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  • High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink
  • High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink
  • High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink
  • High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink
  • High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink
  • High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink
High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink

High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink

  • 100 - 499 Pieces
    $17.56
  • 500 - 999 Pieces
    $15.47
  • >= 1000 Pieces
    $13.55
View product details

High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink

Product overview

Core functionalities

Applicable scenarios

Unique advantages

  • Heat Dissipation: The heatsink is designed to efficiently dissipate heat away from high-power laser devices, ensuring optimal performance and longevity.
  • Thermal Management: Utilizes advanced heat pipe soldering technology to manage thermal output in electronic components.

Key features

  • 1. Advanced Material Technology

    • With a combination of aluminum and copper, this heatsink ensures superior thermal conductivity and efficient heat dissipation, ideal for high-temperature applications.

  • 2. Innovative Interactive Design

    • With a modular design featuring customizable fins and copper pipes, you can tailor the heatsink to meet specific cooling requirements for various electronic devices.

  • 3. Optimal Performance Parameters

    • With U-shaped copper heat pipes, achieve enhanced heat transfer efficiency, allowing ~20% faster cooling than traditional models* [*Disclaimer: Based on internal testing; actual results may vary].

  • 4. Versatile Scenario Solutions

    • With its adaptable structure, this heatsink can be customized for different electronic devices, providing reliable cooling solutions for both home and commercial applications.

  • 5. Reliable Certification Standards

    • With its high-grade materials and precise manufacturing, this heatsink meets industry standards for durability and performance, ensuring long-lasting reliability in challenging conditions.

Product details

High Power Laser Device Heat Pipe Soldering Zipper Fin Latest Technology Heat Sink

The High Power Laser Device Heat Pipe Soldering Zipper Fin Heat Sink represents the latest in heat dissipation technology. Constructed from high-grade aluminum and copper, this heat sink is engineered for optimal thermal conductivity and efficiency. Its design features a rectangular base with multiple fins and U-shaped copper pipes to enhance heat transfer capabilities.

Technical specifications

FeatureSpecificationBenefit
MaterialAluminum, CopperExcellent thermal conductivity
DesignRectangular, Zipper FinIncreased surface area for heat dissipation
MountingMetal bracket, 4 holesSecure and stable attachment
CustomizationAdjustable fins, pipesTailor cooling solutions to specific needs
Grade6000 seriesHigh strength and corrosion resistance
TemperT3-T8Enhanced durability and flexibility

Customization guide

Adjustable fins and copper pipes allow customization to meet specific cooling requirements for different electronic devices. The modular design ensures adaptability to various heat sources, providing tailored cooling solutions.

Get inspired

With this heat sink, you can achieve superior cooling performance in high-power laser devices, ensuring reliability and efficiency in demanding environments. Its advanced design makes it ideal for electronics requiring robust heat management.

Choose your model

ParameterBase ModelAdvanced ModelPro Model
Thermal ConductivityHigh+15%+30%*
Heat DissipationStandardEnhancedPremium
Customization OptionsBasicMore OptionsFully Customizable

Supplier's note

The Pro Model's thermal conductivity rating, which is 30% higher than industry benchmarks, guarantees exceptional performance in high-temperature scenarios. When combined with its customizable design, this model ensures precise heat management tailored to specific application needs. The Advanced Model, with its enhanced heat dissipation capabilities, is optimal for users seeking improved cooling efficiency without the need for extensive customization. The Base Model offers reliable performance for standard applications, providing a cost-effective solution for general use.

Frequently asked questions

  • Which model of latest technology heat sink is best for high-temperature environments?

  • How do I maintain my high power laser device heat sink to ensure optimal performance?

  • What are the benefits of using copper over aluminum in heat sinks for electronic devices?

  • Can the high power laser device heat sink be customized for specific cooling requirements?

  • Is the high power laser device heat sink suitable for FDA-approved electronic applications?

  • What makes the latest technology heat sink a reliable choice for electronic cooling systems?

  • How does the U-shaped copper pipe design improve the heat sink's efficiency?

  • What are the unique selling points of the high power laser device heat sink for industrial use?

Product comparison

CategoryUsage ScenariosCharacteristicsAdvantagesDisadvantages
Cooling SolutionsHigh-temp electronicsMade of aluminum and copper (high thermal conductivity)Superior heat dissipation (efficient cooling for high-temp devices)Potentially high cost due to materials
Heat PipesCustom electronic coolingU-shaped copper pipes (enhanced heat transfer)Efficient heat transfer (U-shape allows effective dissipation)Requires precise installation
Mounting SystemsSecure attachmentMetal bracket with four mounting holes (stable mounting)Secure attachment (prevents movement during operation)Limited compatibility with non-standard setups
Customizable FinsVersatile coolingAdjustable fins (customizable design)Adaptable to various needs (modular for different devices)Complexity in customization
Noise ReductionQuiet environments43 dBA (quieter than refrigerator hum)Suitable for noise-sensitive areas (quiet operation)May not meet extreme noise reduction needs
Chemical ResistanceIndustrial applicationsWithstands 50+ chemical exposures (ASTM D543)Durable in harsh environments (resistant to chemicals)Potentially increased weight

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The comparison data is based on manufacturer information and industry standards. Actual results may vary depending on individual use cases. It is advisable to verify details with the supplier for the most accurate information.