All categories
Featured selections
Trade Assurance
Buyer Central
Help Center
Get the app
Become a supplier
Alibaba
Electronic Components, Accessories & Telecommunications
Integrated Circuits
Specialized ICs
  • Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G
  • Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G
  • Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G
  • Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G
  • Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G
  • Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G
Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G

Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G

  • >= 1 Pieces
    $0.01

Customization:

Customized logo（Min.Order: 999999999 pieces）
Customized packaging（Min.Order: 999999999 pieces）
Graphic customization（Min.Order: 999999999 pieces）
View product details

Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Integrated Circuit Design: The Hainayu IC features a quad flat package (QFP) design with a grid array of solder balls, facilitating high-density packaging and efficient heat dissipation for electronic devices.
  • Processing and Storage: Suitable for applications requiring compact size and high performance, such as smartphones, laptops, and other portable devices.

Key features

  • 1. Material Technology

    • With a corrosion-resistant metal body, the QFP component ensures durability and longevity, even in high-demand electronic applications.

  • 2. Interactive Design

    • With its grid array of solder balls, the QFP component allows for high-density packaging, optimizing space in compact electronic devices.

  • 3. Performance Parameters

    • With efficient heat dissipation capabilities, the QFP component maintains optimal performance and extends the lifespan of electronic devices.

  • 4. Scenario Solutions

    • With surface mount technology (SMT), the QFP component simplifies assembly and is ideal for densely packed systems like smartphones and laptops.

  • 5. Certification Standards

    • With EPR_Germany_Packing certification, the QFP component complies with eco-friendly standards, ensuring sustainable electronic manufacturing.

Product details

Hainayu IC electronic component integrated circuit in stock BOM list BGA256 10M50DAF256I6G

The Hainayu IC electronic component, specifically the 10M50DAF256I6G, is a high-performance integrated circuit available for immediate stock and fast delivery. This component is ideal for various electronic devices requiring reliable processing and storage solutions.

Technical specifications

FeatureSpecificationBenefit
Packaging TypeBGA256High-density packaging for compact devices
CertificationEPR_Germany_PackingCompliance with European environmental standards
ApplicationIntegrated CircuitVersatile use in processing and storage functions

Customization guide

With customizable features like ball pitch, ball size, and package size, you can tailor the QFP component to meet specific design and thermal management needs.

Get inspired

Unlock new possibilities in device design with the versatile and efficient Hainayu IC components, ideal for high-density electronic packaging.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Processing SpeedBaseline Value+15%+30%*
Thermal ManagementBase SpecEnhancedPremium

Supplier's note

  1. The Pro version's high-density packaging capability – exceeding industry norms by 30% – allows for more connections in compact spaces, enhancing device performance. With its advanced thermal management, this model ensures longevity and reliability in demanding applications.
  2. For developers focused on compact device design, the Pro model offers unparalleled benefits with its superior processing speed and thermal management, making it the optimal choice for high-performance needs.

Frequently asked questions

  • Which specialized IC model suits compact electronic devices best?

  • How do I maintain and care for my integrated circuit to ensure longevity?

  • What are the differences between BGA and QFP packaging for integrated circuits?

  • Can I customize the packaging of my integrated circuit for specific device requirements?

  • Is the Hainayu IC electronic component FDA-approved for medical device applications?

  • Which integrated circuit is best for high-performance computing devices?

  • How quickly can I receive my order of Hainayu integrated circuits?

  • Can I get support from independent brand agents and distributors for Hainayu products?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Integrated Circuits (ICs)Consumer Electronics, LaptopsHigh-Density Packaging (compact design)Efficient Heat Dissipation (enhanced cooling)Requires precise assembly (specialized equipment)
Specialized ICsSmartphones, Portable DevicesSurface Mount Technology (SMT compatible)Space-saving (reduced PCB footprint)Limited repairability (hard to replace)
Quad Flat Package (QFP)High-Performance SystemsGrid Array Solder Balls (dense connections)Customizable Ball Pitch (tailored connections)Complex design (increased design time)
MicrocontrollersEmbedded Systems, AutomationCompact Size (small form factor)Versatile Applications (wide functionality)Power limitations (lower power handling)
Memory ChipsData Storage, Computing DevicesHigh Capacity Storage (large data volume)Fast Data Access (quick read/write)Higher cost (more expensive than alternatives)
Electrolytic CapacitorsPower Supply, Signal ProcessingHigh Capacitance (large charge storage)Energy Efficiency (low power loss)Limited lifespan (wear out over time)

Related searches

souvenir magnet wood owl magnets customlowara vertical multistage pumplowara vertical multistage50ml conical centrifuge tubestainless steel door lockHiphop Pendant Necklacedigital automaticultrasonic cleanercleanerturbocharger test bench turbocharger testing machinekamazkamaz leaf springkamaz parts12 inch gif digital photo framedigitalcentrifugal nozzle spray dryer3D acrylic lamppet vinyl toyh200bdc uclez0009qszz uclez0009qsz1 uclez0009qsz2 6la58717500 ctme0039qszzgold solid state relayt ssr 10dalockable push lock access panel

The Product Description is generated by third-party, and Alibaba.com is not liable for any risks related to inaccuracies or the infringement of third-party rights.

The information in this Product Description may differ from the details on the product listing page on Alibaba.com. Additionally, the contents may not be updated in real-time with the product listing page on Alibaba.com, and there may be delays in reflecting the most updated information. The description on product listing page takes precedence. You shall not rely on this Product Description in making transaction decisions.

The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.