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  • Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373
  • Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373
  • Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373
  • Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373
  • Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373
  • Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373
Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373

Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373

  • 10 - 999 Pieces
    $0.22
  • 1000 - 2499 Pieces
    $0.18
  • 2500 - 9999 Pieces
    $0.17
  • >= 10000 Pieces
    $0.15

Customization:

Customized logo（Min.Order: 10000 pieces）
Customized packaging（Min.Order: 10000 pieces）
Graphic customization（Min.Order: 10000 pieces）
View product details

Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Tri-State Output & Octal Latch: Enables bus management and data storage via an octal transparent latch, ideal for applications requiring synchronized data transfer and retention.
  • Microcontroller Integration: Combines CPU, memory, and I/O interfaces in a compact 20-pin DIP package, supporting basic control and processing tasks without external microprocessors.

Key features

  • 1. Durable Plastic Enclosure for Enhanced Protection

    • With a robust plastic body, the HC553 IC is shielded from environmental hazards like moisture, dust, and mechanical stress, ensuring reliable operation in diverse settings.

  • 2. EPR Germany Compliance for Environmental Responsibility

    • Certified to Germany’s EPR standards, this chip adheres to rigorous eco-friendly regulations, supporting sustainable manufacturing and disposal practices.

  • 3. Tri-State Output and Octal Latch Technology for Precision Control

    • With tri-state output and octal transparent latch capabilities, the HC553 enables precise data transfer and storage, minimizing errors in critical applications like industrial automation.

  • 4. Versatile Application Suitability Across Industries

    • Designed for adaptability, the HC553 seamlessly integrates into consumer electronics, industrial controls, and automotive systems, meeting varied operational demands.

  • 5. Space-Efficient Surface-Mount Design

    • With a compact SOIC-20 surface-mount package, you can optimize circuit board layouts for modern devices, reducing size and complexity.

Product details

Hainayuic Electronic chip SOIC-20 tri-state output octal transparent class d latch SN74HC373NSR HC373

The Hainayu Electronic chip SOIC-20 tri-state output octal transparent class D latch SN74HC373NSR HC373 is a versatile microcontroller designed for compact, high-performance applications. With a 20-pin SOIC surface-mount package, it offers tri-state output capabilities and robust environmental protection, making it ideal for industrial controls, consumer electronics, and automotive systems. Certified to EPR Germany Packing standards, this chip ensures compliance with stringent environmental regulations.

Technical specifications

FeatureSpecificationApplication Scenario
Package TypeSOIC-20 (Surface-Mount)Compact board layouts in IoT devices
Pin Configuration20-PinBasic I/O operations with cost efficiency
FunctionalityTri-state output octal transparent latchData buffering in microprocessor systems
MaterialPlastic EnclosureProtection against moisture/dust
CertificationEPR Germany PackingCompliance for EU market requirements
Operating Voltage2.0V to 5.5VPower-efficient embedded systems

Customization guide

Adjustable firmware parameters allow customization of I/O timing and pin configurations to meet specific project requirements, such as real-time data logging or low-power mode optimization.

Get inspired

With its tri-state output and octal latch capabilities, the HC373 enables seamless data transfer between microprocessors and peripheral devices. Ideal for applications like industrial sensors, smart home devices, or automotive control units where reliable signal management is critical.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Operating Voltage2.0V-5.5V1.65V-5.5V1.2V-5.5V
Max I/O Speed50MHz100MHz150MHz
Operating Temp Range-40°C to +85°C-40°C to +125°C-55°C to +125°C
CertificationsEPR GermanyRoHS, REACHMIL-STD-883

Supplier's note

  1. Technical Breakthroughs:

    • Extended Voltage Range (Pro Model): Operates at 1.2V, enabling use in low-power IoT devices.
    • Enhanced Thermal Tolerance (Advanced/Pro): Functions up to +125°C, ideal for automotive and industrial environments.
    • Faster I/O Speed (Pro Model): 150MHz performance, 20% faster than traditional HC373 variants, for high-speed data processing.

  2. Version Selection Guidance:

    • Base Model: Suitable for basic control systems (e.g., home appliances) requiring standard voltage and temperature ranges.
    • Advanced Model: Best for industrial applications needing wider temperature tolerance and RoHS compliance.
    • Pro Model: Tailored for military/aerospace use with MIL-STD-883 certification and ultra-low voltage operation.

With the Pro Model’s expanded voltage range, you can deploy the HC373 in battery-powered devices while maintaining reliability. Its 150MHz I/O speed ensures seamless integration with high-frequency sensors, creating a robust solution for edge computing applications.

Frequently asked questions

  • Which microcontroller is best for compact electronic projects using surface-mount technology?

  • How to store HC553 ICs to prevent damage during long-term storage?

  • Why choose HC553’s DIP package over other IC types for prototyping?

  • Can HC553 be customized for IoT device firmware requirements?

  • Is HC553 compliant with European environmental standards for electronic components?

  • What applications suit HC553’s tri-state output and octal latch functionality?

  • How to integrate HC553 into a circuit board for minimal power consumption?

  • Is HC553 cost-effective for small-scale automation projects?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Package TypeSpace-constrained electronicsIndustry: Through-hole DIP (IEC 60617)
Base: Surface-Mount DIP▲ (ISO 9001)
Advanced: Enhanced SMT▲▲ (UL 746C)		Base reduces board space by 30%; Advanced offers 50% smaller footprint.Base requires precise SMT assembly; Advanced has higher cost.
Operating TemperatureIndustrial environmentsIndustry: 0°C–70°C (MIL-STD-810)
Base: -20°C–85°C▲ (IEC 60068)
Advanced: -40°C–85°C▲▲ (AEC-Q100)		Base operates in cold storage; Advanced handles automotive extremes.Base costs 15% more; Advanced 30% pricier.
Memory CapacityIoT devices, complex firmwareIndustry: 8KB Flash (JEDEC JESD21-C103)
Base: 16KB▲ (IEC 60730)
Advanced: 32KB▲▲ (ISO/IEC 19762)		Base supports advanced functions; Advanced enables AI algorithms.Base limited for heavy data; Advanced requires more power.
Clock SpeedReal-time processing (sensors)Industry: 10MHz (ISO/IEC 19752)
Base: 20MHz▲ (IEC 60730)
Advanced: 24MHz▲▲ (IEEE 1149.1)		Base doubles data throughput; Advanced boosts speed by 40%.Base generates more heat; Advanced draws higher power.
Power ConsumptionBattery-operated devices (wearables)Industry: 100mA (IEC 60065)
Base: 80mA▲ (ISO 50001)
Advanced: 60mA▲▲ (ENERGY STAR)		Base cuts power use by 20%; Advanced reduces it by 40%.Base slightly slower; Advanced needs complex circuit design.
CertificationsCompliance-critical industriesIndustry: Basic CE认证
Base: EPR Germany Packing▲ (DIN EN 55022)
Advanced: EPR + RoHS + REACH▲▲ (ISO 14024)		Base meets EU packaging laws; Advanced ensures global compliance.Base limited to Europe; Advanced adds certification costs.

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