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Multilayer PCB
  • High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB
  • High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB
  • High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB
  • High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB
  • High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB
  • High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB
High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB

High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB

  • 100 - 999 Pieces
    $2.59
  • >= 1000 Pieces
    $1.67

Customization:

Customized logo（Min.Order: 1 pieces）
Customized packaging（Min.Order: 1 pieces）
Graphic customization（Min.Order: 1 pieces）
View product details

High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • High-Frequency Signal Transmission: Optimized for high-speed data and RF applications, ensuring minimal signal loss in complex electronic systems.
  • HDI Multilayer Design: Enables dense circuit layouts with up to 16 layers, ideal for compact and high-performance devices.
  • Heavy Copper Traces: Supports high-current applications with enhanced thermal dissipation and durability.

Key features

  • 1. Material Technology

    • With heavy copper traces and FR-4 substrate, you can achieve superior heat dissipation and durability, ensuring stable performance in high-current applications. ~30% better thermal conductivity than standard copper PCBs*

  • 2. Performance Parameters

    • With HDI (High Density Interconnect) technology, you can support high-frequency signal transmission with minimal loss, ideal for advanced electronic devices. Up to 40% higher signal integrity compared to traditional multilayer PCBs*

  • 3. Scenario Solutions

    • Designed for Power over Ethernet (PoE) applications, you can seamlessly integrate power and data transmission in networking equipment, enabling efficient IoT and smart device deployments.

  • 4. Certification Standards

    • With REACH certification, you can ensure compliance with EU environmental and safety regulations, reducing supply chain risks for global markets.

  • 5. Interactive Design

    • With a modular component layout, you can easily customize circuit configurations for specific applications, offering flexibility in design and scalability for mass production. ~20% faster prototyping compared to non-modular PCB designs*

Product details

High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB

The High Frequency FR4 PCB HDI Multilayer PCB Heavy Copper PCB combines advanced materials and modular design to deliver high-performance solutions for demanding electronic applications. Certified to REACH standards, it features heavy copper traces for thermal stability and HDI technology for compact, high-density circuitry. Ideal for Power over Ethernet (PoE) systems and industrial electronics, this PCB ensures reliable performance in high-current and high-frequency environments.

Technical specifications

FeatureSpecificationApplication Scenario
Material CompositionFR-4 substrate with 2-6 oz heavy copper tracesHigh-current applications (e.g., power supplies, inverters)
HDI Technology8–16 layers with microvia stackingCompact devices requiring dense circuit routing (e.g., smartphones, IoT sensors)
CertificationREACH compliantEU-market electronics needing environmental safety compliance
PoE CompatibilityIEEE 802.3af/at compliantNetworking devices requiring power/data over Ethernet (e.g., IP cameras, smart switches)

Customization guide

Adjustable parameters include:

  • Copper Thickness: Tailor from 2–6 oz to match current load requirements.
  • Layer Count: Modify HDI layer configuration (8–16 layers) for varying circuit density needs.
  • Component Layout: Optimize grid spacing and module placement for custom form factors.

Get inspired

With HDI technology and heavy copper, this PCB enables sleek, high-performance devices while maintaining thermal resilience. Its PoE compatibility simplifies deployment in smart infrastructure, reducing the need for separate power wiring.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Layer Count8 layers12 layers16 layers
Copper Thickness2 oz4 oz6 oz
Max Current Handling30A50A (+67%)80A (+167%)*
Thermal DissipationStandardEnhanced (+20%)Premium (+40%)

Supplier's note

  1. Technical Breakthroughs:

    • HDI Technology: Enables 40% denser circuit routing than traditional PCBs, ideal for miniaturized devices.
    • Heavy Copper: Delivers 3x higher current capacity than standard 1-oz copper PCBs, reducing overheating risks.
    • PoE Compliance: IEEE 802.3at certification supports power delivery up to 30W, expanding IoT device applications.

  2. Version Selection Guidance:

    • Base Model: Best for standard electronics (e.g., consumer gadgets) requiring cost-effective HDI solutions.
    • Advanced Model: Optimal for mid-range industrial systems needing enhanced thermal performance (e.g., industrial sensors).
    • Pro Model: Tailored for high-power applications (e.g., server backplanes, EV charging stations) demanding extreme durability and scalability.

Example Use Case: The Pro Model’s 6 oz copper and 16-layer HDI configuration allow it to handle 80A currents—50% higher than industry benchmarks—making it ideal for heavy-duty robotics and renewable energy systems.

Frequently asked questions

  • Which High Frequency FR4 PCB model suits high-speed data applications?

  • How to clean SMD components on a Multilayer PCB without damage?

  • FR4 vs Rogers material: Which is better for industrial PCBs?

  • Can the Heavy Copper PCB be customized for specific component layouts?

  • Is the Multilayer PCB REACH-compliant for EU electronics?

  • Is this PCB suitable for Power over Ethernet (PoE) systems?

  • Why choose Heavy Copper PCB over standard copper for industrial use?

  • What are the benefits of HDI technology in Multilayer PCBs?

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