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  • Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M
  • Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M
  • Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M
  • Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M
  • Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M
  • Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M
Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M

Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M

  • >= 1 Pieces
    $1.30

Customization:

Customized logo（Min.Order: 999999999 pieces）
Customized packaging（Min.Order: 999999999 pieces）
Graphic customization（Min.Order: 999999999 pieces）
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Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit Design: Designed to serve high-speed or high-power applications, these ICs are ideal for tasks involving signal processing, power management, or data transmission.
  • Surface-Mount Packaging: The compact surface-mount package allows for efficient integration into printed circuit boards (PCBs), enhancing the performance of electronic devices.

Key features

  • 1. Advanced Material Technology

    • With a robust silicon semiconductor die and metal alloy pins, these ICs ensure durability and reliability in high-performance applications.

  • 2. Interactive Design

    • With a surface-mount package, you can achieve efficient integration into your PCB designs, optimizing space and performance in your electronic devices.

  • 3. Superior Performance Parameters

    • With an integrated heat sink, these components excel in high-power applications, managing significant heat generation and maintaining optimal performance.

  • 4. Versatile Scenario Solutions

    • With customizable functionality, these ICs can be tailored for a range of tasks from signal processing to data transmission, providing flexible solutions for various electronic systems.

  • 5. Compliance with Certification Standards

    • With EPR certification in Germany, these components meet stringent environmental and safety standards, ensuring high-quality and eco-friendly integration into your products.

Product details

Hainayu BOM quotation electronic component integrated IC chip sensor transmitter HSOP36 CXD9883 CXD9883M

The Hainayu BOM quotation electronic component, specifically the integrated IC chip sensor transmitter model HSOP36 CXD9883 CXD9883M, is designed for high-speed and high-power applications. With its robust surface-mount package, this IC chip ensures efficient heat dissipation and seamless integration into various electronic devices, making it ideal for engineers seeking fast delivery and original, brand-new components.

Technical specifications

FeatureSpecificationBenefit
Package TypeSurface-Mount (HSOP36)Compact integration in PCBs
MaterialSilicon, Metal Alloy, PlasticHigh durability and thermal management
CertificationEPR_Germany_PackingCompliance with international standards
Design StyleHigh-Speed/Power CapabilitySuitable for demanding electronic systems

Customization guide

With adjustable IC type and package options, you can tailor functionality and performance to meet specific signal processing, power management, or data transmission needs.

Get inspired

Imagine redefining your electronic systems with our integrated IC chip, perfect for high-performance applications. With its efficient design, realize the potential of your next project with seamless integration and outstanding reliability.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Heat DissipationStandard+15%+30%*
Integration EaseBasicEnhancedPremium

Supplier's note

The Pro version's heat dissipation capability is triple the industry standard, enabling safe handling of high-power applications. When paired with its surface-mount design, this creates unparalleled integration efficiency for cutting-edge electronic systems. Choose the Pro Model for top-tier performance and reliability in demanding environments.

Frequently asked questions

  • Which model of the HSOP36 CXD9883 IC chip is best for high-power applications?

  • How do I maintain the HSOP36 CXD9883 IC chip for optimal performance?

  • What are the advantages of using the HSOP36 CXD9883 over other ICs?

  • Can the HSOP36 CXD9883 IC chip be customized for specific applications?

  • Is the HSOP36 CXD9883 IC chip certified for use in electronic devices in Germany?

  • What materials are used in the HSOP36 CXD9883 IC chip, and how do they compare to other ICs?

  • How quickly can I receive the HSOP36 CXD9883 IC chip after placing an order?

  • Are there independent brand agents and distributors available for the HSOP36 CXD9883 IC chip?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Specialized ICsHigh-speed applicationsSurface-mount design (compact)Efficient heat dissipationRequires precise mounting
Semiconductor ModulesPower management systemsIntegrated heat sink (enhanced cooling)High power handling capacityHigher cost due to added features
Signal ProcessorsData transmission devicesHigh-frequency operation (GHz range)Faster data processingIncreased power consumption
Power TransistorsHigh-power circuitsMetal alloy pins (durable connection)Robust and reliableLarger physical footprint
Custom IC SolutionsTailored electronicsFunctional customization (flexible)Versatile for specific tasksLonger development time
Surface-Mount DevicesConsumer electronicsCompact packaging (space-saving)Easy integration into PCBsDifficult to repair if damaged

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