Hainayu SE742 Automobile Engine Computer Board Ignition Drive Chip Electronic Component Chip IC with Single Delivery Fast

Technical specifications

Customization guide

Adjustable parameters include pin density (up to 150 pins) for expanded connectivity and material thickness (0.8mm to 1.6mm) to meet thermal or mechanical stress requirements. Custom heat-sink designs can also be integrated for specialized cooling needs.

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With its robust FR-4 construction and high-pin density, the SE742 enables seamless integration into advanced engine management systems. Whether you need reliable ignition control for high-performance vehicles or compliance-ready components for European markets, this chip delivers precision and durability.

Choose your model

Supplier's note

1. Technical Breakthroughs:

   • Enhanced Thermal Resistance: The Pro Model’s +30% heat dissipation capability enables stable operation in high-temperature engine bays.
   • High-Density Pin Layout: The Advanced Model’s 120-pin grid supports complex engine control modules requiring rapid data exchange.
   • EPR Compliance: All models meet France and Germany’s packaging regulations, reducing environmental impact and simplifying market entry.

2. Version Selection Guide:

   • Base Model: Ideal for standard automotive systems where cost efficiency is prioritized.
   • Advanced Model: Suitable for mid-tier applications needing enhanced thermal performance and mid-range connectivity (e.g., hybrid vehicles).
   • Pro Model: Best for high-performance engines or industrial machinery requiring extreme thermal stability and ultra-fast data transfer.

With the Pro Model’s triple-certification and 20% faster data transfer than traditional ICs, it ensures seamless integration into next-gen electric vehicle systems. The central metallic layer paired with advanced thermal specs creates a durable solution for harsh automotive environments.