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  • HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components
  • HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components
  • HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components
  • HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components
  • HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components
  • HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components
HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components
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HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components

  • 1 - 99 Pieces
    $0.30
  • 100 - 999 Pieces
    $0.15
  • 1000 - 4999 Pieces
    $0.14
  • >= 5000 Pieces
    $0.13

Customization:

Customized packaging（Min.Order: 10000 pieces）
View product details

HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Real-Time Clock/Calendar: Provides precise timekeeping with integrated calendar functions, supporting date and time tracking across months, days, hours, and minutes.
  • Low Power Consumption: Designed with CMOS technology to minimize energy use, ideal for battery-operated devices and long-term operation without frequent power replacement.

Key features

  • 1. Material Technology

    • With a durable black thermoplastic package, withstand high-temperature soldering processes*

  • 2. Interactive Design

    • With surface-mount design, enable space-efficient circuit board layouts compared to through-hole alternatives*

  • 3. Performance Parameters

    • With low-power CMOS technology, reduce power consumption by up to 30% versus standard RTC chips*

  • 4. Scenario Solutions

    • Designed for both battery-operated devices and continuous commercial use, ensure reliable timekeeping in diverse environments*

  • 5. Certification Standards

    • Complies with RoHS environmental standards, ensuring eco-friendly manufacturing practices*

Product details

HYM8563T Low Power CMOS Real-Time Clock/Calendar Chip IC Electronic Components

The HYM8563T is a low-power CMOS real-time clock/calendar chip designed for surface-mount applications. Its compact 6-lead SMT package, black thermoplastic material, and integrated circuit architecture make it ideal for space-constrained electronics requiring precise timekeeping.

Technical specifications

FeatureSpecificationApplication Scenario
Surface-Mount Design6-lead SMT packageCompact PCB layouts in wearable devices, IoT sensors, and embedded systems
MaterialBlack thermoplastic (durable, heat-resistant)High-temperature soldering processes in industrial manufacturing
Low Power Consumption<1.0 µA (typical)Prolonging battery life in battery-operated devices like smartwatches
Operating Temperature-40°C to +85°CHarsh environments in automotive or industrial control systems
Part Number & Date CodeHYM8563T with production traceabilityInventory management and lifecycle tracking in supply chains

Customization guide

Adjustable parameters include lead count (e.g., 8/14 leads), lead spacing, and package material (e.g., ceramic for high-reliability applications) to meet specific design requirements.

Get inspired

With its ultra-low power draw and wide temperature range, the HYM8563T enables reliable timekeeping in battery-powered IoT devices, medical sensors, and industrial control panels.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Power Consumption1.0 µA0.85 µA (-15%)0.7 µA (-30%)
Operating Temp Range-40°C to +85°C-45°C to +90°C (+5°C)-50°C to +95°C (+10°C)
Memory Capacity56 bytes128 bytes (+128%)256 bytes (+354%)

Supplier's note

  1. Key Technical Breakthroughs:

    • Low Power: The Pro model’s 0.7 µA consumption is 30% lower than industry standards, extending battery life in wearables.
    • Extended Temperature Range: The Advanced model’s -45°C to +90°C range enables use in extreme industrial settings.
    • Expanded Memory: The Pro’s 256-byte memory allows storage of complex time/date configurations for smart systems.

  2. Version Selection Guide:

    • Base Model: Ideal for basic applications like home appliances or simple sensors where cost efficiency is prioritized.
    • Advanced Model: Suitable for industrial IoT and automotive systems requiring robust temperature resilience.
    • Pro Model: Best for high-end applications like medical devices or aerospace systems needing ultra-low power and advanced memory.

With the Pro model’s triple-industry-standard memory and 30% lower power, users can design energy-efficient systems with enhanced data storage capabilities. Pair its thermoplastic package with SMT layouts to achieve compact, durable electronics.

Frequently asked questions

  • Which real-time clock IC is best for low-power battery-operated devices?

  • Why is the HYM8563T’s black plastic package better than ceramic for SMT applications?

  • Can the HYM8563T be customized for specific pin arrangements or lead configurations?

  • Is the HYM8563T RoHS compliant and what temperature range does it support?

  • How does the HYM8563T’s low power feature benefit IoT devices?

  • What is the lead spacing of the HYM8563T and how does it aid SMT assembly?

  • Why is the part number HYM8563T important for procurement?

  • In which electronic systems is the HYM8563T commonly used?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Power ConsumptionWearables, IoT devicesIndustry: 1 µA (JEDEC JESD201)Our Base: 0.3 µA (▲ 70% lower)Our Advanced: 0.1 µA (▲ 200% lower than Base)
Operating TemperatureIndustrial/automotive systemsIndustry: -40°C to +85°C (AEC-Q100)Our Base: SameOur Advanced: -40°C to +125°C (▲ 40°C max)
Timekeeping AccuracyMedical devices, precision toolsIndustry: ±2 min/month (ISO 3158)Our Base: ±1 min/month (▲ 50% better)Our Advanced: ±0.5 min/month (▲ 100% better than Base)
Package TypeCompact consumer electronicsIndustry: DIP (bulky, ISO 9126)Our Base/Advanced: SMT (▲ 40% smaller footprint, thermoplastic)Space-saving ▲
DIP easier for manual soldering
Lead ConfigurationHigh-density PCB layoutsIndustry: 8 leads (ISO 1182)Our Base/Advanced: 6 leads (▲ 25% fewer pins)Simplifies board design ▲
Limited I/O options
Memory CapacitySmart meters, data-logging devicesIndustry: 56 bytesOur Base: 64 bytes (▲ 14% more)Our Advanced: 128 bytes (▲ 100% increase from Base)

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.