationRequires significant cooling infrastructure
Low-Capacity NetworkingSmall Office NetworksCompact PCB with fewer componentsCost-effective, lower power consumptionLimited scalability
Advanced TelecommunicationsBackbone Network InfrastructureHigh-density connectors, complex ICsSupports high-speed data transfer, modular designHigh initial cost
Entry-Level TelecommunicationsSmall Business ApplicationsBasic connectors and minimal componentsEasy to maintain, affordableLimited data transfer speed
Ruggedized EquipmentOutdoor or Industrial ApplicationsPCB with enhanced durability (IP65 certified)Withstands harsh environmentsHigher manufacturing cost
Energy-Efficient SystemsGreen Data CentersLow power ICs and efficient heat dissipation (Energy Star Certified)Reduced operational costsMay sacrifice peak performance

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